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A kind of low melting point copolyamide hot-melt adhesive and preparation method thereof

A technology of copolyamide and hot-melt adhesive, which is applied in the direction of adhesives, etc., and can solve problems such as low degree of polymerization, unsuitability for high-end clothing, and high melting point.

Active Publication Date: 2017-06-06
SHANGHAI RES INST OF CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent selects dibasic acid with 3-8 carbon atoms and diamine with 3-8 carbon atoms. In this patent, it is difficult to control the molar ratio of the functional group carboxyl group and amine group of the reactant to 1:1, so the degree of polymerization is small. , the molecular weight is not large; at the same time, the main chain is all composed of short chains of 3-8 carbon atoms, and there are only long chains at the end nodes, so the washing resistance is not very good
Chinese patents CN88103468A and CN1590433A respectively disclose two kinds of copolyamide hot melt adhesives with high melting point, but the melting point is very high and cannot be used in the apparel industry
Chinese patent CN101705073B proposes a soybean oil-based dimer acid polyamide hot-melt adhesive and its preparation method. The melting point of the obtained hot-melt adhesive is 98-120°C, but the hot-melt adhesive prepared by this method has poor oxidation resistance and is easy to yellow. Change, not suitable for high-end clothing

Method used

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  • A kind of low melting point copolyamide hot-melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Pour 50 parts of caprolactam, 250 parts of nylon 66 salt, 50 parts of nylon 1010 salt, 150 parts of nylon 1012 salt, 5 parts of acetic acid capping agent, and 5 parts of 168 antioxidant, and pour the above materials into a high-pressure reaction kettle with stirring; seal the kettle Replace with nitrogen for 3 times, and then fill with nitrogen to a pressure of 1.00MPa; heat to 240°C, stir, adjust the pressure to 1.8MPa, react for 1h, reduce to normal pressure within 30min, and raise the temperature to 250°C, continue the reaction After 4 hours, cool down to 180°C, stop stirring, let stand for 30 minutes, discharge to water tank, wire drawing, dicing, and drying. The particles were cryogenically crushed with liquid nitrogen, and sieved through 80 mesh to obtain a white powder sample of copolyamide hot melt adhesive. The melting point of the sample and the peel strength applied to the adhesive liner are shown in the appended table, respectively.

Embodiment 2

[0018] Pour 250 parts of caprolactam, 150 parts of nylon 66 salt, 100 parts of nylon 1010 salt, 50 parts of nylon 1012 salt, 10 parts of caprylic acid end-capping agent, 10 parts of 1098 antioxidant, and pour the above materials into a high-pressure reactor with stirring; Replace with nitrogen for 3 times, and then fill with nitrogen to a pressure of 1.00MPa; heat to 240°C, stir, adjust the pressure to 1.8MPa, react for 1h, reduce to normal pressure within 30min, and raise the temperature to 250°C, continue the reaction After 4 hours, cool down to 180°C, stop stirring, let stand for 30 minutes, discharge to water tank, wire drawing, dicing, and drying. The particles were cryogenically crushed with liquid nitrogen, and sieved through 80 mesh to obtain a white powder sample of copolyamide hot melt adhesive. The melting point of the sample and the peel strength applied to the adhesive liner are shown in the appended table, respectively.

Embodiment 3

[0020] Put 100 parts of caprolactam, 150 parts of nylon 66 salt, 100 parts of nylon 1010 salt, 250 parts of nylon 1212 salt, 15 parts of isooctanoic acid capping agent, 1 part of 1010 antioxidant, and pour the above materials into a high-pressure reactor with stirring; Replace the kettle with nitrogen for 3 times, then fill it with nitrogen to a pressure of 1.00MPa; heat to 240°C, stir, and adjust the pressure to 1.8MPa, after 1 hour of reaction, reduce to normal pressure within 30min, and raise the temperature to 250°C, continue React for 4 hours, lower the temperature to 180°C, stop stirring, let stand for 30 minutes, discharge to the water tank, wire drawing, pelletizing, and drying. The particles were cryogenically crushed with liquid nitrogen, and sieved through 80 mesh to obtain a white powder sample of copolyamide hot melt adhesive. The melting point of the sample and the peel strength applied to the adhesive liner are shown in the appended table, respectively.

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Abstract

The invention relates to a low-melting-point copolyamide hot melt adhesive and a preparation method of the low-melting-point copolyamide hot melt adhesive. The hot melt adhesive comprises the components in parts by weight: 50-250 parts of caprolactam, 50-250 parts of nylon 66 salts, 50-250 parts of nylon 1010 salts, 50-250 parts of nylon 1012 salts or nylon 1212 salts, 5-15 parts of end-capping reagents and 1-10 parts of antioxidants. The preparation method comprises the following steps: pouring all components into a high pressure stirring reaction kettle according to the weight process; displacing for 3-5 times by using nitrogen after the kettle is enclosed; charging the nitrogen until the pressure is 1-2 MPa; heating to be 240 DEG C; stirring; regulating the pressure to be 1.2-2.8 MPa; reacting for 1-4 hours; reducing the pressure to be normal pressure in 30 minutes; raising the temperature to be 250-280 DEG C to continuously react for 1-4 hours; reducing the temperature to be 180 DEG C; stopping stirring; keeping standing for 30 minutes; discharging into a water tank; performing drawbench, chopping and drying; and performing freezing pulverization on grains by using liquid nitrogen and sieving by an 80-mesh sieve to obtain copolyamide hot melt adhesive white powder. Compared with the prior art, the low-melting-point copolyamide hot melt adhesive has the advantages of low melting point, washing resistance, solvent resistance, high adhesive property and the like.

Description

technical field [0001] The invention relates to a low-melting-point copolyamide hot-melt adhesive and a preparation method thereof, in particular to a low-melting-point hot-melt adhesive used in the apparel industry and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] In the apparel industry, due to its excellent washing resistance, low temperature flexibility, elasticity, hand feeling, and adhesiveness, polyamide hot melt adhesives are widely used in the comprehensive fusible interlining of clothing (suits), especially in High-end clothing industry. Among them, copolyamide fusible interlining with low melting point (95-130℃) is mainly used for high-end clothing fusible interlining, and its pressing conditions are mild, and it is also suitable for wool, fur, fine cloth and other clothing accessories. [0003] Polyamide hot melt adhesive is solid at room temperature, but it is liquid after reaching its melting point. It...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J177/02C09J177/06C08G69/36D06M17/08
Inventor 谢国庆李晓雷翟金国龚彦王重夕凌钦才郭文欣陈国平
Owner SHANGHAI RES INST OF CHEM IND