Packing contained polytetrafluoroethylene composite material, sheet and circuit board containing same

A polytetrafluoroethylene and composite material technology, applied in circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of reduced material strength, low tensile strength, insufficient strength, etc., to achieve uniform distribution, low dielectric Effects of Electric Constant and Dielectric Loss

Active Publication Date: 2017-07-07
GUANGDONG SHENGYI SCI TECH
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention uses porous film as raw material, its own strength is not enough, and because the fluffy degree of the film is not enough, it is relatively difficult for powder filler to enter its pores
[0010] However

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packing contained polytetrafluoroethylene composite material, sheet and circuit board containing same
  • Packing contained polytetrafluoroethylene composite material, sheet and circuit board containing same
  • Packing contained polytetrafluoroethylene composite material, sheet and circuit board containing same

Examples

Experimental program
Comparison scheme
Effect test

preparation example

[0095] A polytetrafluoroethylene non-woven fabric is prepared by a melt blown method (refer to the preparation method of a non-woven fabric in the patent CN102333913). That is, use a single-screw extruder (caliber 30mm, L / D=24) to melt polytetrafluoroethylene composite resin (C-88AXP, manufactured by Asahi Glass, Japan) and introduce it into a special mold with a flow adjustment structure and a heating air introduction structure, and then From the spinning nozzle on the die (with 10 circular molten resin discharge holes (inner diameter 400 μm) and slit-shaped gas discharge holes (width 1 mm), these molten resin discharge holes are arranged in a row with an effective width of 5 cm, so The above-mentioned gas ejection holes can eject heated air parallel to the arrangement direction, thereby applying tensile stress to the molten resin. ), stretched to form fibers. And the fibers are collected on the surface of the film substrate to form a non-woven fabric to be finished with a wi...

Embodiment 1

[0103] The sheet-shaped polytetrafluoroethylene nonwoven fabric A is immersed in spherical silica powder slurry (spherical silica powder particle diameter D90 is about 3 μ m, D50 is about 1 μ m, and the slurry is 75% methyl ethyl ketone suspension), Then pass through the gap of 0.15mm, scrape off the surface slurry, dry off the solvent, then soak again, pass through the gap and dry off the solvent, repeat three times. Dry the non-woven fabric impregnated with the slurry at 155°C for 5 minutes in a blast oven, beat the dried non-woven fabric to remove the filler on the surface, and obtain a polytetrafluoroethylene resin composite material containing filler. Then stack 6 sheets of polytetrafluoroethylene resin composite materials containing fillers, and copper foil coated with silicone grease on both sides (the smooth side faces the non-woven fabric) as a release film, at 380 ° C, in a vacuum environment, in an electric heating press Medium-heat pressing for 1 hour to obtain a p...

Embodiment 2

[0109] This comparative example 3 is the embodiment 2 of CN102260378, specifically as follows:

[0110] The polytetrafluoroethylene dispersion emulsion with a solid content of 60% was adjusted to a viscosity of 15 mPa·s (20° C.) with deionized water, and then the pH was adjusted to 11 with ammonia water, and stirred and mixed evenly. Add fused silica powder (the weight ratio of microsilica powder and PTFE is 1:1) into the above emulsion, and stir to disperse the silica uniformly in the emulsion to obtain an impregnable glue.

[0111] Impregnate the ePTFE film with a thickness of 300 μm and a porosity of 95% prepared by the expansion stretching method with the above-mentioned adjusted glue, and then send it to an oven to bake at 280 ° C to remove moisture and additives (emulsifier, dispersant) , Made into a polytetrafluoroethylene composite material containing fillers, its thickness is 308μm, and there is no crack.

[0112]Then stack 6 sheets, cover both sides with 18 μm coppe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Thicknessaaaaaaaaaa
Pore diameteraaaaaaaaaa
Login to view more

Abstract

The invention belongs to the technical field of circuit boards and relates to a packing contained polytetrafluoroethylene composite material, a sheet and a circuit board. The packing contained polyarylether or polyaryl sulfide composite material includes a three-dimensional net-structure material and packing spread in pores of the three-dimensional net-structure material, and the three-dimensional net-structure material is mainly formed by mutual lapping or adhering polytetrafluoroethylene fibers. By the arrangement of the packing contained composite material, the sheet and the circuit board which are obtained are isotropic in X and Y directions in dielectric constant, low in the dielectric constant and dielectric loss and good mechanical performance.

Description

technical field [0001] The invention belongs to the technical field of circuit substrates, and relates to a filler-containing polytetrafluoroethylene composite material, a sheet and a circuit substrate containing the same. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operating signal tends to be higher in frequency, and the frequency of use of electronic products continues to increase, requiring substrate materials. The dielectric constant is getting lower and lower, the dielectric loss is required to be smaller and smaller, and the uniformity of the substrate dielectric constant is required to be better. [0003] At present, high-frequency and high-speed circuit substrates use low-dielectric constant resins to obtain good high-frequency performance. These low-dielectric consta...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L27/18C08K3/36C08K3/24B32B27/30B32B37/10B32B37/06H05K1/03
CPCB32B27/304B32B37/06B32B37/10B32B2457/00C08J5/18C08J2327/18C08K3/24C08K3/36C08L2203/16C08L2203/20H05K1/0373C08L27/18
Inventor 孟运东杨中强苏民社江恩伟
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap