Glass fiber

Abstract

The present invention provides a glass fiber, comprising the following components by mass: 50-60% of SiO2; 10-20% of Al2O3; 20.2-28% of B2O3; 0-4% of CaO; 4-10% of MgO; 0-0.4% of Na2O and K2O; 0.1-0.4% of Li2O; 0-2% of F2; 0-0.2% of Fe2O3; and 0-0.5% of TiO2. Through improvement of the B2O3 component proportion and significant reduction of the content of Na2O and K2O components, various components interact, dielectric constant and dielectric loss are reduced, water-resistance of the glass fiber is better, and the molding temperature and crystallization upper limit temperature are lower.

Description

technical field [0001] The invention relates to the field of inorganic non-metallic materials, in particular to a glass fiber. Background technique [0002] Glass fiber is a high-performance inorganic material with excellent mechanical properties, corrosion resistance, high temperature resistance and good insulation. With the rapid development of the electronic information industry, glass fiber needs to have lower dielectric constant and dielectric loss, so that the circuit board can propagate faster and have smaller propagation loss. [0003] At present, the glass fibers commonly used in circuit boards at home and abroad are mainly E glass fibers and D glass fibers. Among them, the composition of E glass fibers is: 52-56% SiO 2 , 12-16% Al 2 o 3 , 5-10% of B 2 o 3 , 16-25% CaO, 0-5.0% MgO, 3-5% Na 2 O+K 2 O, E glass fiber has the advantages of good processability, good water resistance, and low price, but its dielectric constant is high, about 6.7, and its dielectric...

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Problems solved by technology

[0003] At present, the glass fibers commonly used in circuit boards at home and abroad are mainly E glass fibers and D glass fibers. Among them, the composition of E glass fibers is: 52-56% SiO 2 , 12-16% Al 2 o 3 , 5-10% of B 2 o 3 , 16-25% CaO, 0-5.0% MgO, 3-5% Na 2 O+K 2 O, E glass fiber has the advantages of good processability, good water resistance, and low price, but its dielectric constant is high, about 6.7, and its dielectric loss is large, greater than 10 -3 , cannot meet the requirements of high density and high-speed information processing

The composition of D glass fiber is: 72-76% SiO 2 , 0~5% Al 2 o 3 , 20-25% B 2 o 3 , 3~5% Na 2 O+K 2 O, its dielectric constant is about 4.1, and its dielectric loss is 8×10 -4 Or so, but D glass fiber has the following disadvantages: (1) Compared with E glass fiber, D glass fiber has a higher content of SiO 2 , leading to poor drilling performance of D glass fiber reinforced laminates, which is not conducive to subsequent processing; (2) D glass fiber has a high glass softening point and poor melting property, and it is easy to produce veins and air bubbles, resulting in difficulties in drawing operations. There are many broken glass fibers in the silk process, so the productivity and workability are very poor, the production cost is high, and it is not easy to produce on a large scale; (3) D glass fiber has a very high melting temperature and drawing temperature, generally at 1400 Above ℃, the quality requirements of the kiln are very strict, which will reduce the life of the kiln; (4) D glass fiber has poor water resistance, and it is easy to cause the fiber and resin to peel off

[0007] The Chinese patent document with the application number CN200610166224.5 discloses a low dielectric constant glass fiber, which consists of 50-60% SiO 2 , 6-9.5% Al 2 o 3 , 30.5-35% B 2 o 3 , 0-5% CaO, 0-5% ZnO, 0.5-5% TiO 2 , among them, ZnO replaces

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