Process of mechanical copper plating and mechanical copper alloy plating

Abstract

The invention discloses a process of mechanical copper plating and mechanical copper alloy plating and belongs to the technical field of surface plating of a steel product. The process of mechanical copper plating and mechanical copper alloy plating comprises the steps of adjusting the pH value of a plating solution by means of universal mechanical plating equipment, then adding copper powder or copper alloy powder and a sedimentation accelerating agent into the plating solution, and finally a cooper coating or a copper alloy coating is prepared on the surface of the steel product along with the rotation of a plating cylinder of the mechanical plating equipment. The sedimentation accelerating agent adopted by the process is composed of diatomite, sodium gluconate, triethanolamine, stannous salt, ammonium dihydrogen phosphate, polyethylene glycol, OP-10, inorganic acid and a defined amount of water. By adopting the process of mechanical copper plating and mechanical copper alloy plating, the copper powder or the copper alloy powder can subside on the surface of the steel product rapidly, the process is simple, the operation is convenient, and the dual-effect of corrosion prevention and decoration of the steel product can be achieved.

Description

technical field [0001] The invention relates to a mechanical copper plating and copper alloy process, which belongs to the technical field of surface plating of iron and steel materials, and is used for preparing copper and copper alloy plating layers on the surface of iron and steel parts. Background technique [0002] In recent years, with the continuous increase of environmental protection pressure, the traditional copper electroplating process has been closed, stopped, and reorganized. However, the demand for copper electroplating process in the fields of electronics, electrical appliances, and decorative-protective hardware has increased unabated. The development of copper plating provides a good opportunity. However, in the field of mechanical plating, there is no mature mechanical copper plating process for production practice. Literature search shows that there is little research on mechanical copper plating in the field of surface protection. Yu Ping used to add co...

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Problems solved by technology

[0003] The main layered material used in mechanical copper plating and copper alloy is copper powder or copper alloy powder. Compared with zinc and zinc alloy powder, metallic copper is easy to oxidize, and the standard electrode potential of metallic copper is much more positive than metallic zinc. The surface state of zinc powder and zinc powder in the acidic solution is also different, so the conventional mechanical galvanizing process is not suitable for mechanical copper and copper alloy plating from the perspective of mechanism.