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A kind of conductive silver glue and its preparation method and application

A technology of conductive silver glue and nano-silver powder, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of high resistivity adhesion, high resistivity of the silver layer, and failure of the film layer to achieve good resistance Shear strength, pattern edge sharp effect

Active Publication Date: 2017-03-01
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, although the thermosetting conductive silver glue has good adhesion and electrical properties after the film layer is cured, the silver layer bursts and cracks after welding, and the film layer is completely invalid;
[0004] As a low-resistivity and high-adhesion low-temperature-curing adhesive paste, conductive silver glue has a mature application process and a large application market for tantalum capacitors and other products, but the current domestic technology accumulation and research and development in this area The ability is far behind the development of the microelectronics industry. At present, the resistivity of the silver layer after curing of the ordinary adhesive silver paste is relatively high. After dispensing with an automatic dispensing machine, the drawing phenomenon of the paste is obvious, the process performance is poor, and the edge of the pattern is blurred. and other bad phenomena

Method used

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  • A kind of conductive silver glue and its preparation method and application
  • A kind of conductive silver glue and its preparation method and application
  • A kind of conductive silver glue and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 28 parts of conductive silver glue matrix;

[0028] 10 parts of micron silver powder;

[0029] Nano silver powder 62 parts.

[0030] As preferably, in parts by weight, the conductive silver colloid matrix includes the following components:

[0031]

[0032] In a constant temperature water bath at 80-90°C, add the flexible additive into the dispersant and heat and stir until it is completely dissolved. Finally, slowly add the curing agent, coupling agent, and epoxy resin, stir and heat until it is completely dissolved, and obtain a conductive material after cooling. Silver colloid matrix: mixing the micron silver powder and the nano silver powder to obtain mixed silver powder, mixing the mixed silver powder with the conductive silver colloid matrix, grinding and dispersing, rolling into a uniform paste-like object, and obtaining the conductive silver colloid .

Embodiment 2

[0034] Conductive silver glue matrix 35 parts;

[0035] 7 parts of micron silver powder;

[0036] Nano silver powder 58 parts.

[0037] As preferably, in parts by weight, the conductive silver colloid matrix includes the following components:

[0038]

[0039] In a constant temperature water bath at 80-90°C, add the flexible additive into the dispersant and heat and stir until it is completely dissolved. Finally, slowly add the curing agent, coupling agent, and epoxy resin, stir and heat until it is completely dissolved, and obtain a conductive material after cooling. Silver colloid matrix: mixing the micron silver powder and the nano silver powder to obtain mixed silver powder, mixing the mixed silver powder with the conductive silver colloid matrix, grinding and dispersing, rolling into a uniform paste-like object, and obtaining the conductive silver colloid .

Embodiment 3

[0041] 50 parts of conductive silver glue matrix;

[0042] 40 parts of micron silver powder;

[0043] Nano silver powder 10 parts.

[0044] As preferably, in parts by weight, the conductive silver colloid matrix includes the following components:

[0045]

[0046] In a constant temperature water bath at 80-90°C, add the flexible additive into the dispersant and heat and stir until it is completely dissolved. Finally, slowly add the curing agent, coupling agent, and epoxy resin, stir and heat until it is completely dissolved, and obtain a conductive material after cooling. Silver colloid matrix: mixing the micron silver powder and the nano silver powder to obtain mixed silver powder, mixing the mixed silver powder with the conductive silver colloid matrix, grinding and dispersing, rolling into a uniform paste-like object, and obtaining the conductive silver colloid .

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Abstract

The invention discloses a conductive silver glue and its preparation method and application. The conductive silver glue comprises the following components in parts by weight: 10-50 parts of conductive silver glue matrix; 1-40 parts of micron silver powder; nano-silver powder 10 to 60 servings. The preparation method includes the following steps: (1) under a constant temperature water bath of 80-90°C, add the flexible additive into the dispersant, heat and stir until completely dissolved, and finally slowly add the curing agent, coupling agent and epoxy resin , stirred and heated until completely dissolved, and cooled to obtain a conductive silver colloid matrix; (2) mixing the micron silver powder and the nano silver powder to obtain a mixed silver powder, mixing the mixed silver powder with the conductive silver colloid matrix, grinding and dispersing, and rolling Become uniform pasty object, obtain described conductive silver glue. The cured silver layer has a lower resistivity, and the slurry has no stringing phenomenon after dispensing with an automatic dispensing machine, and the edge of the pattern is clear.

Description

technical field [0001] The invention belongs to the technical field of electronic production, and in particular relates to a conductive silver glue and its preparation method and application. Background technique [0002] Conductive silver glue is widely used in electronics, information, electroplating and other industries, and is mainly used for conductive bonding between objects. Conductive silver glue is widely used in electromagnetic shielding, electroplating pre-coating, tantalum electrolytic capacitor electrodes and other fields. Conductive silver glue is also widely used in substrates such as flexible circuit boards (PEI, PI) to form conductive lines, contacts and carbon film potentiometers. Electrodes, as well as conductive bonding, electrode lead-out and SMT technology for LED, LCD, quartz resonator, chip and VFD. With the development trend of light, small, thin, low cost, and high integration in the microelectronics industry, the application range of this type of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/00C09J183/04C09J109/02C09J11/04C09J9/02
Inventor 郭明亚庞锦标韩玉成李程峰张秀杜玉龙何创创廖东
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS