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Copper foil with carrier, printed circuit board, copper clad laminated sheet, electronic device, and printed circuit board fabrication method

A technology with copper foil and carrier attached to the carrier, which is applied in the manufacture of printed circuits, electronic equipment, printed circuits, etc., can solve the problems of poor insulation and residue of circuit patterns, and achieve the effect of good laser opening

Active Publication Date: 2015-12-09
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if such an ultra-thin copper layer with a large outline (concave-convex, roughness) is used in a printed wiring board, especially for a semiconductor package substrate that needs to form a fine circuit pattern, undesired copper will remain during circuit etching. Copper particles that are required, but cause problems such as poor insulation between circuit patterns

Method used

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  • Copper foil with carrier, printed circuit board, copper clad laminated sheet, electronic device, and printed circuit board fabrication method
  • Copper foil with carrier, printed circuit board, copper clad laminated sheet, electronic device, and printed circuit board fabrication method
  • Copper foil with carrier, printed circuit board, copper clad laminated sheet, electronic device, and printed circuit board fabrication method

Examples

Experimental program
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Embodiment 1～9、11、12

[0244] Examples 1-9, 11, 12, Comparative Examples 1-5)

[0245]A titanium rotating cylinder was arranged in the electrolytic cell, and electrodes were arranged around the cylinder with an inter-electrode distance. Next, electrolysis was carried out in the electrolytic tank under the carrier foil production conditions described in Table 1, copper was deposited on the surface of the rotating drum, and the copper deposited on the surface of the rotating drum was peeled off to continuously produce an electrolytic copper foil with a thickness of 18 μm. It is set as a copper foil carrier. Furthermore, regarding Examples 1, 2, 6, 8, 9, and 12, the thicknesses of the surface-treated copper foil carriers were 12 μm, 5 μm, 70 μm, 12 μm, 35 μm, and 35 μm, respectively. Moreover, about the comparative example 3, it was set as the copper foil carrier of thickness 12 micrometers. About Examples 1, 2, 6, 8, 9, and 12, the conditions described in Table 1 were surface-treated to the copper f...

Embodiment 10

[0309] A rolled copper foil (refined copper, JISH3100C1100) was prepared, and the rolled copper foil was subjected to cold rolling for final processing using a rolling roll whose surface was roughened by sandblasting. At this time, the rolling roll roughness Ra=0.39-0.42 μm, and the oil film equivalent were 35,000. Thus, a copper foil carrier was obtained.

[0310] Next, copper foil with a carrier was produced by forming an intermediate layer and an ultra-thin copper layer on the surface (matte surface) of the electrodeposited copper foil in the same manner as in Example 1.

[0311] Each evaluation was implemented by the following method about the copper foil with a carrier of the Example and the comparative example obtained as mentioned above.

[0312]

[0313] The thickness of the ultra-thin copper layer of the produced copper foil with a carrier was observed using FIB-SIM (Focused Ion Beam-Scanning Ion Microscope, focused ion beam-scanning ion microscope) (magnification:...

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Abstract

Provided is a copper foil with a carrier, the ultrathin copper layer of which has good laser-hole-opening properties, and which is suitable for the fabrication of a high-density integrated circuit substrate. The copper foil with a carrier is provided with a carrier, an intermediate layer, and ultrathin copper layer, in that order. When the ultrathin copper layer is peeled off in accordance with JIS C 6471 after the copper foil with a carrier is heated at 200°C for two hours, the surface roughness (Sz) of the ultrathin copper layer on the intermediate layer side is 1.40μm to 4.05μm as measured by a laser microscope.

Description

technical field [0001] The present invention relates to a copper foil with a carrier, a printed wiring board, a copper-clad laminate, an electronic device, and a method for manufacturing the printed wiring board. Background technique [0002] A printed wiring board is usually produced by bonding copper foil to an insulating substrate to form a copper-clad laminate, and then etching the surface of the copper foil to form a conductive pattern. With the increasing demand for miniaturization and high performance of electronic equipment in recent years, high-density mounting of mounted components or high frequency of signals has been developed, and printed wiring boards are required to miniaturize (fine-pitch) or High frequency correspondence, etc. [0003] Copper foils with a thickness of 9 μm or less, and furthermore, copper foils with a thickness of 5 μm or less have recently been demanded in response to finer pitches. However, such extremely thin copper foils have low mechan...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B15/08H05K1/09
CPCB32B15/01B32B15/08B32B15/20B32B2307/538B32B2457/08C25D1/04C25D5/48C25D7/0614H05K3/205B32B15/018
Inventor 古曳伦也
Owner JX NIPPON MINING & METALS CO LTD