Carbon-nanotube-based transparent antistatic pressure-sensitive adhesive structure and application thereof

Abstract

The utility model discloses a transparent anti-electrostatic pressure-sensitive adhesive structure based on carbon nanotubes and an anti-electrostatic protecting membrane. The pressure-sensitive adhesive structure comprises a carbon nanotube transparent conductive network and a pressure-sensitive adhesive layer which is overlapped with the carbon nanotube transparent conductive network. The anti-electrostatic protecting membrane comprises a base material, the carbon nanotube transparent conductive network covering one side of the base material, and the pressure-sensitive adhesive layer covering the carbon nanotube transparent conductive network, has excellent anti-electrostatic property, has electrostatic voltage less than 100V when being rapidly peeled off from a base body such as glass and plastic, and can effectively protect the security and the cleanness of electronic equipment; meanwhile the carbon nanotube transparent conductive network has great porosity, does not affect the combination of the base material with the pressure-sensitive adhesive, is applicable to various normal pressure-sensitive adhesives, is easy to prepare and low in cost, and has a great application market.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive layer of a protective film, in particular to a transparent antistatic pressure-sensitive adhesive layer based on a carbon nanotube conductive network and a preparation method thereof, which can be applied to the protection of electronic products. Background technique [0002] At present, in the process of production, storage and transportation of electronic products, the surface protection of products is indispensable. On the one hand, this protection can prevent the surface of the product from being worn, and on the other hand, it can prevent dust from adhering to the surface of the product. As a protective film used for electronic products, in addition to requiring it to be easily attached to the surface of the product, in order to prevent excessive electrostatic voltage that may even endanger the safety of electronic products during the process of tearing off the protective film, the protective ...

AI Technical Summary

Problems solved by technology

The former needs to add conductive materials to the pressure-sensitive adhesive, which will not only affect the adhesive performance of the pressure-sensitive adhesive, but also cause conductive substances to remain on the surface of the product, which greatly limits the selectivity of the pressure-sensitive adhesive.

Although the latter will not have such problems, because the conductive substances used are often in the form of particles, and to ensure that these particles form a continuous conductive network, it is necessary to use a considerable amount of conductive substances, which will affect both the pressure-sensitive adhesive and the substrate. The bonding strength of the material will also cause waste of conductive materials, which is not conducive to reducing costs; at the same time, too much conductive material will also affect the transparency of the protective film, which is not conducive to testing the product without tearing off the protective film

Images