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Resin composition and prepreg and laminated board fabricated by using same

A technology of resin composition and prepreg, which is applied in the field of resin composition, prepreg and laminate, can solve the problems of no halogen-free flame retardant, toxic hydrogen halide gas, harm to human health, etc., and achieve excellent dielectric properties, low Effects of dielectric constant and excellent heat and humidity resistance

Active Publication Date: 2014-09-10
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional printed circuit substrate materials mainly use halides to achieve the purpose of flame retardancy. When a circuit substrate containing halides is ignited and burned, not only the amount of smoke is large, the smell is unpleasant, but also toxic and corrosive hydrogen halides will be released. Gas, not only pollutes the environment, but also endangers human health
However, none of the active ester resins disclosed above involves research on halogen-free flame retardancy.

Method used

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  • Resin composition and prepreg and laminated board fabricated by using same
  • Resin composition and prepreg and laminated board fabricated by using same
  • Resin composition and prepreg and laminated board fabricated by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment and

[0052] Embodiment and comparative example:

[0053] Examples 1-3 are the synthesis of nitrogen-containing and phosphorus-containing multifunctional phenolic compounds of the present invention, Examples 4-8 are the synthesis of active ester resins, and Examples 9-14 and Comparative Examples 1-3 are the preparation and physical properties of the resin composition evaluate. Unless otherwise specified below, "parts" represent "parts by weight", and "%" represent "% by weight".

Embodiment 1

[0055] Drop into N-(4-hydroxyphenyl)maleimide (50g, 0.265mol), phenol (50g, 0.532mol) and oxalic acid (5g) in the there-necked flask that thermometer, condensing tube, stirrer are installed, mix After stirring evenly, place it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (55mL, 37% formaldehyde aqueous solution, the ratio of phenol / aldehyde is 1 / 0.8) dropwise to the flask for 0.5 hours; After formaldehyde, maintain the temperature of 70°C and stir for 15 hours; then, dissolve and dilute the reaction product with 200mL acetone, and then precipitate the reaction product with 40% methanol aqueous solution; repeat the above dissolution-precipitation operation 3 to 5 times, It is filtered, separated, and dried to obtain pure nitrogen-containing polyfunctional phenolic compound; then, take the above-mentioned synthetic nitrogen-containing polyfunctional phenolic compound (50 g), and -10-Oxa (24g, 0.116mol) was added to a three-necked ...

Embodiment 2

[0057] Drop into N-(4-hydroxyphenyl)maleimide (50g, 0.265mol), bisphenol A (50g, 0.201mol) and oxalic acid (5g) in the there-necked flask that thermometer, condensing tube, stirrer are installed After mixing and stirring evenly, place it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (35mL, 37% formaldehyde aqueous solution, the ratio of phenol / aldehyde is 1 / 0.8) to the flask dropwise for 0.5 hours; After adding formaldehyde, maintain the temperature of 70°C and stir for 15 hours; then, dissolve and dilute the reaction product with 200mL acetone, and then precipitate the reaction product with 40% methanol aqueous solution; repeat the above dissolution-precipitation operation for 3-5 Once, it was filtered, separated, and dried to obtain a pure nitrogen-containing polyfunctional phenolic compound; Phosphenanthrene-10-oxa (26g, 0.116mol) was added to a three-necked flask equipped with a thermometer, condenser, and stirrer, and 200mL ...

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Abstract

The invention discloses a resin composition, comprising the following raw materials in parts by weight: (a) 40-60 parts of active ester resin; (b) 30-60 parts of epoxy resin; (c) 10-50 parts of cyanate ester resin. The practical application proves that the laminated board prepared by the resin composition disclosed by the invention has excellent dielectric properties. Compared with the prior art, the dielectric constant and the dielectric loss are greatly reduced, sufficiently low dielectric constant and tangent low dielectric loss can be expressed in the high-speed and high-frequency signal transmission processes, a significant effect is obtained, and the resin composition has positive practical significance.

Description

technical field [0001] The invention relates to a resin composition, and a prepreg and a laminate made of the resin composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of resin composition, the printed circuit board material that uses this resin composition to make can show sufficiently low low dielectric constant and low dielectric loss tangent in the high-speed, high-frequency sign...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/04C08G59/40C08J5/24B32B27/04B32B15/092
Inventor 何继亮马建崔春梅肖升高
Owner SHENGYI TECH SUZHOU
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