Semiconductor air conditioning card, cushion, seat and mattress

Abstract

The invention relates to a semiconductor air conditioning card, a cushion, a seat and a mattress and belongs to the manufacturing field of hi-tech electronic products. The semiconductor air conditioning card comprises a semiconductor refrigerating chip, cold-end radiating fins, hot-end radiating fins, and a vacuum cavity solvent soaking plate, wherein the cold-end radiating fins are connected with the cold surface of the semiconductor refrigerating chip; the hot surface of the semiconductor refrigerating chip is connected with one end of the vacuum cavity solvent soaking plate; the hot-end radiating fins are connected with the other end of the vacuum cavity solvent soaking plate. According to the invention, the working mode and composition structure of the semiconductor refrigerating chip are innovatively designed to enable the semiconductor refrigerating chip to be applicable to a product with multiple functions, particularly to be applicable to a cushion product having strict requirements for size and thickness, and generate innovative influence on the existing semiconductor air conditioning refrigeration technique.

Description

Technical field [0001] The invention relates to a semiconductor air conditioner card, a cushion, a seat, and a mattress, and belongs to the field of high-tech electronic product manufacturing. Background technique [0002] Semiconductors have two important physical effects, the Seebeck effect and the Peltier effect. The former can be used for power generation and temperature detection, while the latter is used for cooling. When the semiconductor chip works in the cooling mode, by consuming power, a temperature difference is generated between the two ends of the chip, that is, one end absorbs heat and the other end releases heat. If the heat generated by the hot end can be effectively taken away, the heat at the cold end can be used. It is continuously delivered to the hot end to produce a cooling effect. Therefore, although the size of the semiconductor chip itself is small, in order to keep the chip in a good working condition, the hot end generally needs a larger heat sink and...

AI Technical Summary

Problems solved by technology

[0004] Chinese patent document "A Built-in Vehicle Temperature-Controlled Seat", announcement number 201989661, discloses a built-in vehicle temperature-controlled seat, which consists of a seat cushion, a backrest cushion, two leather covers with holes, and two A sponge with holes, an intake fan, a retractable ventilation hose, two semiconductor cooling and heating modules with radiators, two air separators, and a control device are combined to drive the cooling and heat exchange through the fan. This patent can only used in seat systems

[0005] Compared with seat technology, air-conditioning cushion technology is very immature. Although similar products occasionally appear on the market, they have not been popularized due to obvious technical shortcomings.

The characteristics of the existing air-conditioning cushion technology can be summarized as follows: 1) The semiconductor refrigeration sheet works outside the seat cushion, because the refrigeration sheet is a fragile and pressure-resistant part, so it cannot bear large mechanical pressure or deformation stress; 2 ) Since the cooling plate works outside the cushion, the heat exchange between the inside of the cushion and the cold end of the cooling plate must be realized through a solid or liquid heat transfer medium, such as using a metal with a high heat transfer coefficient such as aluminum copper plate, or a liquid medium with a high specific heat such as water, etc. ; 3) The heat dissipation end parts are bulky, which is another important reason why the refrigerating sheet needs to work outside the seat cushion. Due to the relatively low working efficiency of the semiconductor refrigerating sheet, the electric power efficiency of the refrigerating sheet currently on the market is less than 60%. While cooling, a lot of heat will be released. If the heat dissipation is not good, there will be no cooling effect. Therefore, the fins on the heat dissipation end are relatively large. Even referring to computer graphics cards and CPU heat dissipation, thick heat pipe fin radiators and fans are used to enhance heat dissipation.

[0006] The existing air-conditioning seat cushion technology has the following obvious problems: 1) In order to avoid the pressure of the semiconductor refrigeration sheet and ensure good heat dissipation at the heat dissipation end, the seat cushion must be made very thick. Too thick thickness will greatly change the driving angle of the car seat, even It hinders the safety system of the car seat; 2) It is not feasible to use copper and aluminum plates to realize the heat exchange between the seat cushion and the cooling plate. First, to ensure the heat transfer power, the copper and aluminum plates are much thicker than expected. Temperature gradient (the heat transfer mechanism of copper-aluminum metal plate is to realize heat conduction through temperature difference, there is no heat conduction without temperature gradient), the temperature uniformity of the seat cushion is very poor, the area close to the cooling plate is very cold, and the area far away from the cooling plate has basically no cooling effect ; 3) the more feasible scheme in the prior art is to use water as the heat transfer medium, that is, the water is cooled by the semiconductor refrigeration technology outside the cushion, and the water pump is injected into the cushion to carry out heat exchange. The cooling rate is slow and the efficiency is low (the specific heat of water is large, and the water needs to be cooled to a certain temperature to produce an obvious cooling effect); secondly, in order to make up for the lack of efficiency, it is often necessary to use high-power semiconductor chips, which consume high energy consumption; finally, There are water pipes all over the cushion, once a leak occurs, it may bring subsequent safety hazards

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