5results about How to "Increase the volume ratio" patented technology

The application provides a high-density fan-out packaging structure and a preparation method thereof. The method comprises the following steps: providing a silicon substrate, pasting a passive surface of a chip to be packaged on the silicon substrate; plastic packaging the chip to be packaged to obtain a plastic packaging layer, wherein a top surface of the plastic packaging layer is at the same horizontal plane as a top end of an interconnection column on an active surface of the chip to be packaged; preparing a multilayer wiring layer on the top surface of the plastic packaging layer, so that the multilayer wiring layer and the interconnection column are interconnected; preparing a welding member on the multilayer wiring layer, which is in conductive connection with a packaging interconnection body; and thinning the silicon substrate to obtain a high-density fan-out packaging structure. The application solves the problem of chip warping in the preparation of the high-density fan-out packaging structure in the prior art.

The utility model discloses a limiting structure and an energy storage system, and relates to the technical field of batteries, and the limiting structure is used for limiting a battery cell group; the limiting structure comprises at least two plate bodies arranged in the first direction, and every two adjacent plate bodies are connected through a mortise and tenon joint structure. The plate body is provided with a first face, a second face, a third face and a fourth face, the first face and the second face are oppositely arranged in the first direction, the third face and the fourth face are oppositely arranged between the first face and the second face, and the sizes of the first face and the second face are smaller than those of the third face and the fourth face. The first face or the second face of any plate body is connected with the second face or the first face of the adjacent plate body through a mortise and tenon joint structure. The plate bodies are spliced in a tenon-and-mortise matching mode, the problems that a structure for limiting the battery cell set is inconvenient to connect and cannot be stably connected are effectively solved, space occupied by the limiting structure can be reduced, the space utilization rate and the system electric quantity of the energy storage system are increased, and the energy storage system has the electric quantity competition advantage.

This invention belongs to the field of magnetic resonance imaging technology, and particularly relates to a multi-voxel spectral reconstruction method and system with ROI adaptive capability. The method includes acquiring a structural image of the scanned object; performing multi-voxel spectral scanning on the scanned object to acquire K-space spectral data; based on the location information of the region of interest (ROI) and interference regions, combined with the point spread function of the spectral scanning system; performing target reconstruction processing on the K-space spectral data according to the optimal voxel localization parameters to generate reconstructed spectral data; and extracting spectral information corresponding to the ROI from the reconstructed spectral data. This invention, through a strategy of multiple adaptive reconstructions in a single scan, can independently calculate the optimal localization parameters and perform targeted reconstruction for each ROI within the field of view based on the same set of K-space data. This allows different anatomical structures to obtain the maximum volume proportion in their dedicated reconstructed voxels without compromising the localization effect between different regions.

This invention provides a direct-write printing method for preparing a three-dimensional porous polyimide-hollow glass microsphere composite material and the resulting material. The method includes: S1 preparing a soluble polyimide-hollow glass microsphere composite material; S2 preparing a direct-write printing composite ink; S3 direct-write printing and humidification pre-gelling; S4 solvent-inducing phase transition curing to create pores; and S5 low-temperature drying to obtain the finished product. This invention utilizes chemical bonding to construct an organic-inorganic cross-linked network, avoiding interfacial gaps and filler sedimentation. It eliminates the need for photosensitizers and high-temperature treatment, resulting in a simple process, high molding precision, and low shrinkage. The prepared composite material possesses a nanoscale three-dimensional interconnected porous structure with strong interfacial bonding, lightweight yet high strength, and excellent thermal insulation properties. It effectively solves the problems of easy collapse, uneven pore size, and complex processes in existing 3D printing of porous polyimide materials, making it suitable for applications such as thermal insulation, sound absorption, and catalyst support.