Narrowly-dispersed phenol-phenolic varnish resin preparation method and narrowly-dispersed phenol-phenolic varnish resin obtained by means of the preparation method

Abstract

The invention provides a narrowly-dispersed phenol-phenolic varnish resin preparation method, and the narrowly-dispersed phenol-phenolic varnish resin which is narrow in molecular weight distribution, and takes phenols and aldehydes as raw materials is obtained in high yield. The narrowly-dispersed phenol-phenolic varnish resin preparation method is characterized by comprising following steps of (a) adding phenol and formaldehyde into bisphenol F with the amount of two nuclear bodies being detected to be more than 85 % by area by means of gel permeation chromatography, reacting the above materials in the presence of acid catalyst, and removing acid catalyst, water and unreacted phenol in the obtained reaction product, and obtaining a rough phenol-phenolic varnish resin; (b) removing evaporation component taking the dicaryon as the main component from the rough phenol-phenolic varnish resin by means of a distillation operation, and obtaining a narrowly-dispersed phenol-phenolic varnish resin with the amount of two nuclear bodies being detected to be lower than 20 % by area by means of gel permeation chromatography, and the amount of high molecular weight bodies of more than six nuclear bodies being detected to be lower than 12 % by area by means of gel permeation chromatography.

Description

technical field [0001] The present invention relates to a method for producing a narrowly dispersed phenol novolac resin and the narrowly dispersed phenol novolak resin obtained by the production method. Background technique [0002] Phenol novolac resin has excellent properties as an organic or inorganic substrate bonding material, and is used as a curing agent for epoxy resin compositions for sealing semiconductor devices such as semiconductor elements such as ICs and LSIs, or for heat resistance, Resins for molding materials with excellent electrical insulation properties. With regard to the market trend of electronic equipment in recent years, miniaturization, weight reduction, and high performance are progressing, and in response to this market trend, high integration of semiconductor elements is being carried out year by year. In addition, the surface mounting of semiconductor devices is being promoted. In the high integration of semiconductor elements, the size of se...

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Problems solved by technology

[0006] Therefore, as a method for producing a narrowly dispersed phenol novolac resin with a low dinuclear content, it has been proposed that after the reaction, dinuclear bodies are extracted using hot water (Patent Document 1), adding a slightly soluble solvent, and then add water-soluble alcohol and water to remove the method of low nucleosomes (Patent Document 2), etc., but these methods do not show the effective use of the removed dinuclear bodies, so as a result, waste relative to phenol novolac Dinuclear component of about 20% by mass in varnish resin

In addition, a method is disclosed in which a phenol novolac resin is synthesized by first resolizing phenols and aldehydes using a basic catalyst, and then adding phenols and an acidic catalyst for novolakization, However, the process is complicated, and the reduction of dinuclear bodies is not sufficient (Patent Document 3)

In addition, a method is disclosed in which a phenol novolak resin is synthesized by condensation reaction of phenols and aldehydes using a hydroxycarboxylic acid having a carboxyl group and an alcoholic hydroxyl group in one molecule as a catalyst, but the decrease in dinuclear body Insufficient and causes a problem of residual catalyst (Patent Document 4)

Furthermore, a production method is also disclosed in which a monomer and a catalyst are added to a phenol novolak resin, and a high molecular weight body of the phenol novolac resin is decomposed by heat treatment to cause low molecular weight and narrow dispersion, thereby obtaining a narrow dispersion Phenol novolak resin, but the yield is very poor, about 10%, not practical (Patent Document 5)

In addition, the following production method has been proposed, wherein, using the process of distilling bisphenol F to obtain high-purity bisphenol F, the distillation residue is directly made into phenol novolak resin, or further polymerized to produce high-molecular phenol novolac Varnish resin, or the production method of general-purpose bisphenol F obtained by mixing crude bisphenol F before recovery with high-purity bisphenol F, but compared with each independent production method, the number of steps increases and the productivity deteriorates significantly. , general-purpose bisphenol F also contains a lot of high molecular weight bodies and has a bad influence on physical properties, or it is impossible to obtain phenol novolac resins with the same molecular weight distribution as general phenol novolac resins. In addition, those with few dinuclear bodies The production of phenol novolac resin is determined by the production of high-purity bisphenol F, and there are many problems in actual production (Patent Document 6)

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