TFT substrate structure manufacturing method and TFT substrate structure thereof
A manufacturing method and substrate technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as large costs and expenses, and achieve the effects of reducing production costs, saving processes, and improving production efficiency.
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[0037] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0038] see figure 2 , the present invention at first provides a kind of manufacturing method of TFT substrate structure, comprises the following steps:
[0039] Step 1, such as image 3 As shown, a substrate 1 is provided on which a buffer layer 2 is deposited.
[0040] Specifically, the substrate 1 may be a glass substrate or a plastic substrate, and the material of the buffer layer 2 may be silicon oxide (SiOx), silicon nitride (SiNx), or a combination of the two.
[0041] Step 2, such as Figure 4 As shown, a polysilicon (Poly-Si) layer 3 is deposited on the buffer layer 2 , and a gate insulating layer 4 is deposited on the polysilicon layer 3 .
[0042] Specifically, the material of the gate insulating layer 4 may be silicon oxide, si...
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