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Aluminum alloy and preparation method and application thereof

A technology of aluminum alloy and total amount, which is applied in the field of aluminum alloy and its preparation, can solve the problems of not meeting the heat dissipation requirements of electronic products and low thermal conductivity, and achieve the effects of good comprehensive mechanical properties, high elongation, and good casting performance

Inactive Publication Date: 2016-02-03
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of the alloy is low, only 92W / (m·K), which cannot meet the heat dissipation requirements of existing electronic products

Method used

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  • Aluminum alloy and preparation method and application thereof
  • Aluminum alloy and preparation method and application thereof
  • Aluminum alloy and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Aluminum alloy raw materials were prepared according to the composition in Table 1. The aluminum alloy raw material is smelted and cast into an ingot, and the obtained ingot is mold-cast on a 160T cold die-casting machine, so as to obtain the die-cast body of the aluminum alloy of the present invention. Among them, the melting temperature is 750°C, the injection speed is 2m / s, the mold temperature is 200°C, and the casting size is 200mm×30mm×3mm.

[0050] The surface hardness, thermal conductivity, yield strength and elongation of the prepared aluminum alloy were measured, and the results are listed in Table 2.

Embodiment 2-15

[0052] The aluminum alloy die-cast body was prepared by the same method as in Example 1, except that the aluminum alloy raw material was prepared according to the composition in Table 1.

[0053] The surface hardness, thermal conductivity, yield strength and elongation of the prepared aluminum alloy were measured, and the results are listed in Table 2.

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Abstract

The invention discloses an aluminum alloy and a preparation method and application thereof. The aluminum alloy comprises the following components in percentage by weight: 4-9% of silicon, 0.5-1.5% of copper, 0.3-1% of iron, 0-0.1% of rare earth elements, 0-0.3% of titanium, 0-0.5% of magnesium, 0-0.05% of boron, 0-0.1% of manganese, 0-0.1% of zirconium, 0-0.1% of chromium, 0-10% of zinc, 0-0.05% of strontium, 0-0.1% of lithium, 0-0.005% of vanadium, and 77.095-95.2% of aluminum. The aluminum alloy, provided by the invention, is excellent in comprehensive mechanical performance, higher in strength and hardness and higher in ductility, and can be machined to structural elements having various shapes and thicknesses. Above all, the aluminum alloy, provided by the invention, is excellent in heat conductivity. The aluminum alloy, provided by the invention, is suitable for serving as a structural material having higher requirements on the heat conducting performance, and in particular, is suitable for serving as a structural part of an electronic product.

Description

technical field [0001] The invention relates to an aluminum alloy and its preparation method and application. Background technique [0002] Aluminum alloy has good processing performance, especially hypoeutectic aluminum-silicon alloy. High-quality cast aluminum alloys can be used to make parts with complex shapes and are widely used in many fields. With the development of electronic products in the direction of thinner and more multifunctional, the requirements for heat dissipation performance are getting higher and higher. Therefore, cast aluminum alloys with high thermal conductivity have important application prospects. [0003] Electronic products usually require complex and precise structural parts, so die-casting alloys have become commonly used structural parts. However, the most commonly used die-casting aluminum alloy is ADC12, which has good casting performance, mechanical strength and corrosion resistance, so it is widely used. However, the thermal conductivit...

Claims

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Application Information

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IPC IPC(8): C22C21/02C22C1/02
CPCC22C1/02C22C21/02C22C21/04
Inventor 张法亮文丹华宫清
Owner BYD CO LTD
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