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Modified urea-formaldehyde resin adhesive for high moisture-proof fiberboard

A technology of urea-formaldehyde resin glue and fiberboard, which is applied in the field of fiberboard manufacturing, can solve the problems such as the service life of wooden products and furniture affecting the scope of use of products, high water absorption thickness expansion rate, easy deformation due to moisture, etc. Improve waterproof and water resistance, good dimensional stability

Active Publication Date: 2017-09-29
安徽池州丰林木业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the defects of high water absorption thickness expansion rate, easy to be deformed by moisture and water resistance of the existing medium density fiberboard used in a dry state, which affect the product range of use and the service life of wooden furniture

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Raw material ratio

[0024] raw material

Weight (㎏)

content(%)

Remark

formaldehyde

500

37.0

urea

300

46.3

U1=15, U2=70 U3=80

Melamine

50

99.5

M1=10, M2=40

Oxidized starch

5

industrial grade

acid

Appropriate amount

20-50

lye

Appropriate amount

20-50

[0025] 2. Synthesis process steps:

[0026] 1) Put formaldehyde into the reaction kettle at one time, add acid solution under stirring to adjust the pH to 3.5-4.0.

[0027] 2) Add urea and oxidized starch for the first time, and the amount of urea added is 45.0% of the total gum mass.

[0028] 3) Heat up to 40-50°C and keep warm at 60-80°C for 20-30min.

[0029] 4) Add lye to adjust the pH to 6.0-6.5, add the second urea (20.0-25.0% of the glue volume) and melamine (1-2% of the glue volume), and keep warm at 80-90°C for 20-60min.

[0030] 5) Add lye to adjust the pH=7.5-8.5, add the second...

Embodiment 2

[0036] 1. Raw material ratio

[0037] raw material

Weight (㎏)

content(%)

Remark

formaldehyde

600

37.0

urea

350

46.3

U1=185, U2=75 U3=90

Melamine

80

99.5

M1=20, M2=60

Oxidized starch

10

industrial grade

acid

Appropriate amount

20-50

lye

Appropriate amount

20-50

[0038] 2. Synthesis process steps:

[0039] 1) Put formaldehyde into the reaction kettle at one time, add acid solution under stirring to adjust the pH to 4.0-4.5.

[0040] 2) Add urea and oxidized starch for the first time, and the amount of urea added is 50.0% of the total glue amount.

[0041] 3) Heat up to 40-50°C, and keep warm at 60-80°C for 30-40min.

[0042] 4) Add lye to adjust the pH to 6.5-7.0, add the second urea (20.0-25.0% of the glue) and melamine (1-3% of the total glue), and keep warm at 80-90℃ for 30- 40min.

[0043] 5) Add lye to adjust the pH=7.8-8.0, add the second ...

Embodiment 3

[0049] 1. Raw material ratio

[0050] raw material

Weight (㎏)

content(%)

Remark

formaldehyde

500

37.0

urea

350

46.3

U1=170, U2=100 U3=80

Melamine

80

99.5

M1=12, M2=18

Oxidized starch

10

industrial grade

acid

Appropriate amount

20-50

lye

Appropriate amount

20-50

[0051] 2. Synthesis process steps:

[0052] 1) Put formaldehyde into the reaction kettle at one time, add acid solution under stirring to adjust the pH to 4.5-5.0.

[0053]2) Add urea and oxidized starch for the first time, and the amount of urea added is 48% of the total glue.

[0054] 3) Heat up to 40-50°C, keep warm at 60-80°C for 40-60min.

[0055] 4) Add lye to adjust the pH to 6.0-6.5, add the second urea (accounting for 20.0-25.0% of the glue) and melamine (accounting for 1-3% of the total mass of the glue), and keep warm at 80-90°C for 50- 60min.

[0056] 5) Add lye to adjust t...

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Abstract

The invention discloses a modified urea-formaldehyde resin adhesive for high moisture-proof fiberboard, which uses formaldehyde, urea, a small amount of melamine and oxidized starch as raw materials. Alkali process preparation. The improved network structure of the adhesive with Uron ring and triazine heterocyclic ring can not only improve the reactivity of the methylol molecular group in the adhesive and the effect of hot-press curing, but also effectively block the hydrophilic group. The fiberboard prepared by the invention can significantly improve the water resistance and bonding strength of the fiberboard, solve the problems of easy swelling and deformation of the fiberboard and poor strength in high humidity environment, and has the functions of water resistance, environmental protection and prolonging the service life of fiberboard wood products.

Description

technical field [0001] The invention belongs to the technical field of fiberboard manufacturing, and in particular relates to a preparation technology of a modified urea-formaldehyde resin adhesive for medium-density moisture-proof fiberboards. Background technique [0002] Medium density fiberboard is made of wood fiber or other plant fiber, after fiber preparation, adhesive or other additives, under heat and pressure, it is pressed to a thickness of not less than 1.5mm, and its nominal density ranges from 0.65g / cm3 to Plates between 0.80g / cm3. [0003] Medium-density fiberboard has unique advantages such as uniform material, dense and delicate structure, smooth and clean surface, stable performance, no radiation and easy processing. Currently, it is used in more than 90% of furniture manufacturing and building decoration industries, but most fiberboards are dry. The furniture-type or ordinary MDF used in the state cannot meet the requirements of high-end office furniture,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/32C08G12/40
Inventor 韦淇峰詹满军
Owner 安徽池州丰林木业有限公司