Nutrient wafer biscuit and making method thereof

A technology of wafers and nutrition, which is applied in the field of nutrition wafers and its preparation, can solve the problems of lack of health care, unfavorable health, easy to get angry, etc., and achieve novel taste, rich taste, good nutrition and heat effect

Inactive Publication Date: 2015-11-25
安徽米乐食品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional wafers are mostly flavored with essences, which is not good for the body, and it is easy to get angry if eaten too much, but it has no health care effect on the body

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A nutritional wafer made of the following components by weight:

[0033] Flour cake ingredients: 35 parts of wheat flour, 3 parts of corn starch, 0.4 parts of palm oil, 0.02 parts of ammonia bicarbonate, 0.1 parts of seasoning salt, 0.04 parts of baking soda, 35 parts of water, 0.05 parts of phospholipids, 10 parts of superfine sesame leaf powder , 2 parts of Schisandra seed powder, 1.5 parts of jujube seed powder, 0.5 parts of grape seed powder, 2 parts of yam powder, 5 parts of perilla seed powder, 0.5 parts of sorghum root powder, 2 parts of purple potato powder, 0.5 parts of okra seed powder, 0.2 servings of grilled eel fish bone meal;

[0034] Sandwich ingredients: 20 parts of peanut milk, 0.2 parts of Polygonatum polysaccharides, 0.1 parts of seasoning salt, 2 parts of skimmed milk powder, 1.5 parts of flavoring agents, 0.05 parts of corn peptides, 0.05 parts of motherwort pollen, 0.5 parts of white mushroom powder, 0.2 parts of clove extract , 0.2 parts of rape flowe...

Embodiment 2

[0054] A nutritional wafer made of the following components by weight:

[0055] Flour cake ingredients: 35 parts of wheat flour, 3 parts of corn starch, 0.4 parts of palm oil, 0.02 parts of ammonia bicarbonate, 0.1 parts of seasoning salt, 0.04 parts of baking soda, 35 parts of water, 0.05 parts of phospholipids, 10 parts of superfine sesame leaf powder , 2 parts of Schisandra seed powder, 1.5 parts of jujube seed powder, 0.5 parts of grape seed powder, 2 parts of yam powder, 5 parts of perilla seed powder, 0.5 parts of sorghum root powder, 2 parts of purple potato powder, 0.5 parts of okra seed powder, 0.2 servings of grilled eel fish bone meal;

[0056] Sandwich ingredients: 20 parts strawberry yogurt flavor slurry, 0.2 parts Polygonatum polysaccharides, 0.1 parts seasoning salt, 2 parts skimmed milk powder, 1.5 parts flavoring agents, 0.05 parts corn peptides, 0.05 parts motherwort pollen, 0.5 parts white mushroom powder, clove extract 0.2 parts of rapeseed extract, 1.3 parts o...

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PUM

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Abstract

The invention discloses a nutrient wafer biscuit. The nutrient wafer biscuit comprises a biscuit wrapper and filling. The biscuit wrapper comprises, by weight, 35 parts of wheat flour, 3 parts of corn starch, 0.4 part of palm oil, 0.02 part of ammonium bicarbonate, 0.1 part of seasoning salt, 0.04 part of baking soda, 35 parts of water, 0.05 part of phospholipids, 10 parts of superfine sesame leaf powder, 2 parts of fructus schisandrae seed powder, 1.5 parts of date pit powder, 0.5 part of grape pip powder, 2 parts of yam flour, 5 parts of perilla seed powder, 0.5 part of sorghum root powder, 2 parts of purple sweet potato powder, 0.5 part of okra seed powder, 0.2 part of baked eel bone powder. The filling comprises, by weight, 20 parts of pulp, 0.2 part of polygahatous polysaccharides, 0.1 part of seasoning salt, 2 parts of skim milk powder, 1.5 parts of flavoring agents, 0.05 part of corn peptide, 0.05 part of motherwort pollen, 0.5 part of white mushroom powder, 0.2 part of clove extract, 0.2 part of rape flower extract, 1.3 parts of alkalized cocoa powder, 0.06 part of vanillin, 2 parts of malt syrup and 0.5 part of roxburgh rose juice. The raw materials are rich in resources, the market prospect is wide, and the made biscuit is high in nutritive value and good in taste.

Description

Technical field [0001] The invention relates to the technical field of functional foods, in particular to a nutritional wafer and a preparation method thereof. Background technique [0002] Wafers (it can also be the kind of wafers with net patterns), like wafers or thin hollow wafers, can be placed in a wafer furnace (the wafer furnace has a tong that rotates around the furnace) Baked inside. These wafer products are part of the well-known mechanized production of wafer products in the food and consumer goods industry. Whether they are filled or unfilled wafer products, they have all come out commercially. In general, they are well known as enjoyables. Belonging to the wafer industry products, in addition to rolled wafer bags, sugar bags and wafer rolls, there are other wafer products, such as pouring wafer bags, wafer cups, wafer trays, flat-bottom wafer shallow Plates, thin hollow wafers, hollow hippies (transliteration), ice cream bags, filled wafers, ice cream wafers, sma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A21D13/08A21D2/36A21D13/13A21D13/14
Inventor 米文彪
Owner 安徽米乐食品有限公司
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