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Phenyl hydrogen-containing silicon oil with epoxy side chain and preparation method thereof

A technology of phenyl hydrogen-containing silicone oil and epoxy group, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor mechanical properties and poor adhesion, and achieve convenient operation, good bonding effect, and high transparency. The effect of light rate

Inactive Publication Date: 2015-06-03
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the above-mentioned technical problems in the prior art, the present invention provides a phenyl hydrogen-containing silicone oil containing epoxy groups in the side chain and a preparation method thereof. The described product and method solve the problems of the prior art. Technical problems of poor adhesion and poor mechanical properties of silicone resin

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  • Phenyl hydrogen-containing silicon oil with epoxy side chain and preparation method thereof
  • Phenyl hydrogen-containing silicon oil with epoxy side chain and preparation method thereof
  • Phenyl hydrogen-containing silicon oil with epoxy side chain and preparation method thereof

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Embodiment 1

[0031] A preparation method of phenyl hydrogen-containing silicone oil containing epoxy groups in the side chain, specifically comprising the steps of:

[0032] (1) Preparation of Cyclosiloxane Containing Epoxycyclohexane Group

[0033] Under a nitrogen atmosphere, 100 parts by weight of the hydrogen-containing cyclic mixture and 206 parts by weight of 4-vinyl epoxycyclohexane are added in a 1000ml four-necked flask equipped with a stirrer, a condenser tube, a constant pressure funnel and a thermometer, Add 100 parts by weight of toluene, 0.001 parts by weight of chloroplatinic acid-isopropanol solution, and 0.001 parts by weight of 4-methoxyphenol at the same time; then raise the temperature to 80°C and react for 2h. Distill under reduced pressure to remove the solvent and residual low boilers to obtain a liquid with a viscosity of 3000mPa.s, that is, cyclosiloxane containing epoxycyclohexane groups.

[0034] The cyclosiloxane containing epoxy cyclohexane group of above-ment...

Embodiment 2

[0050] (1) Preparation of Cyclosiloxane Containing Epoxycyclohexane Group

[0051] Under a nitrogen atmosphere, 100 parts by weight of hydrogen-containing cyclic bodies and 208 parts by weight of 4-vinyl epoxycyclohexane were added to a 1000ml four-necked flask equipped with a stirrer, a condenser tube, a constant pressure funnel and a thermometer, and 100 parts by weight of Part cyclohexane, 0.002 parts by weight of chloroplatinic acid, and 0.002 parts by weight of hydroquinone were added at the same time; then the temperature was raised to 85°C, and the reaction was carried out for 6h. The reaction mixture was distilled under reduced pressure at -0.096MPa at 155°C to remove the solvent and Residual low boilers give a light yellow liquid with a viscosity of 3100mPa.s, namely cyclosiloxane containing epoxycyclohexane groups.

[0052] According to the national standard GB / T 1677-2008, the epoxy value of the plasticizer is determined to be 0.54; it is close to the theoretical va...

Embodiment 3

[0061] (1) Preparation of Cyclosiloxane Containing Epoxycyclohexane Group

[0062] Under a nitrogen atmosphere, add 100 parts by weight of hydrogen-containing cyclic body and 210 parts by weight of 4-vinyl epoxycyclohexane into a 1000ml four-necked flask equipped with a stirrer, a condenser tube, a constant pressure funnel and a thermometer, and add 100 parts by weight of Part cyclohexane, 0.003 parts by weight of chloroplatinic acid, and 0.003 parts by weight of hydroquinone were added at the same time; then the temperature was raised to 90°C, and the reaction was carried out for 10h. The reaction mixture was distilled under reduced pressure at -0.096MPa at 160°C to remove the solvent and Remaining low boilers, a light yellow liquid with a viscosity of 4300mPa.s is obtained, which is the cyclosiloxane containing epoxycyclohexane group.

[0063] According to the national standard GB / T 1677-2008, the epoxy value of the plasticizer is determined to be 0.54; it is close to the th...

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Abstract

The invention discloses phenyl hydrogen-containing silicon oil with an epoxy side chain. The structural formula of the silicon oil is described in the specification. The invention further provides a preparation method of the silicon oil. The preparation method comprises the steps of adding a hydrogen-containing cyclic mixture and 4-vinyl cyclohexene oxide into a reaction container in the atmosphere of nitrogen, and adding a solvent, a catalyst and a polymerization inhibitor; heating for reacting, and distilling under reduced pressure to obtain cyclosiloxane containing epoxy cyclohexane groups; adding the cyclosiloxane containing epoxy cyclohexane groups, a methyl phenyl cyclic body, a hydrogen-containing cyclic body, an end-capping reagent and a solvent into another container, and adding a catalyst; and heating for reacting, and distilling under reduced pressure to obtain the phenyl hydrogen-containing silicon oil with the epoxy side chain. The silicon oil has the advantages of good cohesiveness, high refractive index and high refractive index.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a phenyl hydrogen-containing silicone oil, specifically a phenyl hydrogen-containing silicone oil with epoxy groups in its side chain and a preparation method thereof. Background technique [0002] At present, LED encapsulants are mainly composed of vinyl silicone resin and hydrogen-containing silicone oil. Among them, hydrogen-containing silicone oil is used as a crosslinking agent for LED encapsulation glue. LED encapsulants prepared with hydrogen-containing silicone oil as a crosslinking agent component are often difficult to meet the development needs of high-power LED encapsulation industry due to poor cohesiveness. Tackifiers are often added to the composition of LED encapsulants to enhance the bonding effect. Chinese patent , CN101508882B discloses a packaging material applied to light-emitting diodes and a preparation method thereof. The tackifier used is ros...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/14C08G77/12C09J183/06C09J183/05C09J183/07H01L33/56
Inventor 张英强赵永新徐耀民王晓瑞郑康生
Owner SHANGHAI INST OF TECH
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