Double-neutralization system in circuit board electroless plating copper production line

Abstract

The invention relates to the technical field of circuit board manufacturing, and specifically relates to a double-neutralization system in the circuit board electroless plating copper production line. A first overflow mouth is arranged in a neutralization tank, so that liquid medicine can overflow into a pre-neutralization tank, the concentration of the liquid medicine in the tank can be stabilized, the effect of neutralization can be improved, and residual potassium permanganate and other impurities in a production plate can be better removed. The liquid medicine in the neutralization tank can be reused after filtered by a filter pump. The liquid medicine can also flow into the pre-neutralization tank through a pre-neutralization pipe, so that the number of opening times of the pre-neutralization tank is reduced, the liquid medicine is utilized better, and waste is reduced. By overflowing the water in a first washing tank after neutralization into a second washing tank before neutralization, the dosage is reduced, and the cost is lowered. Through the structure improvement, the pollution of potassium permanganate to the neutralization tank is improved significantly, the service life of the neutralization tank is prolonged, and the pollution of potassium permanganate to hole forming and activating is improved effectively.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a double neutralization system in a circuit board copper sinking production line. Background technique [0002] The production process of circuit boards generally includes material cutting → negative film making inner layer circuit → pressing → drilling → copper sinking → full board electroplating → positive film process to make outer layer circuit → making solder mask layer → surface treatment → forming. Copper sinking refers to the formation of a copper sinking layer on the production board by means of chemical copper deposition. Before the chemical deposition of copper on the production board, a strong oxidant (such as potassium permanganate) must be used to remove the resin residue on the surface of the hole wall after drilling, and The resin surface of the hole wall is roughened, and the bonding force between the copper sinking layer and the hole wall is inc...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems that the neutralization system in the existing copper sinking production line does not clean the remaining strong oxidants and redox products in the production board, which leads to easy contamination of other potions, poor backlighting of the production board, and no copper in holes, etc., and provides a solution. A double neutralization system with better neutralization effect

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