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Phenolic resin composition and application thereof

A technology of phenolic resin and boron phenolic resin, applied in the field of phenolic resin composition, can solve the problems of performance decline, low stability, poor thermal stability of phenolic resin, etc., and achieve the effect of slow performance decline and high thermal stability

Inactive Publication Date: 2015-05-20
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Phenolic resin is a commonly used friction material binder, but due to the poor thermal stability of phenolic resin at high temperature, the stability of friction material products made of phenolic resin as binder is low. Significant performance degradation

Method used

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  • Phenolic resin composition and application thereof
  • Phenolic resin composition and application thereof

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preparation example Construction

[0034] In the preparation method of the boron phenolic resin provided by the invention, the phenolic resin and the boron source are mixed. In one embodiment provided by the present invention, the polymerization rate of the phenolic resin is 30-50s / 150°C; in another embodiment provided by the present invention, the polymerization rate of the phenolic resin is 35-40s. In one embodiment provided by the present invention, the fluidity of the phenolic resin is 20-35 mm; in another embodiment provided by the present invention, the fluidity of the phenolic resin is 25-33 mm. In one embodiment provided by the present invention, the weight average molecular weight of the phenolic resin is 1000-20000; in another embodiment provided by the present invention, the weight average molecular weight of the phenolic resin is 2000-3000. In an embodiment provided by the present invention, the phenolic resin contains a certain amount of free phenol. In the embodiment that a phenolic resin provide...

Embodiment 1

[0051] Preparation of phenolic resin composition

[0052] Add 300g of phenol and 4g of oxalic acid into a four-necked flask, raise the temperature to 70-72°C, add 203.7g of formaldehyde solution with a concentration of 38.5wt% dropwise, drop it over 0.5h, slowly raise the temperature to 80°C, and react at a constant temperature at this temperature . After reacting for 3 hours, the reaction product is dehydrated and dephenolized by vacuuming until the free phenol content in the reaction product is 0.5 wt%, to obtain a phenolic resin with a weight average molecular weight of 2000-3000 and a water content of less than 1 wt%.

[0053]Add 12 g of boric acid to 350 g of the above phenolic resin in two batches, stir and mix evenly, and react at a constant temperature of 135-140° C. for 1 hour. After reacting for 1 hour, detect the cone-plate viscosity of the reaction product, and stop the reaction when the cone-plate viscosity of the reaction product is 31P at 150°C. The reaction p...

Embodiment 2

[0065] Preparation of phenolic resin composition

[0066] Add 500g of phenol and 5g of oxalic acid into a four-necked flask, raise the temperature to 75°C, add dropwise 344g of formaldehyde solution with a concentration of 38wt%, and drop it in 1.5h, slowly raise the temperature to 83°C, and react at a constant temperature at this temperature. After reacting for 2.5 hours, the reaction product is dehydrated and vacuumized to remove phenols until the free phenol content in the reaction product is 2 wt%, to obtain a phenolic resin with a weight average molecular weight of 2000-3000 and a water content of less than 1 wt%.

[0067] Add 26 g of boric acid to 750 g of the above phenolic resin in two batches, stir and mix evenly, and react at a constant temperature of 135-140° C. for 1 hour. After reacting for 1 hour, detect the cone-plate viscosity of the reaction product, and stop the reaction when the cone-plate viscosity of the reaction product is 35P at 150°C. The reaction prod...

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Abstract

The invention belongs to the field of synthetic resin and particularly relates to a phenolic resin composition and application thereof. The phenolic resin composition provided by the invention mainly comprises boron phenolic resin, an amino compound and a phosphorus-containing flame retardant. The resin composition is high in thermal stability at a high temperature and the performance of a friction material product prepared from the phenolic resin composition as a binder is slowly degenerated during storage. Experimental results show that the heat loss of the phenolic resin composition provided by the invention is less than 40% when the phenolic resin composition is cured at 800 DEG C, and the heat losses of the phenolic resin composition which is respectively cured for 3 minutes and 5 minutes at 500 DEG C, are sequentially less than 0.5% and 1.2%; the coefficient of friction attenuation amount the friction material product prepared from the phenolic resin composition is less than 1.5%, the wear rate attenuation amount is less than 3%, the bending strength attenuation amount is less than 2% and the impact strength attenuation amount is less than 2.5%.

Description

technical field [0001] The invention belongs to the field of synthetic resins, in particular to a phenolic resin composition and its application. Background technique [0002] Phenolic resin is an industrially produced synthetic resin, which is widely used in friction materials, refractory materials, molding compounds, coatings, adhesives, foam plastics and other fields. Although phenolic resin has a history of more than 100 years, people have not given up research on the modification of phenolic resin. With the continuous development of industry and modernization, as well as the development of new fields, higher requirements are put forward for the performance of phenolic resin. [0003] Ordinary phenolic resin can exist stably below 200°C. If it exceeds 200°C, it will be oxidized obviously, and it will enter the stage of thermal decomposition from 340 to 360°C. As the temperature increases, the phenolic resin will gradually undergo pyrolysis, Carbonization phenomenon, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08K13/06C08K9/10C08K5/3492C08K5/21C08K5/18C08K3/32C08G8/28C08G8/10C08J5/14
Inventor 李枝芳宋庆鹏刘卫
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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