Low release quantity additive halogen-free flame-retardant heat-conduction organic silicon pouring sealant and preparation method thereof

A technology of silicone potting and addition molding, which is used in the fields of low outgassing, thermal conductive addition silicone liquid potting, and halogen-free flame retardant. It can solve the problem of high outgassing and achieve good fluidity and excellent thermal conductivity. and flame retardancy

Inactive Publication Date: 2015-07-29
CHENGDU TALY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, the present invention provides a low-outgassing addition type halogen-free flame-retardant heat-conducting silicone liquid encapsulant and its preparation method. The volatil

Method used

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  • Low release quantity additive halogen-free flame-retardant heat-conduction organic silicon pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] (1) Preparation of base rubber: at room temperature (25°C), 120 parts of α,ω divinylpolydimethylsiloxane with a volatile content of 0.3% and a viscosity of 500mPa.s, and its ethylene base content of 0.5%; 100 parts of amorphous alumina with a volatile content of 0.21% and an average particle size of 5 μm; 140 parts of aluminum hydroxide with a volatile content of 0.18% and an average particle size of 3 μm; a volatile content of 0.28 %, 60 parts of heavy calcium carbonate with an average particle size of 30 μm are added to the kneader, heated up to 120 ° C and mixed for 1 h, then ground twice by a three-roller machine and cooled to obtain a base compound.

[0041] (2) Preparation of component A: Take 100 parts of the base rubber, add 3.5 parts of polymethylhydrogensiloxane (Si-H :Si-Vi~1.65), 0.2 parts of 1,3-diethyl-1,1,3,3-tetramethyldisiloxane, stirred for 2h, mixed evenly and removed under vacuum condition of 0.08-0.09MPa After bubbling, make up component A.

[004...

Embodiment 2

[0049] Other contents are as in the examples, and the preparation steps are as follows:

[0050] (1) Preparation of base rubber: at room temperature (25°C), 100 parts of α,ω divinylpolydimethylsiloxane with a volatile content of 0.25% and a viscosity of 100mPa.s, and its ethylene base content of 0.8%; 50 parts of zinc oxide with a volatile content of 0.24% and a particle size of 40-50 μm; 50 parts of magnesium hydroxide with a volatile content of 0.15% and a particle size of 20-30 μm; a volatile content of 0.28 %, 100 parts of glass beads with an average particle size of 100 μm were added to the kneader, heated to 150 ° C and mixed for 2 hours, then ground by a three-roll machine twice and then cooled to obtain the base rubber.

[0051] (2) Preparation of component A: Take 100 parts of base rubber, add 3.7 parts of polymethylhydrogensiloxane (Si-H :Si-Vi~1.85), 0.1 parts of 1,3,5,7 tetravinyl-1,3,5,7 tetramethylcyclotetrasiloxane, stirred for 3 hours and mixed evenly, under t...

Embodiment 3

[0055] (1) Preparation of base rubber: at room temperature (25°C), 110 parts of α,ω divinylpolydimethylsiloxane with a volatile content of 0.3% and a viscosity of 1000mPa.s, and its ethylene Base content of 0.4%; 100 parts of boron nitride with a volatile content of 0.25% and a particle size of 3-10 μm; 200 parts of zinc borate with a volatile content of 0.18% and a particle size of 20-30 μm; a volatile content of 0.28 %, 150 parts of silicic acid powder with a particle size of 80-100 μm was added to the kneader, heated to 100°C and mixed for 3 hours, then ground by a three-roll machine for 3 times and then cooled to obtain the base rubber.

[0056] (2) Preparation of component A: Take 100 parts of base rubber, add 2.5 parts of polymethylhydrogensiloxane (Si-H :Si-Vi~1), 0.01 part of 1-ethynyl-1-cyclohexanol, stirred for 0.5h and mixed evenly, then removed the air bubbles under the vacuum condition of 0.08-0.09MPa, and prepared into component A.

[0057] (3) Preparation of co...

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Abstract

The invention belongs to the technical field of organic silicon pouring sealants, and particularly relates to a low release quantity additive halogen-free flame-retardant heat-conduction organic silicon pouring sealant and a preparation method thereof. The pouring sealant comprises an A component and a B component, wherein the A component and the B components are mixed in weight ratio of 1:1; the A component comprises basic rubber materials, polymethyl hydrogen siloxane and crosslink breaker; the weight ratio of the basic rubber materials, the polymethyl hydrogen siloxane and the crosslink breaker is 100:2.5-4:0.01-0.5; the B component comprises basic rubber materials and catalyzer; the weight ratio of the rubber materials and the catalyzer is 100:0.15-0.2; the A component and the B component are uniformly mixed according to the equal weight ratio and are defoaming to obtain the pouring sealant. The pouring sealant is good in flowability, can be heat and cured at room temperature, has favorable heat conductivity and flame retardancy, has the release quantity being lower than 0.5 percent under the condition of 120 DEG C*24h, and is particularly applicable to pouring with the heat-conduction and flame-retardant requirements under a seal system in the LED (Light-emitting Diode) industry.

Description

technical field [0001] The invention belongs to the technical field of silicone potting glue, and in particular relates to a low outgassing, halogen-free flame-retardant, heat conduction addition type silicone liquid potting glue. Background technique [0002] In today's world, science and technology are changing with each passing day. Human society has entered the age of electronic information. Electronic components and electronic products tend to be denser and miniaturized. To minimize the adverse effects of the outside world, electronic components need to be potted. Now the heat generated by electronic equipment is increasing sharply. If the heat cannot be conducted in time, it will easily cause local high temperature, which may damage the components and affect the reliability and service life of electronic components. Therefore, heat conduction requirements are also proposed while moisture-proof insulation . At the same time, as people's requirements for environmenta...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06
Inventor 李强陶云峰杨卓刘备辉方辉张先银
Owner CHENGDU TALY TECH CO LTD
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