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High-toughness thermal-resistance adhesive for chemical resistant laminate

A high-toughness, physical and chemical board technology, applied in the field of physical and chemical boards, can solve the problems of poor heat resistance and oxidation resistance, warping and deformation of physical and chemical boards, and glue opening, so as to improve the demoulding effect, reduce the cost of products, The effect of overcoming brittleness

Inactive Publication Date: 2015-04-29
ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Phenolic resin has developed rapidly due to its unique performance and wide application. In the preparation process of physical and chemical boards, phenolic resin is often used as an adhesive to produce weather-resistant physical and chemical boards. It has the advantages of uniform stress, high bonding strength, and good water resistance. , due to the tight stacking of rigid aromatic rings connected by methylene in the molecular structure of phenolic resin, the phenolic resin body becomes brittle, and the phenolic hydroxyl and methylene groups on the phenolic resin are easily oxidized, and the heat resistance and oxidation resistance are not good. It is easy to cause warping and deformation of large-scale multi-layer physical and chemical boards or the occurrence of glue-opening defects. How to prepare a physical and chemical board adhesive with low cost, good mechanical properties and heat resistance, excellent bonding performance, and good toughness has become the current technical issues to be resolved

Method used

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  • High-toughness thermal-resistance adhesive for chemical resistant laminate
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  • High-toughness thermal-resistance adhesive for chemical resistant laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of high-toughness heat-resistant adhesive for physical and chemical board proposed by the present invention, its raw material comprises by weight:

[0022]

[0023]

[0024] In the preparation process of the modified phenolic resin, the cashew nut oil is sent to the distiller for vacuum distillation. The vacuum distillation temperature is 220°C, the vacuum distillation pressure is 900Pa, and the preformed phenolic resin with a viscosity of 62mPa·s (25°C) is obtained. Material; Weigh 100 parts of phenol, 25 parts of prefabricated materials, 13 parts of formaldehyde, 0.5 parts of catalyst and 1.3 parts of additives in the reaction bottle, add hydrochloric acid solution to adjust the pH value to 1.5, heat up to 80 ° C, and keep warm for 30 minutes , the temperature was raised to 100°C at a rate of 2°C / min, kept at a temperature of 1.5h, and dehydrated under reduced pressure to obtain a modified phenolic resin.

Embodiment 2

[0026] A kind of high-toughness heat-resistant adhesive for physical and chemical board proposed by the present invention, its raw material comprises by weight:

[0027]

[0028] In the preparation process of the modified phenolic resin, the cashew nut oil is sent to the distiller for vacuum distillation. The vacuum distillation temperature is 220°C, the vacuum distillation pressure is 1150Pa, and the preformed phenolic resin with a viscosity of 56mPa·s (25°C) is obtained. Material; Weigh 100 parts of phenol, 30 parts of prefabricated materials, 5 parts of formaldehyde, 0.9 parts of catalyst and 0.8 parts of additives in the reaction bottle, add hydrochloric acid solution to adjust the pH value to 2, heat up to 70 ° C, and keep warm for 40 minutes , heated up to 100°C at a rate of 1.5°C / min, held for 2 hours, and dehydrated under reduced pressure to obtain a modified phenolic resin.

Embodiment 3

[0030] A kind of high-toughness heat-resistant adhesive for physical and chemical board proposed by the present invention, its raw material comprises by weight:

[0031]

[0032] In the preparation process of the modified phenolic resin, the cashew nut oil is sent to the distiller for vacuum distillation. The vacuum distillation temperature is 220°C, the vacuum distillation pressure is 1100Pa, and the preformed phenolic resin with a viscosity of 58mPa·s (25°C) is obtained. Material; Weigh 100 parts of phenol, 28 parts of prefabricated materials, 10 parts of formaldehyde, 0.7 parts of catalyst and 1.2 parts of additives in the reaction bottle, add hydrochloric acid solution to adjust the pH value to 1.8, heat up to 78 ° C, and keep warm for 36 minutes , the temperature was raised to 100°C at a rate of 1.8°C / min, kept at a temperature of 1.5h, and dehydrated under reduced pressure to obtain a modified phenolic resin.

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Abstract

The invention discloses a high-toughness thermal-resistance adhesive for a chemical resistant laminate. The adhesive is prepared from the following raw materials in parts by weight: 45-55 parts of modified phenolic resin, 1-3 parts of isocyanate resin, 1-1.4 parts of silicon resin methyl branched chain silicone oil, 0.4-1 part of surfactant, 0.2-0.5 part of dipentaerythritol, 1.5-2.3 parts of polyborosiloxane, 8-12 parts of montmorillonite, 1-3 parts of nano-magnesium oxide, 4-8 parts of corn starch and 1.5-3 parts of anti-aging agent TCY. The high-toughness thermal-resistance adhesive has the advantages of low cost, good mechanical performance, good heat resistance, excellent adhering performance and good toughness.

Description

technical field [0001] The invention relates to the technical field of physical and chemical boards, in particular to a high-toughness heat-resistant adhesive for physical and chemical boards. Background technique [0002] Phenolic resin has developed rapidly due to its unique performance and wide application. In the preparation process of physical and chemical boards, phenolic resin is often used as an adhesive to produce weather-resistant physical and chemical boards. It has the advantages of uniform stress, high bonding strength, and good water resistance. , due to the tight stacking of rigid aromatic rings connected by methylene in the molecular structure of phenolic resin, the phenolic resin body becomes brittle, and the phenolic hydroxyl and methylene groups on the phenolic resin are easily oxidized, and the heat resistance and oxidation resistance are not good. It is easy to cause warping and deformation of large-scale multi-layer physical and chemical boards or the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/14C09J183/04C09J183/14C09J103/02C09J11/04C09J11/06C08G8/32
Inventor 徐学武
Owner ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND