Photocuring pressure-sensitive adhesive tape and preparation method thereof
A pressure-sensitive tape, light-curing technology, applied in the direction of adhesives, adhesive types, film/sheet adhesives, etc., can solve the problems of limited hot-melt adhesive bonding strength, poor chemical resistance, hot-melt pressure sensitivity Problems such as changes in the proportion of glue components and adhesive properties, etc., to achieve the effect of stable bonding performance, fast curing speed, and low curing temperature
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[0012] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0013] The light-curable pressure-sensitive adhesive tape provided by the present invention includes a base material, wherein the light-curable pressure-sensitive adhesive is coated on the base material, and the light-curable pressure-sensitive adhesive comprises the following components: acrylate curing agent, diluent, light Initiators and auxiliaries.
[0014] In the light-curing pressure-sensitive adhesive tape provided by the present invention, the acrylate curing agent is polyacrylic acid ester, epoxy acrylate or polyurethane acrylate, and the diluent is a free radical active diluent or a cationic active diluent. The free radical reactive diluent is 1,6-hexanediol methoxy monoacrylate or ethoxylated neopentyl glycol methoxy monoacrylate; the cationic reactive diluent is a reactive epoxy resin diluent , cyclic ether, cyclic lactone or vinyl ether m...
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