Diamond grinding pad for processing super-hard ceramics and preparation method for diamond grinding pad

A diamond and grinding pad technology, which is applied in the field of research and development of ceramic processing devices, can solve the problems of difficult to meet product dimensional accuracy, poor product surface quality, and difficult to meet dimensional accuracy, etc., to achieve heat dissipation and chip removal, consistent size, Good stability of grinding force

Active Publication Date: 2015-07-15
LENS TECH CHANGSHA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional ceramic material processing technology is mainly based on mechanical processing. By turning, cutting, and grinding ceramic materials, the process is simple and the efficiency is high. However, due to the high hardness and high brittleness of the ceramic material itself, mechanical processing is difficult to meet the requirements of the product. Requirements for high dimensional accuracy and low surface roughness
It is more difficult to meet the requirements of high dimensional accuracy and low surface roughness

Method used

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  • Diamond grinding pad for processing super-hard ceramics and preparation method for diamond grinding pad
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  • Diamond grinding pad for processing super-hard ceramics and preparation method for diamond grinding pad

Examples

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Example Embodiment

[0041] Example 1

[0042] Such as figure 1 As shown, the present invention provides a diamond polishing pad for processing superhard ceramics. The polishing pad includes a diamond material layer 1, and the diamond material layer 1 includes a square abrasive block layer 11 and a flat layer 12. From one side of the diamond polishing pad to the other side, it includes: a square abrasive block layer 11, a flat layer 12, a non-woven fabric layer 2, an adhesive layer 3, a PET film layer 4, and a PC with double-sided adhesive Layer 5. figure 1 Among them, 51 is the double-sided adhesive layer on the PC board layer with double-sided adhesive. The diamond material layer is made of the following raw materials in mass percentages: resin binder 35%, diamond 10%, wollastonite 50%, molybdenum disulfide 3%, and fumed silica 2%.

[0043] The method for preparing the above-mentioned diamond polishing pad for processing superhard ceramics includes the following steps:

[0044] Step 1: Mixing: Weigh ...

Example Embodiment

[0055] Example 2

[0056] The structure of the diamond polishing pad in Example 2 is the same as that in Example 1, but the ingredients for preparing the diamond material layer are: resin binder 25%, diamond 20%, wollastonite 40%, molybdenum disulfide 10%, gas phase Silica 5%.

Example Embodiment

[0057] Example 3

[0058] The structure of the diamond polishing pad in Example 3 is the same as that in Example 1, but the ingredients for preparing the diamond material layer are: resin binder 50%, diamond 5%, wollastonite 43.5%, molybdenum disulfide 1%, gas phase Silica 0.5%.

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Abstract

The invention provides a diamond grinding pad for processing super-hard ceramics. The grinding pad comprises a diamond material layer, wherein the diamond material layer comprises a square grinding block layer and a tiling layer and is prepared from the following raw materials in percentage by mass of 25 to 50 percent of resin binder, 5 to 20 percent of diamond, 1 to 10 percent of molybdenum disulfide, 20 to 50 percent of wollastonite and 0.5 to 5 percent of fumed silica. All of performances of the diamond grinding pad provided by the invention in the grinding force, the grinding force stability, the cutting force and the service life are remarkably superior to the performances of a 45MIC grinding pad of 3M company.

Description

technical field [0001] The invention relates to the field of research and development of ceramic processing devices, in particular to a diamond grinding pad for processing superhard ceramics and a preparation method thereof. Background technique [0002] Due to the characteristics of high strength, high hardness, high brittleness, wear resistance, high shear stress resistance and extremely low tensile stress resistance of the ceramic itself, it is difficult to process, and the processing cost is high, the efficiency is low, and the processing quality is low. not ideal. Superhard ceramics (generally zirconia ceramics used in the field of electronic devices) are more prominent in strength, hardness, and brittleness than ordinary ceramics, making it more difficult to process, and the processing cost is higher and the efficiency is lower. Therefore, The processing quality is even less ideal. With economic development putting forward higher demands on ceramic performance, super...

Claims

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Application Information

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IPC IPC(8): B24B37/11B24D18/00
CPCB24B37/11B24D18/0009
Inventor 周群飞饶桥兵康萌
Owner LENS TECH CHANGSHA
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