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Flip-chip LED packaging structure and manufacturing method

A technology of LED packaging and manufacturing method, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that restrict the development of LED miniaturization, the volume of packaged products is large, and restrict the application of LEDs, and achieve small package size, low packaging cost, The effect of high production efficiency

Active Publication Date: 2018-10-19
HUATIAN TECH KUNSHAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current packaging form of LED flip chips is usually carried out in a single form, that is, the cut LED flip chips are mounted on the substrate (such as metal brackets, lead frames, ceramic substrates, metal substrates) one by one, and then metalized one by one. Lead interconnection, glue dispensing one by one; since almost all processes are carried out on a single piece, the production efficiency is relatively low and the production cost is high, which seriously restricts the application of LED
Moreover, the packaged product formed by this single-chip package is bulky, which restricts the need for the development of LED miniaturization.

Method used

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  • Flip-chip LED packaging structure and manufacturing method
  • Flip-chip LED packaging structure and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] like figure 2 As shown, a flip-chip LED packaging structure includes an LED flip-chip 1, and the LED flip-chip has an electrode surface 101, a light-emitting surface 102 opposite to the electrode surface, and a peripheral side surface 103;

[0084] The electrode surface is not wrapped with an upper surrounding layer, and the exposed electrode 9 of the LED flip chip is provided with a solder bump 7;

[0085] The light-emitting surface is wrapped with a lower surrounding layer, and the lower surrounding layer is a single-layer structure. The single-layer structure is a layer of fluorescent layer 2. The fluorescent layer is used to convert the light emitted by the chip from fluorescent materials to white light. The fluorescent layer can be made of Phosphor powder, or transparent glue mixed with phosphor powder, or a dry film made of fluorescent material.

[0086] Optionally, the single-layer structure can also be a layer of fluorescent glass fiber composite layer 12 . T...

Embodiment 2

[0091] like image 3 As shown, this embodiment 2 includes all the technical features of embodiment 1, the difference is that the electrode surface is wrapped with an upper surrounding layer, the upper surrounding layer is a layer of protective layer 6, and the protective layer is provided with an opening , the opening exposes the electrode 9 of the LED flip chip 1 , and the solder bump 7 is arranged on the electrode. The protective layer can isolate water vapor, air, etc., and avoid corrosion of electrodes or connecting electrode metal materials. The material of the protective layer 6 includes one or more of high molecular polymers such as epoxy resin, silicon oxide, silicon nitride, and plastic packaging materials. kind.

Embodiment 3

[0093] like Figure 4 As shown, this embodiment 3 includes all the technical features of embodiment 2, and the difference is that the light-emitting surface is wrapped with a lower surrounding layer, and the lower surrounding layer has a two-layer structure, and the light transmission is strengthened sequentially from the inside to the outside. layer 3 and fluorescent layer 2; the surrounding side is wrapped with a surrounding layer, and the surrounding layer is a two-layer structure, which is the light transmission strengthening layer 3 and the fluorescent layer 2 in sequence from the inside to the outside. The light-transmitting strengthening layer is used to transmit light and increase the mechanical strength of the chip, and the fluorescent layer is used to convert the side light of the chip from fluorescent material to white light; that is, to realize the function of increasing the mechanical strength of the chip while changing the color of the light-emitting surface and s...

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Abstract

The invention discloses a flip-chip LED packaging structure and a manufacturing method. In the packaging structure, the electrode surface of the LED flip-chip is wrapped with or not wrapped with an upper surrounding layer, and the electrodes of the LED flip-chip are connected with solder bumps; The light-emitting surface and each side are embedded in the lower surrounding layer and the surrounding surrounding layer, which can be a multi-layer or two-layer or single-layer structure; the surrounding surrounding layer is used to adjust the functional application of the chip or increase the mechanical strength of the chip. In order to adjust the color of the light and increase the mechanical strength of the chip, the electrodes are connected to external devices through solder bumps, eliminating the need for silicon substrates and through-silicon holes and other structures. It has simple structure, thinner thickness, good mechanical strength, and smaller package size. And other technical advantages, and can change the light emitting surface and light color, improve the light output rate, and have many functions and applications of the chip. The manufacturing method adopts the flip-chip technology combined with the chip-level packaging method, avoids the through-silicon hole technology in the manufacturing process, has simple manufacturing process, and lower packaging cost.

Description

technical field [0001] The invention relates to a packaging structure and a manufacturing method of an LED flip-chip, in particular to a packaging structure and a manufacturing method of a flip-chip LED. Background technique [0002] As a new type of high-efficiency solid-state light source, light-emitting diode (LED) has a series of advantages such as low operating voltage, low power consumption, stable and reliable performance, and has shown great potential as a lighting source. The structures of commonly used LED packaging chips in the market are: planar structure chips, that is, the positive and negative electrodes of the chip are on the light-emitting surface of the chip; vertical structure chips, that is, the positive and negative electrodes of the chip are distributed on the light-emitting surface of the chip and The two different surfaces of the reflective surface; flip chip, that is, the positive and negative electrodes of the chip are on the reflective surface of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/40
CPCH01L33/405H01L2933/0016H01L33/505H01L33/486H01L33/502H01L33/56H01L2933/0041H01L2933/005H01L2933/0066H01L33/0095H01L33/62
Inventor 万里兮肖智轶沈建树崔志勇翟玲玲钱静娴
Owner HUATIAN TECH KUNSHAN ELECTRONICS