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Bi-component heat conduction silica gel and application thereof

A heat-conducting silicon, two-component technology, applied in the field of two-component heat-conducting silicone gel, can solve the problems of low production efficiency, insufficient elongation, insufficient material toughness, etc., to facilitate foam removal and operation, improve production efficiency, The effect of short curing time

Active Publication Date: 2015-04-15
兆舜科技(广东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The means of improving the thermal conductivity of thermally conductive polymers in the prior art is to increase the content of thermally conductive inorganic powders (such as aluminum oxide) such as alumina. However, simply adding thermally conductive inorganic powders results in insufficient toughness of the material and excessive hardness. Fragile, insufficient elongation (≤80%)
In addition, the thermally conductive polymers in the prior art also have high viscosity, which makes it difficult to remove foam before use, and the production and curing time is relatively long, generally around 24 hours, and the production efficiency is low.

Method used

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  • Bi-component heat conduction silica gel and application thereof
  • Bi-component heat conduction silica gel and application thereof
  • Bi-component heat conduction silica gel and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A two-component thermally conductive silicone gel, which is obtained by mixing and preparing the following raw materials according to the ratio:

[0041] Raw material mass ratio:

[0042] Agent A includes:

[0043] End-side vinyl silicone oil (vinyl content 0.45wt%) 22g

[0044] Alumina (spherical, particle size 15um) 78g

[0045] Platinum catalyst (5000ppm) 0.001g

[0046] Agent B includes:

[0047]

[0048]

[0049] Wherein, the hydrogen-containing silicone resin is prepared by the following method:

[0050] (1) Put 155 parts by mass of water and 0.30 parts by mass of hydrochloric acid into the reactor, add 70 parts by mass of tetramethyldihydrodisiloxane, stir and reflux at a stirring speed of 250 to 300 rpm;

[0051] (2) Open the condensed water to reflux, when the temperature of the reaction solution is raised to 30°C, 720 parts by mass of methyltrimethoxysilane is added dropwise, and the temperature is continued to rise to 50°C.

[0052] (3) When the t...

Embodiment 2

[0055] A two-component thermally conductive silicone gel, which is obtained by mixing and preparing the following raw materials according to the ratio:

[0056] Raw material mass fraction ratio:

[0057] Agent A includes:

[0058] End-side vinyl silicone oil (vinyl content 0.45wt%) 20g

[0059] Alumina (spherical, particle size 15um) 80g

[0060] Platinum catalyst (5000ppm) 0.001g

[0061] Agent B includes:

[0062]

[0063]

[0064] Wherein, the hydrogen-containing silicone resin is prepared by the following method:

[0065] (1) Put 150 parts by mass of water and 0.4 parts by mass of hydrochloric acid into the reactor, add 70 parts by mass of tetramethyldihydrodisiloxane, stir and reflux at a stirring speed of 250 to 300 rpm;

[0066] (2) Open the condensed water to reflux, when the temperature of the reaction solution is raised to 30°C, 700 parts by mass of methyltrimethoxysilane is added dropwise, and the temperature is continued to rise to 50°C.

[0067] (3) Wh...

Embodiment 3

[0070] A two-component thermally conductive silicone gel, which is obtained by mixing and preparing the following raw materials according to the ratio:

[0071] Raw material mass fraction ratio:

[0072] Agent A includes:

[0073] End-side vinyl silicone oil (vinyl content 0.45wt%) 18g

[0074] Alumina (spherical, particle size 15um) 82g

[0075] Platinum catalyst (5000ppm) 0.001g

[0076] Agent B includes:

[0077]

[0078]

[0079] Wherein, the hydrogen-containing silicone resin is prepared by the following method:

[0080] (1) Put 160 parts by mass of water and 0.1 parts by mass of hydrochloric acid into the reactor, add 80 parts by mass of tetramethyldihydrodisiloxane, stir and reflux, and the stirring speed is 250-300 rpm;

[0081] (2) Open the condensed water to reflux, when the temperature of the reaction solution is raised to 30°C, 750 parts by mass of methyltrimethoxysilane is added dropwise, and the temperature is continued to rise to 50°C.

[0082] (3) W...

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Abstract

The invention relates to a bi-component heat conduction silica gel, which is composed of an A agent and a B agent. Specifically, the A agent includes end-side vinyl silicone oil, heat conduction filler and a platinum catalyst; and the B agent includes: 17.5-19.5wt% of the end-side vinyl silicone oil, 53-57wt% of zinc oxide, 23-27wt% of boron nitride, 1.3-1.6wt% of hydrogen-containing silicon resin, and 0.00015-0.00025wt% of a polymerization inhibitor. According to the invention, by introducing the end-side vinyl silicone oil with specific vinyl content and viscosity, and specific hydrogen-containing silicon resin to cooperate with the high heat conduction filler (especially alumina) vegetation, the heat conduction silica gel with heat conduction coefficient up to 3.5w / mk and elongation up to 500% can be obtained. And the heat conduction silica gel has very good toughness.

Description

technical field [0001] The invention relates to a two-component heat-conducting silicone gel and its application. The two-component heat-conducting silicon gel can be used for electronic potting. Background technique [0002] Semiconductors such as computers (CPUs), transistors, and light-emitting diodes (LEDs) generate heat during use, and the performance of electronic components may degrade due to the heat. Therefore, heat sinks are mounted on electronic components that generate heat. However, most of the radiators are made of metal, so that the electronic components and the radiator cannot be well bonded. Therefore, a method of improving adhesiveness by inserting a heat conductive composition formed into a sheet shape has been taken. [0003] The thermal conductivity of traditional thermally conductive silicone gel is generally 2.0w / mk. However, the performance of electronic devices in recent years has been greatly improved, and the heat generation has also increased a...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K3/22C08K3/38C08G77/12C08G77/08
Inventor 陈正旺尹邦志黎忠林
Owner 兆舜科技(广东)有限公司
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