Resin composition and prepreg and laminated board fabricated by using same

A technology of resin composition and prepreg, which is applied in the field of resin composition, prepreg and laminate, can solve the problems of no halogen-free flame retardant, toxic hydrogen halide gas, harm to human health, etc., and achieve excellent dielectric properties, low Effects of dielectric constant and excellent heat and humidity resistance

Active Publication Date: 2014-09-10
SHENGYI TECH SUZHOU
View PDF4 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional printed circuit substrate materials mainly use halides to achieve the purpose of flame retardancy. When a circuit substrate containing halides is ignited and burned, not only the amount of smoke is large, the smell is unpleasant, b

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition and prepreg and laminated board fabricated by using same
  • Resin composition and prepreg and laminated board fabricated by using same
  • Resin composition and prepreg and laminated board fabricated by using same

Examples

Experimental program
Comparison scheme
Effect test

Example

[0052] Examples and comparative examples:

[0053] Examples 1 to 3 are the synthesis of the nitrogen-containing and phosphorus-containing polyfunctional phenolic compound of the present invention. Examples 4 to 8 are the synthesis of active ester resin. Examples 9 to 14 and Comparative Examples 1 to 3 are the preparation and physical properties of the resin composition. Evaluation. Unless otherwise specified below, "parts" means "parts by weight", and "%" means "% by weight".

Example Embodiment

[0054] Example 1

[0055] Put N-(4-hydroxyphenyl)maleimide (50g, 0.265mol), phenol (50g, 0.532mol) and oxalic acid (5g) into a three-necked flask equipped with thermometer, condenser and stirrer, and mix After stirring, place it in a constant temperature water bath at 70℃; then, under stirring, add formaldehyde solution (55mL, 37% formaldehyde aqueous solution, phenol / aldehyde ratio 1 / 0.8) to the flask dropwise over 0.5 hours; After the formaldehyde is formed, the temperature is maintained at 70°C and stirred for 15 hours; then, the reaction product is dissolved and diluted with 200 mL of acetone, and then the reaction product is precipitated with a 40% methanol aqueous solution; the above dissolution-precipitation operation is repeated 3 to 5 times, It is filtered, separated, and dried to obtain a pure nitrogen-containing polyfunctional phenol compound; then, take the above-synthesized nitrogen-containing polyfunctional phenol compound (50g) and 9,10-dihydro-9-oxa-10-phosphinphe...

Example Embodiment

[0056] Example 2

[0057] Put N-(4-hydroxyphenyl)maleimide (50g, 0.265mol), bisphenol A (50g, 0.201mol) and oxalic acid (5g) into a three-necked flask equipped with thermometer, condenser and stirrer. , After mixing and stirring, place in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (35mL, 37% formaldehyde aqueous solution, phenol / aldehyde ratio 1 / 0.8) to the flask dropwise over 0.5 hours; After adding the formaldehyde, keep the temperature at 70°C and stir for 15 hours; then, dissolve and dilute the reaction product with 200 mL of acetone, and then precipitate the reaction product with a 40% methanol aqueous solution; repeat the above dissolution-precipitation operations 3~5 Next, it was filtered, separated, and dried to obtain a pure nitrogen-containing polyfunctional phenol compound; then, the nitrogen-containing polyfunctional phenol compound (50g) synthesized above was taken together with 9,10-dihydro-9-oxa-10- Phosphophenanthre...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Epoxy equivalentaaaaaaaaaa
Softening pointaaaaaaaaaa
Login to view more

Abstract

The invention discloses a resin composition, comprising the following raw materials in parts by weight: (a) 40-60 parts of active ester resin; (b) 30-60 parts of epoxy resin; (c) 10-50 parts of cyanate ester resin. The practical application proves that the laminated board prepared by the resin composition disclosed by the invention has excellent dielectric properties. Compared with the prior art, the dielectric constant and the dielectric loss are greatly reduced, sufficiently low dielectric constant and tangent low dielectric loss can be expressed in the high-speed and high-frequency signal transmission processes, a significant effect is obtained, and the resin composition has positive practical significance.

Description

technical field [0001] The invention relates to a resin composition, and a prepreg and a laminate made of the resin composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of resin composition, the printed circuit board material that uses this resin composition to make can show sufficiently low low dielectric constant and low dielectric loss tangent in the high-speed, high-frequency sign...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L63/00C08L79/04C08G59/40C08J5/24B32B27/04B32B15/092
Inventor 何继亮马建崔春梅肖升高
Owner SHENGYI TECH SUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap