Wireless pneumatic/hydraulic microfluidic module
A microfluidic and air pressure technology, applied in the field of microfluidics, can solve the problems of large volume, difficulty in networking, and high cost of the air pressure drive module, and achieve the effects of intelligentization and networking, simplified structure, and low cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach 1
[0013] Specific implementation mode one: the following combination figure 1 and figure 2 Describe this embodiment, the wireless pneumatic / hydraulic microfluidic module described in this embodiment includes a structural layer and a control layer, and the structural layer and the control layer are fixedly connected together; the two layers can be arranged up and down;
[0014] The structural layer includes flow channel and base encapsulation module 1, micro-channel external joints, microvalve drive unit and pressure sensor 4; flow channel and base encapsulation module 1 includes double T series micro-channel 1-1, concave Film 1-2, flat film 1-3 and substrate 1-4; the upper surface of the substrate 1-4 is provided with a flat film 1-3, the upper surface of the flat film 1-3 is provided with a concave film 1-2, and the concave film 1-2 The upward groove is provided with a micro-channel 1-1 in series with double Ts; the micro-channel external joint includes a medium inlet joint 2...
specific Embodiment approach 2
[0021] Specific implementation mode two: combination figure 1 To illustrate this embodiment, the entire wireless air pressure microfluidic module can be replaced by a short polymer resin tube of similar shape or a rectangular strip of methyl methacrylate (PMMA) tube through a layered layout connection method. Permanent epoxy glue or ethyl cyanoacrylate are fixed by glue. Other connection relationships are the same as those in the first embodiment.
specific Embodiment approach 3
[0022] Specific implementation mode three: combination figure 1 This embodiment is described. In this embodiment, the control chip of the controller 5-5 is realized by a single-chip microcomputer, ARM, DSP or FPGA. Others are the same as in the first embodiment.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| length | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 