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A polycrystalline silicon ingot casting device and a method for preparing a silicon ingot

A technology for polycrystalline silicon and ingot casting is applied in the field of polycrystalline silicon ingot casting device and silicon ingot preparation field, which can solve the problems of affecting the effective utilization rate of silicon ingots, increasing the carbon content of silicon ingots, and low effective utilization rate of silicon ingots, so as to improve the effective utilization rate of silicon ingots. efficiency, reducing carbon content, and increasing effective utilization

Active Publication Date: 2018-03-06
JINKO SOLAR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the thermal field environment of polycrystalline ingots is a carbon environment. The graphite shield is directly in contact with the quartz crucible for heat conduction and heat preservation. Under high temperature conditions, the graphite shield will undergo a dry reaction in contact with the quartz crucible to produce carbon-containing compounds, such as carbon dioxide. The generated carbon dioxide will enter the silicon liquid, eventually increasing the carbon content of the silicon ingot, bringing hard spots, shadows and other impurities, affecting the effective utilization of the silicon ingot
The existing technology relies on the gas to take away carbon-containing compounds by increasing the gas flow rate during the polycrystalline ingot casting process, but the effective utilization rate of silicon ingots obtained in this way is still low

Method used

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  • A polycrystalline silicon ingot casting device and a method for preparing a silicon ingot
  • A polycrystalline silicon ingot casting device and a method for preparing a silicon ingot

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preparation example Construction

[0038] The invention provides a kind of preparation method of silicon ingot, comprises the following steps:

[0039] The polysilicon raw material is placed in the polysilicon ingot casting device described in the above technical solution, and is sequentially heated, melted, crystal grown, annealed and cooled to obtain a silicon ingot.

[0040] The present invention has no special limitation on the polysilicon raw material, and polysilicon raw materials well known to those skilled in the art can be used. In a specific embodiment of the present invention, the polysilicon raw material is purchased from Xinjiang Daxin New Energy Co., Ltd.

[0041] The present invention preferably carries out heating, melting, crystal growth, annealing and cooling in an ingot furnace well known to those skilled in the art. In the present invention, the heating temperature is preferably 15°C to 1500°C, and the heating time is preferably 7 to 8.5 hours; the melting temperature is preferably 1500°C t...

Embodiment 1

[0046] A plasma arc generator is used to heat and ionize the gas passing into the nozzle to form a high-temperature and high-speed plasma jet, which melts and atomizes metal molybdenum, and sprays it onto the surface of the graphite plate. The length of the graphite plate is 1081mm. The width is 609mm, the thickness is 28mm, and the composite guard plate with a thickness of 5mm molybdenum layer is obtained;

[0047] Perpendicular to the thickness direction of each said composite guard, the edge of each said composite guard is provided with 2 guard holes; with the end with the guard hole as the right side, each said composite guard The upper end is from the right side to the left side, and the first opening, the second opening and the third opening are arranged in sequence along the horizontal direction. The length of the first opening is 50mm and the height is 40mm; the length of the second opening is 40mm and the height is 40mm; The length of the third opening is 60mm, and th...

Embodiment 2

[0050] A plasma arc generator is used to heat and ionize the gas passing into the nozzle to form a high-temperature and high-speed plasma jet, which melts and atomizes metal tungsten and sprays it onto the surface of the graphite plate. The length of the graphite plate is 1081mm. The width is 609mm, the thickness is 28mm, and the composite protective plate with a thickness of 6mm tungsten layer is obtained;

[0051] Perpendicular to the thickness direction of each said composite guard, the edge of each said composite guard is provided with 2 guard holes; with the end with the guard hole as the right side, each said composite guard The upper end is from the right side to the left side, and the first opening, the second opening and the third opening are arranged in sequence along the horizontal direction. The length of the first opening is 50mm and the height is 40mm; the length of the second opening is 40mm and the height is 40mm; The length of the third opening is 60mm, and th...

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Abstract

The application provides a polysilicon ingot casting device and a method for preparing a silicon ingot. The device includes a quartz crucible and several composite guard plates arranged on the outer periphery of the quartz crucible; each of the composite guard plates includes a graphite layer and is arranged on A metal isolation layer on the graphite layer; the metal isolation layer is in contact with the quartz crucible. The polysilicon ingot casting device is provided with a metal isolation layer on the graphite layer, and the metal isolation layer can hinder the dry reaction between the quartz crucible and the graphite to produce carbon compounds, reduce the carbon content in the silicon ingot, and then improve the quality of the silicon ingot. The effective utilization rate; the grade A rate of polysilicon wafers made by slicing silicon ingots is improved, and the disconnection rate is reduced. Experimental results show that: using the polysilicon ingot casting device provided by the application, the carbon content in the silicon wafer is reduced by 1.5-3ppm; the effective utilization rate of the silicon ingot is increased by 1.2-3.5%; at the same time, the disconnection rate of the silicon wafer is reduced by 0.5-2.5%. The grade A rate of silicon wafers increases by 0.5-1.5%.

Description

technical field [0001] The present application relates to the technical field of polysilicon ingot casting, in particular to a polysilicon ingot casting device and a method for preparing a silicon ingot. Background technique [0002] At present, when casting silicon ingots in ingot furnaces in the photovoltaic industry, advanced directional solidification technology is generally used to make directional growth of grains. The key point of this technology is to gradually cool the molten silicon material from the bottom of the crucible upwards to reach the silicon The purpose of directional crystallization of the ingot from the bottom of the crucible to the top of the crucible. [0003] see figure 1 , figure 1 It is a structural schematic diagram of a photovoltaic ingot casting furnace in the prior art. Since the quartz crucible 02 will soften at high temperature, when the crucible is in a softened state, it cannot bear the silicon material inside because it is heated, expand...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B28/06C30B29/06
Inventor 冷金标周慧敏龙昭钦任一鸣徐志群
Owner JINKO SOLAR CO LTD