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Method for preparing conductive organosilicone pouring sealant

A technology of silicone potting glue and conductive type, which is applied in the direction of conductive adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problems of ineffective removal of static electricity, lack of electrical conductivity, etc., and achieve lower resistivity , Improve electrical conductivity, remove static electricity

Inactive Publication Date: 2015-11-25
DONGGUAN XINXING ORGANIC SILICON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this potting compound, like most silicone potting compounds, does not have conductive properties and cannot effectively remove static electricity.

Method used

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  • Method for preparing conductive organosilicone pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A preparation method of conductive silicone potting glue, the steps are as follows:

[0026] (1) Dissolve SDBS in acetone and disperse evenly, add acetic acid to adjust the pH value to 4 to obtain SDBS solution, add aluminum-doped zinc oxide to deionized water and stir evenly, then add SDBS solution and stir at 80 ° C for 2.5 hours, move to Ultrasonic treatment for 15 minutes in an ultrasonic machine with an ultrasonic power of 120W, vacuum filtration after discharging, washing with deionized water for 10 minutes, drying in a vacuum drying oven at 90°C to constant weight, and obtaining modified aluminum-doped Zinc oxide powder is ready for use, the weight ratio of SDBS and aluminum-doped zinc oxide is 1:8;

[0027] (2) 100 parts by weight of hydroxyl-terminated polydimethylsiloxane, 14 parts by weight of polyparaphenylene, 20 parts by weight of kaolin, 0.6 parts by weight of KH560 and 28 parts by weight of the modified product obtained in step (1) Add aluminum-doped zi...

Embodiment 2

[0032] A preparation method of conductive silicone potting glue, the steps are as follows:

[0033] (1) Dissolve SDBS in acetone and disperse evenly, add acetic acid to adjust the pH value to 4 to obtain SDBS solution, add aluminum-doped zinc oxide to deionized water and stir evenly, then add SDBS solution and stir at 80 ° C for 2.5 hours, move to Ultrasonic treatment for 15 minutes in an ultrasonic machine with an ultrasonic power of 120W, vacuum filtration after discharging, washing with deionized water for 10 minutes, drying in a vacuum drying oven at 90°C to constant weight, and obtaining modified aluminum-doped Zinc oxide powder is ready for use, the weight ratio of SDBS and aluminum-doped zinc oxide is 1:8;

[0034] (2) 100 parts by weight of hydroxyl-terminated polydimethylsiloxane, 15 parts by weight of polyparaphenylene, 22 parts by weight of quartz powder, 0.5 parts by weight of KH560 and 20 parts by weight of the step (1) obtained The modified aluminum-doped zinc o...

Embodiment 3

[0039] A preparation method of conductive silicone potting glue, the steps are as follows:

[0040] (1) Dissolve SDBS in acetone and disperse evenly, add acetic acid to adjust the pH value to 4 to obtain SDBS solution, add aluminum-doped zinc oxide to deionized water and stir evenly, then add SDBS solution and stir at 80 ° C for 2.5 hours, move to Ultrasonic treatment for 15 minutes in an ultrasonic machine with an ultrasonic power of 120W, vacuum filtration after discharging, washing with deionized water for 10 minutes, drying in a vacuum drying oven at 90°C to constant weight, and obtaining modified aluminum-doped Zinc oxide powder is ready for use, the weight ratio of SDBS and aluminum-doped zinc oxide is 1:8;

[0041] (2) 100 parts by weight of hydroxyl-terminated polydimethylsiloxane, 10 parts by weight of polyparaphenylene, 24 parts by weight of kaolin, 0.6 parts by weight of KH560 and 25 parts by weight of the modified product obtained in step (1) Add aluminum-doped zi...

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Abstract

The invention provides a method for preparing conductive organosilicone pouring sealant. The method includes the following steps that (1) SDBS is dissolved in acetone to be evenly dispersed, an SDBS solution is obtained after the ph value is adjusted, aluminum-doped zinc oxide is added in deionized water to be evenly stirred, then the deionized water is added in the SDBS solution to be stirred, ultrasonic treatment is carried out, pressure reducing suction filtration is conducted after discharging is completed, washing is performed, drying is conducted till a constant weight is obtained, and modified aluminum-doped zinc oxide powder is obtained after grinding is completed; (2) hydroxyl end-blocked dimethylsiloxane, polyparaphenylene, a reinforcing agent, a coupling agent and the modified aluminum-doped zinc oxide powder are added in a vacuum kneading machine to be kneaded, so that a base material is obtained; (3) cross-linking agent inhibitor is added in the base material to be stirred at an indoor temperature, and thus a component A is obtained; (4) a catalyst is added in the base material to be stirred at an indoor temperature, and thus a component B is obtained; (5) the component A and the component B are added in a stirring kettle to be evenly stirred, room temperature curing is carried out after vacuum defoamation is completed, and accordingly the conductive organosilicone pouring sealant is obtained. The organosilicone pouring sealant prepared through the method has good conductive performance and can effectively eliminate static electricity.

Description

Technical field: [0001] The invention relates to a silicone potting glue, in particular to a preparation method of a conductive silicone potting glue. Background technique: [0002] At present, high-tech fields such as electronic components, power circuit modules, large-scale integrated circuit boards, and LEDs have further achieved high performance, high reliability, and miniaturization, and the working environment is more harsh. Potting materials must be between low and high temperatures, high-speed It operates under conditions such as rotation, so the potting material is required to have excellent high and low temperature resistance and mechanical properties. At present, the most widely used potting materials are various synthetic polymers, among which epoxy resin, polyurethane and synthetic rubber are widely used. Silicone rubber can maintain elasticity in a wide temperature range for a long time, does not absorb or release heat during vulcanization, and has excellent c...

Claims

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Application Information

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IPC IPC(8): C09J183/06C09J9/02C09J11/04
Inventor 吴细飞
Owner DONGGUAN XINXING ORGANIC SILICON TECH
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