Steel disc strip for diode lead and production technology of steel disc strip

Abstract

The invention relates to steel and a production method of the steel, in particular to a steel disc strip for a diode lead and a production technology of the steel disc strip. The steel disc strip comprises, by weight, 0.03% to 0.06% of C, 0.02% to 0.05% of Si, 0.18% to 0.28% of Mn, larger than or equal to 0.020% of Al, not larger than 0.015% of P, not larger than 0.015% of S, not larger than 0.20% of Cr or Ni or Cu, not larger than 10ppm of Ca, and the balanced Fe and inevitable impurities. The preparation method comprises a converter refining working procedure, an RH carbon-deoxidization working procedure, an LF refining working procedure, a continuous casting working procedure and a rolling working procedure. The technical problems that at present, the steel disc strip for the diode lead is poor in drawing property, cold machining cracks are prone to being generated, the purity is not high, and the quality is unstable are solved.

Description

technical field [0001] The invention relates to a steel and a production method thereof, in particular to a steel wire rod for a diode lead wire and a production process thereof. Background technique [0002] Diode leads are the metal conductors in the diode that connect to the chip. Usually, the material of the diode lead is oxygen-free copper, alloy copper or copper-clad steel wire, and the material is required to have high purity, good electrical conductivity, good processing performance, good plasticity index, and appropriate strength. [0003] Due to the relative scarcity of copper resources, the price of copper has remained high for a long time. Therefore, the use of oxygen-free copper and alloy copper to make diode leads will greatly increase the cost of diode manufacturers. In order to reduce the production costs of diode companies and improve product competitiveness, diodes The lead manufacturer adopts a composite wire with more than 90% of the copper layer wrapped...

AI Technical Summary

Problems solved by technology

Its components and weight percentages are: [C]: 0.04% ~ 0.08%, [Si] 0.05% ~ 0.09%, [Mn] ≤ 0.60%, [Al] ≥ 0.020%, [P] ≤ 0.020%, [S ]≤0.015%, but there are still some technical problems: ①The content of C, Si, Mn is high, the strength of the wire rod is high, and the processing cracking phenomenon often occurs during the processing of the user; The drawing performance is not ideal, and the minimum drawing value is only 0.5mm; ③The purity of the wire rod is not high, and the content and type of non-metallic inclusions, gas content, etc. will cause low electrical conductivity, which is less than 13%; ④ The casting is not smooth, if no calcium treatment process is used, nodules will appear; if the calcium treatment process is used, the inclusions will exceed the standard, resulting in extremely unstable quality, therefore, it can only be used to produce lower-level diode leads

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