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heat dissipation structure

一种结构体、发热体的技术，应用在电固体器件、电路热装置、半导体器件等方向，能够解决残留变形、使用者烫伤、散至外部等问题，达到抑制传热、防止烫伤的效果

Active Publication Date: 2018-01-05
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in general, epoxy resin shrinks in volume during the curing reaction, so it is known that after curing, residual stress or residual deformation occurs inside the material, which leads to disadvantages such as a decrease in strength or warping deformation of the semiconductor plastic package. reason
In addition, in Patent Document 5, an example is shown in which a heating element is covered with epoxy resin so that a space is provided between the epoxy resin and the resin cover, but this is only an example of a structure with insufficient heat conduction.
In fact, in Patent Document 5, if the epoxy resin is not bonded to the cover, it is considered that heat dissipation is insufficient
For this application, it cannot be said that the thermal conductivity of epoxy resin is sufficient, but it is difficult to sufficiently dissipate heat to the outside
In order to use epoxy resin to effectively dissipate the heat of the heating element to the outside and eliminate hot spots, it is usually necessary to further contact the epoxy resin covering the heating element with the resin cover or the body for thermal diffusion. As a result, the heat of the heating element is generated. Transferred to the body, causing users to be scalded and other problems

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0115] Hereinafter, embodiments and effects of the invention will be shown through examples, but the present invention is not limited thereto.

[0116]

[0117] (Viscosity of thermally conductive resin composition)

[0118] Using a BH-type viscometer, the viscosity of the thermally conductive resin composition was measured on 23° C. and 50% RH conditions.

[0119] (Thermal conductivity of thermally conductive resin composition)

[0120] Wrap the thermally conductive resin composition in Saran Wrap (registered trademark), use a hot plate method thermal conductivity measuring device TPA-501 (manufactured by Kyoto Denshi Kogyo Co., Ltd.), clamp a sensor with a size of 4φ between two samples, and use In this method, the thermal conductivity is measured at 23°C.

[0121] (Tensile elastic modulus of cured product of thermally conductive resin composition)

[0122] The thermally conductive resin composition was cured in an atmosphere of 23° C. and 50% RH to produce a small dumbb...

Synthetic example 1

[0134] Under nitrogen atmosphere, add CuBr (1.09kg), acetonitrile (11.4kg), butyl acrylate (26.0kg) and 2,5-dibromodiethyl adipate (2.28kg) in 250L reactor, at 70 Stir at ~80°C for about 30 minutes. Pentamethyldiethylenetriamine was added thereto to start the reaction. From 30 minutes to 2 hours after the start of the reaction, butyl acrylate (104 kg) was continuously added. During the reaction, pentamethyldiethylenetriamine was appropriately added so that the internal temperature was 70°C to 90°C. The total amount of pentamethyldiethylenetriamine used so far was 220 g. Four hours after the start of the reaction, the volatile components were removed by heating and stirring at 80° C. under reduced pressure. Acetonitrile (45.7 kg), 1,7-octadiene (14.0 kg) and pentamethyldiethylenetriamine (439 g) were added thereto and stirring was continued for 8 hours. The mixture was heated and stirred at 80°C under reduced pressure to remove volatile components.

[0135] Add toluene in ...

Synthetic example 2

[0141] Polyoxypropylene glycol with a number average molecular weight of about 2,000 was used as an initiator to polymerize propylene oxide using a zinc hexacyanocobaltate glyme complex catalyst to obtain a number average molecular weight of 25,500 (using Tosoh HLC-8120GPC manufactured by the company was used as the liquid delivery system, TSK-GEL H type manufactured by Tosoh Corporation was used as the column, and THF was used as the solvent (polypropylene oxide measured in terms of polystyrene). Next, methanol was distilled off by adding 1.2 equivalents of NaOMe methanol solution to the hydroxyl groups of the hydroxyl-terminated polypropylene oxide, and then allyl chloride was added to convert the terminal hydroxyl groups into allyl groups. Unreacted allyl chloride was removed by devolatilization under reduced pressure. 300 parts by weight of n-hexane and 300 parts by weight of water were mixed and stirred with respect to 100 parts by weight of the obtained unrefined allyl-t...

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PUM

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Abstract

The present invention provides a heat dissipation structure comprising (A) a printed circuit board, (B) a heating element, (C) an electromagnetic shield, (D) a rubber-like heat-conductive resin layer, and (E) a non-heat-conductive (D) The tensile elastic modulus of the rubber-like thermally conductive resin layer is 50MPa or less, the thermal conductivity is above 0.5W / mK, and (E) The thermal conductivity of the non-thermally conductive layer is lower than 0.5W / mK, its characteristics The heating element (B) is arranged on the printed circuit board (A), and the heating element (B) is in contact with the thermally conductive resin layer (D), and then between the heating element (B) and the electromagnetic shielding cover (C). A non-thermally conductive layer (E) is provided.

Description

technical field [0001] The present invention relates to a heat dissipation structure used for electronic equipment, precision equipment, and the like. Background technique [0002] In recent years, the performance of electronic equipment such as personal computers, mobile phones, and PDAs, and lighting and display equipment such as LEDs and ELs have been significantly improved, which is due to the remarkable improvement in the performance of computing elements and light-emitting elements. In this way, as the performance of computing elements and light-emitting elements improves, the amount of heat generated also increases significantly. How to dissipate heat from electronic equipment, lighting, and display equipment has become an important issue. In addition, as far as electronic parts with high heat generation are concerned, it is generally believed that the electromagnetic waves entering and leaving the electronic parts are shielded to prevent electromagnetic waves from th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H05K7/20H05K9/00
CPCH05K7/20463H05K9/0024H01L2924/0002H01L23/3121H01L23/3737H01L23/552H05K1/0209H05K3/284H05K2201/0133H05K2201/0209H05K2201/10371H01L2924/00H05K1/0204
Inventor 鸿上亚希萩原一男大熊敬介
Owner KANEKA CORP
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