Carbon nanotube/polyetherimide/thermosetting resin dielectric composite material and preparation method thereof

A polyetherimide, carbon nanotube technology, applied in plastic/resin/wax insulators, circuits, electrical components, etc., can solve the problems of reducing dielectric loss, complex structure design, ineffectiveness, etc., to avoid direct contact , The effect of increasing the dielectric constant and reducing the leakage and conduction loss

Active Publication Date: 2015-04-15
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the double percolation structure can obtain a high dielectric constant and reduce the percolation threshold, but it is not effective for reducing the dielectric loss, which is not expected in practical applications
In addition, the complex structural design has not achieved a significant improvement in the comprehensive dielectric properties of composite materials, and the introduction of more polymers makes the processing process more complicated and difficult to control
[0004] In summary, on the basis of obtaining a high dielectric constant, how to obtain a conductor / polymer dielectric composite material with a high dielectric constant, lower dielectric loss and low percolation threshold through a simple and easy method is still a problem. daunting challenge

Method used

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  • Carbon nanotube/polyetherimide/thermosetting resin dielectric composite material and preparation method thereof
  • Carbon nanotube/polyetherimide/thermosetting resin dielectric composite material and preparation method thereof
  • Carbon nanotube/polyetherimide/thermosetting resin dielectric composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. Preparation of carbon nanotube / polyetherimide composites

[0026] 3.0 g of multi-walled carbon nanotubes and 60 g of polyetherimide were mixed and stirred uniformly, and the mixture was added to the Haake melting chamber, and melted and banburyed for blending (blending conditions were 15 min at 330 °C). After the banburying is completed, the carbon nanotube / polyetherimide composite is obtained by cooling.

[0027] 2. Preparation of carbon nanotube / polyetherimide / bismaleimide resin dielectric composites

[0028] Dissolve 10.5 g of carbon nanotube / polyetherimide composite in 100 mL of dichloromethane to form a homogeneous solution A; add 37 g of 2.2'-diallyl bisphenol A to solution A, stir and heat up to 150 ° C ; Slowly add 50g of N,N'-(4,4'-methylenediphenyl)bismaleimide, keep stirring for 40min to obtain a prepolymer. Pour the prepolymer into the preheated mold, vacuum defoaming at 145°C for 30min, and perform curing and post-treatment at 165°C / 2h+185°C / 2h+220°C / 2...

Embodiment 2

[0040] 1. Preparation of carbon nanotube / polyetherimide composites

[0041] Mix 0.6 g of multi-walled carbon nanotubes and 60 g of polyetherimide, add the mixture into the Haake melt chamber, and melt banbury and blend (the blending condition is 15 min at 330 °C). After the banburying is completed, the carbon nanotube / polyetherimide composite is obtained by cooling.

[0042] 2. Preparation of carbon nanotube / polyetherimide / bismaleimide resin dielectric composites

[0043] Dissolve 10.1 g of carbon nanotube / polyetherimide composite in 75 mL of dichloromethane to form a homogeneous solution A; add 30 g of 2.2'-diallyl bisphenol A to solution A, stir and heat up to 150 ° C ; Slowly add 50g of N,N'-(4,4'-methylenediphenyl)bismaleimide, keep stirring for 40min to obtain a prepolymer. Pour the prepolymer into the preheated mold, vacuum defoaming at 145°C for 30min, and perform curing and post-treatment at 165°C / 2h+185°C / 2h+220°C / 2h+240°C / 4h, that is, A carbon nanotube / polyetherim...

Embodiment 3

[0045] 1. Preparation of carbon nanotube / polyetherimide Haake composites

[0046] 4.2 g of multi-walled carbon nanotubes and 60 g of polyetherimide were mixed and stirred uniformly, and the mixture was added to the Haake melt chamber for melting and banburying (blending conditions were 10 min at 340 °C). After the banburying is completed, the carbon nanotube / polyetherimide composite is obtained by cooling.

[0047] 2. Preparation of carbon nanotube / polyetherimide / bismaleimide resin dielectric composites

[0048] Dissolve 10.0 g of carbon nanotube / polyetherimide composite in 100 mL of dichloromethane to form a homogeneous solution A, add 45 g of 2,2'-diallyl bisphenol A to solution A, stir and heat up to 150°C; slowly add 50g of N,N'-(4,4'-methylenediphenyl)bismaleimide, keep stirring for 40min, pour it into the preheated mold after the prepolymerization, at 145 Vacuum defoaming for 30min at ℃, curing and post-treatment according to 165℃ / 2h+185℃ / 2h+220℃ / 2h+240℃ / 4h to obtain a...

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PUM

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Abstract

The invention discloses a carbon nanotube / polyetherimide / thermosetting resin dielectric composite material and a preparation method thereof. The preparation method comprises the following steps: in parts by weight, uniformly mixing 100 parts of polyetherimide and 1-7 parts of carbon nanotubes in a Haake torque molting cavity to obtain a carbon nanotube / polyetherimide composite; dissolving 20 parts of the carbon nanotube / polyetherimide composite into 100-150 parts of dichloromethane, adding a mixed solution into 100 parts of molten thermocurable thermosetting resin, mixing, preserving heat, stirring until a mixture is in a uniform state, curing, and post-treating to obtain a carbon nanotube / thermosetting resin dielectric composite material, wherein a substrate of the carbon nanotube / thermosetting resin dielectric composite material has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The carbon nanotube / polyetherimide / thermosetting resin dielectric composite material has a relatively low percolation threshold, a high dielectric constant and low dielectric loss. The preparation method is simple in process and suitable for large-scale production.

Description

technical field [0001] The invention relates to a dielectric composite material and a preparation technology thereof, in particular to a carbon nanotube / polyetherimide / thermosetting resin dielectric composite material with a high dielectric constant composed of a resin matrix with a phase inversion structure and its preparation method. Background technique [0002] High dielectric constant polymer matrix composites are important functional materials and have important application value in many fields such as insulation, electromechanical, and biological engineering. Incorporation of conductors into polymers is an important type of preparation of high dielectric constant polymer matrix composites. Carbon nanotubes have attracted extensive attention due to their outstanding electrical properties, large aspect ratios, and good mechanical properties. So far, a variety of carbon nanotube / polymer composites have been prepared. As conductor / polymer composites, carbon nanotube / po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08L79/04C08K7/24B29B7/00
CPCC08K2201/014C08L79/08C08L2205/02C08K7/24C08L79/04C08L63/00B29B7/005B29B7/183B29B7/82C08J3/005C08J3/201C08J3/203C08J3/2056C08J2300/24C08J2479/08H01B3/303H01B3/306H01B3/40H01B3/448C08K3/041B29K2063/00B29K2079/085B29K2307/04B29K2995/0006C08J2335/00C08J2363/02C08J2379/04C08J2479/04C08L35/00C08L2205/03
Inventor 梁国正焦一成顾嫒娟袁莉
Owner SUZHOU UNIV
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