Light-absorbing layer system, the production thereof and sputter target suitable therefor

A technology for sputtering target materials and light-absorbing layers, which is applied in the production of the layer system and the field of sputtering target materials, and can solve problems such as toxic Cr-Vl compounds

Active Publication Date: 2015-09-16
MATERION ADVANCED MATERIALS GERMANY GMBH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] Furthermore, the Cr-based "black matrix layers" used especially up to the 5th generation substrates have the disadvantage of the possible formation of toxic Cr-Vl compounds during wet chemical etching

Method used

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  • Light-absorbing layer system, the production thereof and sputter target suitable therefor
  • Light-absorbing layer system, the production thereof and sputter target suitable therefor
  • Light-absorbing layer system, the production thereof and sputter target suitable therefor

Examples

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Effect test

example 1

[0096] With an average grain size of 25 μm, consisting of 89.3% by weight Nb 2 o 4.99 and a powder mixture consisting of 10.7 wt% Mo were vigorously mixed in a swing mixer for 1 hour, thereby 2 o 4.99 A fine and monodisperse distribution of Mo particles is produced in . Subsequently, the mixture was filled into a graphite mold having a diameter of 75 mm and a height of 15 mm. The round billets were densified to greater than 85% of theoretical density by hot pressing at 1200 °C and 30 MPa under reducing conditions. The resulting structure consists of Nb 2 o 4.99 Composition of a matrix in which Mo particles having an average grain size of 25 μm are embedded.

[0097] A similar method was used to produce Nb with 64 wt% 2 o 4.99 and a second sputtering target of 36% by weight Mo. In this case, Mo powders with a grain size of <10 μm are selected for producing a particularly homogeneous Mo distribution.

[0098] The sputtering target has a specific resistance of less than...

example 2

[0129] In order to examine the effect of oxygen stoichiometry on optical and electrical properties, in another test a sputtering target of metallic niobium was incorporated into an in-line sputtering system (code: A700V) from Leybold, and At different partial pressures of oxygen through an alkali-free glass (AF32, size 50x50mm) with a layer thickness of about 100 nm 2 ) to produce a niobium oxide layer by reactive DC sputtering.

[0130] exist Figure 6 In the diagram of , the development of the generator voltage U in [V] (upper curve U) is plotted on the left ordinate axis and the dependence of the oxygen supply q in [sccm] on the right ordinate O2 The oxygen partial pressure p in the unit of [mPa] in the sputtering chamber O2 (lower curve p O2 ). Thus, an oxygen supply in the range of 18-20 sscm, equal to an oxygen partial pressure of about 60-70 mPa, leads to saturation (full oxidation mode) and to a maximum value of the generator voltage. Thus, the metal target used f...

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Abstract

The invention relates to a light absorbing layer system consisting of at least two layers, one of which is an anti-reflective layer which faces an observer and which is made from a dielectric material, and at least one other layer is an absorbing layer facing away from the observer and is made from an oxide or from an oxynitride having a sub-stoichiometric oxygen content. Said layer system has a wavelength range of between 380 - 780nm including a visual transmission Tv of less than 1% and a visual reflection Rv of less than 6% and is characterised by a kappa absorption index of at least 0.70 with a wavelength of 550 mn.

Description

technical field [0001] The invention relates to a light-absorbing layer system consisting of at least two layers, one of which is an antireflection layer made of a dielectric material facing the observer and at least one other layer an absorbing layer facing away from the observer , the absorber layer is made of an oxide or oxynitride having a substoichiometric oxygen content. [0002] Furthermore, the invention relates to a method for producing the layer system, which comprises depositing an absorber layer by DC or MF sputtering of a sputtering target in a sputtering environment containing a rare gas. [0003] Furthermore, the invention relates to a sputtering target suitable for carrying out the method. Background technique [0004] Light-absorbing layer systems are produced, for example, by depositing successive layers by cathodic atomization (sputtering). The atoms or compounds of the solid (sputtering target) are ejected here by bombardment with energetic ions, genera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B1/116G02B5/22G02B5/00F24J2/46F24J2/48C23C14/34
CPCG02B1/116G02F1/133512G02B5/22G02B5/003F24J2/487C23C14/3414F24J2/4652Y02E10/40F24S70/225F24S70/25F24S70/30G02B1/11
Inventor 马丁·施洛特阿尔伯特·卡斯特纳马库斯·舒尔特海斯詹斯·瓦格纳扎比内·施奈德-贝茨伯恩德·西斯泽卡威尔玛·德瓦尔德
Owner MATERION ADVANCED MATERIALS GERMANY GMBH
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