Polycrystalline diamond compact with excellent electric conductivity and method for manufacturing polycrystalline diamond compact
A technology for conductive diamond and diamond polycrystalline, applied in the field of diamond polycrystalline composite sheet and its preparation, can solve the problems of inability to perform electrical discharge machining, lack of electrical conductivity, difficult welding processing, etc., and achieves reduction of abnormal growth and good electrical conductivity. , the effect of reducing residual
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Embodiment 1
[0023] A diamond polycrystalline composite sheet with good electrical conductivity comprises a diamond polycrystalline layer and a cemented carbide substrate. The diamond polycrystalline layer is composed of the following raw materials in weight percentage: 75% of diamond powder with a particle size of 0.5-40 μm, hard 20% high-quality alloy powder and 5% nano-metal bond, and the diamond powder is composed of the following raw materials in weight percentage: 60% boron-free diamond powder, 40% boron-containing diamond powder with a boron element content of 0.0005-0.015%; Cemented carbide powder is composed of the following raw materials in weight percentage: 85% WC powder, 12% Co powder, 2% Ti powder and 1% TaC powder, wherein the particle size of WC powder and Co powder is 1-3μm, Ti The particle size of TaC powder and TaC powder is 1.5-2 μm; the binder is composed of the following raw materials in weight percentage: Co powder 97%, Ni powder 2%, W powder 0.9% and B powder 0.1%, w...
Embodiment 2
[0031] A diamond polycrystalline composite sheet with good electrical conductivity comprises a diamond polycrystalline layer and a cemented carbide substrate. The diamond polycrystalline layer is composed of the following raw materials in weight percentage: 85% of diamond powder with a particle size of 0.5-40 μm, hard 12% high-quality alloy powder and 3% nano-metal bond, and the diamond powder is composed of the following raw materials in weight percentage: 70% boron-free diamond powder, 30% boron-containing diamond powder with a boron content of 0.0005-0.015%; Cemented carbide powder is composed of the following raw materials in weight percentage: WC powder 90%, Co powder 8%, Ti powder 1.5% and TaC powder 0.5%, wherein the particle size of WC powder and Co powder is 1-3μm, Ti The particle size of TaC powder and TaC powder is 1.5-2 μm; the binder is composed of the following raw materials in weight percentage: Co powder 99%, Ni powder 0.45%, W powder 0.5%, B powder 0.05%, where...
Embodiment 3
[0039] A diamond polycrystalline composite sheet with good electrical conductivity comprises a diamond polycrystalline layer and a cemented carbide substrate. The diamond polycrystalline layer is composed of the following raw materials in weight percentage: 82% of diamond powder with a particle size of 0.5-40 μm, hard 14% high-quality alloy powder and 4% nano-metal bond, and the diamond powder is composed of the following raw materials in weight percentage: 66% of boron-free diamond powder, 34% of boron-containing diamond powder with a boron content of 0.0005-0.015%; Cemented carbide powder is composed of the following raw materials in weight percentage: WC powder 87%, Co powder 10%, Ti powder 2% and TaC powder 1%, wherein the particle size of WC powder and Co powder is 1-3 μm, Ti The particle size of TaC powder and TaC powder is 1.5-2 μm; the binder is composed of the following raw materials in weight percentage: Co powder 98%, Ni powder 1.5%, W powder 0.4% and B powder 0.1%, ...
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