Copper alloys for electrical and electronic equipment, copper alloy sheets for electrical and electronic equipment, conductive components and terminals for electrical and electronic equipment

Abstract

The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass% to 15.0 mass% of Zn; 0.10 mass% to 0.90 mass% of Sn; 0.05 mass% to less than 1.00 mass% of Ni; 0.001 mass% to less than 0.100 mass% of Fe; 0.005 mass% to 0.100 mass% of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002‰¤Fe / Ni<1.500, 3.0<(Ni+Fe) / P<100.0, and 0.10<Sn / (Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS / TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

Description

technical field [0001] The present invention relates to a Cu-Zn-Sn based copper alloy for electrical and electronic equipment used as a conductive element for electrical and electronic equipment such as a connector of a semiconductor device, other terminals, or a movable conductive sheet or a lead frame of an electromagnetic relay. Copper alloy sheet for electrical and electronic equipment, conductive components and terminals for electrical and electronic equipment. [0002] This application claims priority to Patent Application No. 2012-288051 filed in Japan on December 28, 2012 and Patent Application No. 2013-252331 filed in Japan on December 5, 2013, and uses the contents thereof for this specification. Background technique [0003] Cu—Zn alloys have been widely used as raw materials for conductive elements for electrical and electronic equipment in view of the balance between strength, processability, and cost. [0004] In addition, in the case of terminals such as conn...

AI Technical Summary

Problems solved by technology

[0016] However, in Patent Documents 1 and 2, only the respective contents of Ni, Fe, and P are considered, and it is not always possible to reliably and sufficiently improve the stress relaxation resistance simply by adjusting these respective contents.

[0017] In addition, although Patent Document 3 discloses adjusting the Ni / Sn ratio, the relationship between the P compound and the stress relaxation resistance is not considered at all, and the improvement of the stress relaxation resistance cannot be sufficiently and reliably achieved.

[0018] Furthermore, in Patent Document 4, the stress relaxation resistance cannot be sufficiently improved only by adjusting the total amount of Fe, Ni, and P and the atomic ratio of (Fe+Ni) / P.

[0019] As described above, conventionally proposed methods cannot sufficiently improve the stress relaxation resistance of Cu-Zn-Sn alloys

Therefore, in the connector of the above-mentioned structure, the residual stress relaxes over time or in a high-temperature environment, and the contact pressure with the conductive member on the opposite side cannot be maintained, so that there is a problem that defects such as poor contact are likely to occur at an early stage.

To avoid this problem, in the past, the wall thickness of the material had to be increased, resulting in increased material cost and weight

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