High-viscosity and low-melting-point metal conductive paste and preparation method and application thereof
A low melting point metal, conductive paste technology, applied in metal/alloy conductors, cable/conductor manufacturing, circuits, etc., can solve the problems of large air gap, limited electrical conductivity, low feasibility, etc., to improve electrical conductivity, electrical conductivity Adjustable, easy-to-use effects
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[0026] Example 1
[0027] Example 1 shows a typical application of a high-viscosity low-melting metal conductive paste in the present invention.
[0028] figure 1 It is a schematic diagram of the structure of a metal conductive paste with high conductivity and low melting point applied to electronic components in Example 1. Among them: 1 is conductive paste, 2 is electronic component, 3 is fastening screw.
[0029] In the high-viscosity low-melting metal conductive paste of this embodiment, the low-melting metal is gallium indium tin zinc alloy (alloy mass fraction: Ga 61%, In 25%, Sn 13%, Zn 1%), and the melting point is 8°C. The metal powder is copper powder, the mass fraction accounts for 50% of the mass of the conductive paste, and the particle size is 1 μm.
[0030] When using, firstly coat the high-viscosity low-melting metal conductive paste evenly between the electronic components; then fix it tightly with screws. The electrical conductivity and viscosity of the high-viscos...
Example Embodiment
[0032] Example 2
[0033] figure 1 It is a schematic diagram of the structure of a metal conductive paste with high conductivity and low melting point applied to electronic components in Example 1. Among them: 1 is conductive paste, 2 is electronic component, 3 is fastening screw.
[0034] In the high-viscosity low-melting metal conductive paste of this embodiment, the low-melting metal is gallium indium tin zinc alloy (alloy mass fraction: Ga 61%, In 25%, Sn 13%, Zn 1%), and the melting point is 8°C. The metal powder is copper powder, the mass fraction accounts for 0.01% of the conductive paste, and the particle size is 1 mm. When using, firstly coat the high-viscosity low-melting metal conductive paste evenly between the electronic components; then fix it tightly with screws. The electrical conductivity and viscosity of the high-viscosity and low-melting-point metal conductive paste of the present invention can be adjusted according to different applications, that is, it has t...
Example Embodiment
[0036] Example 3
[0037] figure 1 It is a schematic diagram of the structure of a metal conductive paste with high conductivity and low melting point applied to electronic components in Example 1. Among them: 1 is conductive paste, 2 is electronic component, 3 is fastening screw.
[0038] In the high-viscosity low-melting metal conductive paste of this embodiment, the low-melting metal is gallium indium tin zinc alloy (alloy mass fraction: Ga 61%, In 25%, Sn 13%, Zn 1%), and the melting point is 8°C. The metal powder is copper powder, the mass fraction accounts for 20% of the mass of the conductive paste, and the particle size is 4 μm.
[0039] When using, firstly coat the high-viscosity low-melting metal conductive paste evenly between the electronic components; then fix it tightly with screws. The electrical conductivity and viscosity of the high-viscosity and low-melting-point metal conductive paste of the present invention can be adjusted according to different applications, ...
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