LED light source module capable of splitting light in advance, and preparation method for LED light source module
An LED light source and light-splitting technology, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of unstable quality of LED products, easy differences in light color and light intensity, and adjust the light color of white LEDs to achieve excellent heat dissipation performance , high consistency, avoid yellowing effect
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Embodiment 1
[0026] An LED light source module with light splitting in the front section, comprising a bracket 1, a cooling cup 2 is arranged on the upper part of the bracket 1, a copper block 3 and an electrode 4 are arranged on the bottom of the cooling cup 2, and a blue light is arranged on the copper block 3 Chip 5, a wire 6 is connected between the blue light chip 5 and the electrode 4, the blue light chip 5 is wrapped with a fluorescent glue 7, and a transparent isolation layer 8 is also provided between the blue light chip 5 and the fluorescent glue 7; The edge of the surface of the transparent isolation layer 8 is provided with an attachment groove 9 surrounding the blue light chip 5 .
[0027] Further, the copper block is further provided with a Zener tube 10 connected in parallel with the blue light chip 5 , and a wire is provided between the Zener tube 10 and the electrode 4 .
[0028] Preferably, the top of the copper block 3 is further provided with a flow blocking groove 11 s...
Embodiment 2
[0030] This embodiment provides a method for preparing the LED light source module with front-end light splitting in Embodiment 1.
[0031] Specifically include the following steps:
[0032] Including the following steps:
[0033] 1) Die-bonding: fix the Zener tube on the copper block, put it into an oven at 190°C and bake for 60±5 minutes; then fix the blue-ray chip on the copper block, and put it into an oven at 140°C for baking Bake for 120±5 minutes;
[0034] 2) Bonding: use a wire bonding machine to draw wires from the blue light chip and the Zener tube, weld the wires to the electrodes, and ensure that the blue light chip is connected in parallel with the Zener tube; The surface of the blue-ray chip is coated with hot melt adhesive to form the transparent isolation layer;
[0035] 3) Light splitting: energize the electrodes, and test the wavelength T nanometers of the blue light chip;
[0036]4) Dispense fluorescent glue: prepare fluorescent glue according to the fol...
Embodiment 3
[0040] This embodiment provides a method for preparing the LED light source module with front-end light splitting in Embodiment 1.
[0041] Specifically include the following steps:
[0042] 1) Die-bonding: fix the Zener tube on the copper block, put it into an oven at 185°C and bake for 60±5 minutes; then fix the blue-ray chip on the copper block, and put it into an oven at 150°C for baking Bake for 120±5 minutes;
[0043] 2) Bonding: use a wire bonding machine to draw wires from the blue light chip and the Zener tube, weld the wires to the electrodes, and ensure that the blue light chip is connected in parallel with the Zener tube; The surface of the blue-ray chip is coated with hot melt adhesive to form the transparent isolation layer;
[0044] 3) Light splitting: energize the electrodes, and test the wavelength T nanometers of the blue light chip;
[0045] 4) Spot fluorescent glue: prepare fluorescent glue according to the following components and parts by weight, TMR-2...
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