Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resource reutilization method by utilization of copper-clad plate residue

A copper-clad laminate and recycling technology, which is applied in the field of resource recycling of copper-clad laminate residues, can solve problems such as waste copper-clad laminate pollution, and achieve the effects of environmental protection, good dispersion, and environmentally friendly preparation of raw materials

Active Publication Date: 2015-08-19
SOUTH CHINA INST OF ENVIRONMENTAL SCI MEP +1
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the problem of recycling copper clad laminates in the prior art, and provide a method for recycling copper clad laminate residues. This method not only saves resources, reduces costs, improves the performance of products, and greatly Solve the pollution problem of waste copper clad laminates to a certain extent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resource reutilization method by utilization of copper-clad plate residue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Based on the weight of the copper clad laminate residue, put the residue of the waste copper clad laminate after the copper extraction treatment (by mass percentage, the main components are 30% cured resin, 68% glass fiber, and 2.0% copper;) into 0.1% mass concentration sulfuric acid Soak in the solution for 5 hours, then add 0.5% methyl tri-tert-butyl peroxysilane coupling agent and 1.5% KH570 coupling agent, soak for another 2 hours, pick up the copper clad laminate residue and dry it at 120°C for 1 hour hour, obtain the copper clad laminate residue after pretreatment;

[0029] In terms of weight percentage, 60% of the pretreated copper-clad laminate residue, 20% of calcium carbonate powder, and 20% of m-phenylene neopentyl glycol type unsaturated polyester are weighed, stirred and mixed evenly, and molded into The uniformly mixed mixture is poured into a steel mold to make a square billet, and then cured at a constant temperature of 100°C, cut into a plate-shaped mat...

Embodiment 2

[0031] Based on the weight of the copper clad laminate residue, put the residue of the waste copper clad laminate after the copper extraction treatment (by mass percentage, the main components are 30% cured resin, 69.9% glass fiber, and 0.1% copper) into a 1.0% mass concentration sulfuric acid solution Soak for 2 hours, then add 1.5% ethylene tri-tert-butylperoxysilane coupling agent and 0.5% KH570 coupling agent, soak for another 0.5 hour, pick up the copper clad laminate residue and dry it at 100°C for 2 hours. Obtain the pretreated copper clad laminate residue;

[0032]In terms of weight percentage, 70% of the pretreated copper-clad laminate residue, 20% of calcium carbonate powder, and 10% of epoxy resin are weighed, stirred and mixed evenly, and molded by pouring to form a uniformly mixed mixture. In the steel mold, a square blank is made, and after being cured at a constant temperature of 120°C, it is cut into a plate-shaped material of 1000mm×1000mm×15mm, and the surfac...

Embodiment 3

[0034] Based on the weight of the copper clad laminate residue, put the residue of the waste copper clad laminate after the copper extraction treatment (by mass percentage, the main components are 50% cured resin, 49% glass fiber, and 1.0% copper) into 0.6% mass concentration sulfuric acid solution soak for 2.5 hours, then add 1.0% allyl tri-tert-butylperoxysilane coupling agent and 1.0% KH570 coupling agent, soak for another 1.5 hours, pick up the copper clad laminate residue and dry it at 120°C for 1 hour , to obtain the pretreated copper clad laminate residue;

[0035] In terms of weight percentage, 40% of the pretreated copper-clad laminate residue, 20% of calcium carbonate powder, and 40% of phenolic resin are weighed, stirred and mixed evenly, and molded by casting. In the mold, a square blank is made, and after being cured at a constant temperature of 100°C, it is cut into a plate-shaped material of 800mm×800mm×15mm, and the surface is polished to a mirror image glossin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
bending strengthaaaaaaaaaa
bending strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a resource reutilization method by the utilization of copper-clad plate residue. The method comprises the following steps: immersing copper-clad plate residue in a sulfuric acid solution with the concentration of 0.1-1.0 wt% for 2-5 hours based on weight of the copper-clad plate residue, adding 0.5-1.5% of an organo-silicone peroxide coupling agent and 0.5-1.5% of a KH570 coupling agent, immersing for 0.5-2 hours, dehydrating the copper-clad plate residue, and drying at 100-120 DEG C for 1-2 hours to obtain pretreated copper-clad plate residue; and stirring and uniformly mixing 40-70 wt% of the pretreated copper-clad plate residue, 10-20 wt% of a calcium carbonate powder and 10-40 wt% of resin, molding, solidifying, cutting, and polishing to prepare a novel plate. According to the invention, comprehensive utilization of the copper-clad plate residue can be promoted so as to change a waste material into a valuable thing, and a novel plate with high bending strength can be prepared.

Description

technical field [0001] The invention belongs to the technical field of recycling copper clad laminates, and more specifically relates to a method for resource recycling of copper clad laminate residues. Background technique [0002] At present, with the rapid development of social economy, the increasing popularity of various electronic products and the acceleration of replacement speed, people's demand for various electronic and electrical products is also increasing. Copper clad laminates are widely used in various electronic equipment such as large computers, office and personal computers, household appliances, entertainment appliances and their auxiliary products. With the mass production of these electronic products and shorter and shorter scrapping cycles, the amount of scrap copper clad laminates is also increasing dramatically. Therefore, electronic pollution caused by discarded copper clad laminates has become a severe environmental problem. The recycling technolo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/06C08L63/00C08L61/06C08L61/24C08L101/00C08L23/12C08K9/06C08K9/02C08K7/14C08K3/26
Inventor 刘晓文王炜钟明峰陈岩贽温勇
Owner SOUTH CHINA INST OF ENVIRONMENTAL SCI MEP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com