Natural graphite/copper composite heat sink and fabrication method thereof

Abstract

The invention discloses a natural graphite / copper composite heat sink and a fabrication method thereof, relating to the field of cooling and electromagnetic shielding of a heating component of an electronic product. The natural graphite / copper composite heat sink comprises a copper foil layer and graphite layers, wherein the graphite layers are arranged on the upper surface and the lower surface of the copper foil layer; the copper foil layer comprises a copper substrate and armoring layers arranged on the upper surface and the lower surface of the copper substrate; warty copper particle structures are uniformly distributed on the surfaces of the armoring layers; and the armoring layers are engaged with the graphite layers through the warty copper particle structures. The fabrication method of the natural graphite / copper composite heat sink comprises the following steps of: pre-processing the surface of a copper foil; roughening and curing the copper foil; uniformly stacking puffed worm graphite and laying on the copper foil; and calendering step by step to obtain the natural graphite / copper composite heat sink. The heat sink disclosed by the invention has favorable heat conduction performance and a favorable electromagnetic shielding effect, is resistant to stretch, and can be bent for 180 degrees, the interface resistance between the copper foil and the graphite is lower, and the heat conduction performance is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation and electromagnetic shielding of heating components of electronic products, in particular to a natural graphite / copper composite heat sink and a preparation method thereof. Background technique [0002] The current CPU generates heat due to high-speed operation, and the high-speed operation of the CPU is developed to improve the processing speed of its equipment. The demand for mobile phones, tablet computers, notebook computers and TVs and the use of display screens increase. The demand for high brightness of display screens increases the use of light-emitting diodes. However, the more light-emitting diodes are used, the power consumption increases, which also increases equipment At the same time, the battery power consumption increases, and the battery capacity also needs to be increased accordingly, which makes the display device generate more heat due to high energy consumption. If the heat gen...

AI Technical Summary

Problems solved by technology

The demand for mobile phones, tablet computers, notebook computers and TVs and the use of display screens have increased. The demand for high brightness of display screens has increased the use of light-emitting diodes. However, the more light-emitting diodes are used, the power consumption increases, which also increases equipment. At the same time, the battery power consumption increases, and the battery capacity also needs to be increased accordingly, which makes the display device generate more heat due to high energy consumption. If the heat generation cannot be effectively controlled, not only the high temperature will cause the CPU to crash or lose its function due to high heat. , will also shorten the service life of heating equipment

At the same time, the functions of display devices are increasing nowadays, and the parts used are also diversified, with a large number and smaller volume. Due to the miniaturization of mobile phones, tablet computers and other devices, the available space is insufficient, and the distance between the parts and components is closer, which is easy to occur. mutual electromagnetic interference

[0003] At present, the thickness of artificial graphite used as a heat dissipation material in the market is mainly 25 μm. The artificial graphite of 40 μm can be mass-produced, but the thermal conductivity is not good. The mass production of artificial graphite of 70 μm is not high, and the thickness limits the heat dissipation of artificial graphite. Performance, more heat needs to be solved, in order to transfer the heat from the heating component "A" point to other points to dissipate and reduce the temperature of the heating component, so that the body temperature of the heating component "A" is greatly reduced

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