Silicon-chip mechanical arm

Abstract

The invention relates to a silicon-chip mechanical arm, and the silicon-chip mechanical arm comprises a mechanical arm, wherein one end of the mechanical arm is connected with a sliding guide rail; a vacuum adsorption-type claw which is connected with the other end of the mechanical arm; vacuum chucks which are located on the vacuum adsorption-type claw; and a controller which can change the position of the mechanical arm and control the working of the vacuum chucks. The silicon-chip mechanical arm also comprises a temperature sensor which is disposed on the mechanical arm and enables a detected temperature signal to be transmitted to the controller. The number of the vacuum chucks is not less than two. When the mechanical arm is used for grabbing a chip, the mechanical arm can reduce the breakage rate of silicon chips, improves the qualified rate of the surfaces of the silicon chips, also improves the effect that the vacuum adsorption-type claw grabs the silicon chips, and avoiding a problem of insufficient absorption force caused by lower degree of vacuum.

Description

technical field [0001] The invention relates to the technical field of semiconductors, and more specifically, the invention relates to a silicon wafer manipulator for transporting silicon wafers. technical background [0002] In the process of making solar cells, important processes such as texturing, diffusion, wet etching, plasma-enhanced chemical vapor deposition, and printing and sintering are required. Among them, the process of plasma-enhanced chemical vapor deposition Deposit a layer of silicon nitride film that can reduce reflection and passivation. In this process, silicon wafers are usually placed in graphite boats at a high temperature of more than 400 degrees Celsius. Immediately after the process is completed, the silicon wafers are bent. If the silicon wafer is not cooled to room temperature, it is easy to cause the silicon wafer to be broken if it is taken by the robot arm, and the suction cup of the robot arm is also easy to leave marks on the silicon nitrid...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, the present invention provides a silicon wafer manipulator, which can not only reduce the fragmentation rate of silicon wafers, improve the pass rate of silicon wafer surface, but also improve the Vacuum adsorption claws have the effect of adsorbing silicon wafers, avoiding the problem of insufficient suction caused by poor vacuum

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