SiC/Al2(WO4)3/Al composite material with adjustable thermal expansion

Abstract

The invention belongs to the technical field of composite materials, and specifically relates to a SiC / Al2(WO4)3 / Al composite material with an adjustable thermal expansion. Al is used as a matrix; a low thermal expansion material SiC is used as a reinforcement; meanwhile, a certain amount of Al2(WO4)3 powder is added in for achieving a reduction of the thermal expansion coefficient. Al2(WO4)3 is a negative thermal expansion material that is able to resist a high temperature and is stable in property. On one aspect, Al2(WO4)3 is added in for reducing the thermal expansion coefficient of the original SiC / Al composite material; on the other aspect, Al2(WO4)3 is added in for reducing the content of the highly hard abrasive SiC and increasing the subsequent processing performance of the composite material. The SiC / Al2(WO4)3 / Al composite material with the adjustable thermal expansion is prepared by a powder metallurgy technology. The thermal expansion coefficient of the SiC / Al2(WO4)3 / Al composite material is significantly lower than that of the SiC / Al composite material. Accordingly, the requirement to the thermal expansion coefficient of electronic packaging materials is met better.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a SiC / Al material with adjustable thermal expansion 2 (WO 4 ) 3 / Al composite material, by changing the low thermal expansion material SiC and the negative thermal expansion material Al 2 (WO 4 ) 3 to adjust the thermal expansion coefficient of the composite material. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials, and composite materials for electronic packaging are generally used in a certain temperature-changing environment, so in this The thermal dimensional stability in the temperature range must be good, and the thermal expansion coefficient is a very important parameter; SiC / Al composite material is a new type of electronic packaging material, and its advantages ar...

AI Technical Summary

Problems solved by technology

[0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. Composite materials are generally used in an environment with a certain temperature change, so the thermal dimensional stability in this temperature range must be good, and the thermal expansion coefficient is a very important parameter; SiC / Al composite material is a new type of electronic packaging material. Its advantages are that the raw material is cheap, can form complex shapes, and has the characteristics of high thermal conductivity, high specific strength, high specific modulus, wear resistance, and low density. For SiC / Al composite materials, the most common The method is to increase the content of reinforcement SiC to adjust the thermal expansion coefficient of the material, which can reduce the thermal expansion coefficient of the composite material from 23×10-6 K-1 of aluminum to 7.5 ×10-6 K-1, material researchers have done a lot of research and reports on this, and the research results have also been applied in the field of electronic packaging; but SiC itself is a high-hardness abrasive with high brittleness. The larger the volume fraction of SiC, the lower the cutting performance of the composite material, which has a great impact on the subsequent machining of the material, making the development of SiC / Al composite materials How to achieve low expansion, high thermal conductivity, performance stability and processability of composite materials at a low filling volume fraction is the key problem to solve the practical application of this type of material, and the discovery of negative thermal expansion materials provides a basis for solving such problems Although it is possible, at present, there are few reports on the use of negative thermal expansion materials and Al-based composites to adjust the thermal expansion coefficient of composite materials.

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