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Anti-oxidation metal product

A metal product, anti-oxidation technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc. The effect of solving the problem of copper wire oxidation, low pinhole rate and excellent conductivity

Inactive Publication Date: 2016-02-24
GUANGDONG MEIYAN JIXIANG IND INVESTMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, inert gas protection should also be added in the packaging and storage of the existing bonding copper wire in the preparation process; the storage and service life of the bare copper wire are very short, which also increases the cost of production and storage, and further affects The use effect of the final product

Method used

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Embodiment 1

[0021] An anti-oxidation metal product of the present invention, the anti-oxidation metal product is a bonded copper wire, the purity of the copper wire is ≥99.99wt%, its surface is coated with an anti-oxidation layer with a thickness of 1nm, and the anti-oxidation layer is composed of the following parts by weight The components consist of: fullerene 0.1kg, aluminum 2kg, polyethylene 8kg, polyacrylamide 11kg, carbon disulfide 1kg.

[0022] The preparation method of the anti-oxidation metal product:

[0023] (1) Put high-purity copper with a purity of 99.999wt% into an intermediate frequency induction furnace for smelting to turn it into copper liquid, then pour it into a graphite ingot mold, keep the vacuum, and turn on the gas injection after the furnace is completely cooled down valve, and open the furnace cover, cool the formed ingot with pure water, and then dry it with compressed air;

[0024] (2) Use vertical smelting to further smelt it, then put it into a crucible, s...

Embodiment 2

[0030] An anti-oxidation metal product of the present invention, the anti-oxidation metal product is a bonded copper wire, the purity of the copper wire is ≥99.99wt%, its surface is coated with an anti-oxidation layer with a thickness of 2nm, and the anti-oxidation layer is composed of the following parts by weight The components consist of: fullerene 0.5kg, aluminum 8kg, polyethylene 15kg, polyacrylamide 16kg, carbon disulfide 3kg.

[0031] The preparation method of the anti-oxidation metal product:

[0032] (1) Put high-purity copper with a purity of 99.999wt% into an intermediate frequency induction furnace for smelting to turn it into copper liquid, then pour it into a graphite ingot mold, keep the vacuum, and turn on the gas injection after the furnace is completely cooled down valve, and open the furnace cover, cool the formed ingot with pure water, and then dry it with compressed air;

[0033] (2) Use vertical smelting to further smelt it, then put it into a crucible, ...

Embodiment 3

[0039] An anti-oxidation metal product of the present invention, the anti-oxidation metal product is a bonded copper wire, the purity of the copper wire is ≥99.99wt%, its surface is coated with an anti-oxidation layer with a thickness of 1.5nm, and the anti-oxidation layer is composed of the following weight Parts are composed of: fullerene 0.4kg, aluminum 3kg, polyethylene 9kg, polyacrylamide 12kg, carbon disulfide 2kg.

[0040] The preparation method of the anti-oxidation metal product:

[0041] (1) Put high-purity copper with a purity of 99.999wt% into an intermediate frequency induction furnace for smelting to turn it into copper liquid, then pour it into a graphite ingot mold, keep the vacuum, and turn on the gas injection after the furnace is completely cooled down valve, and open the furnace cover, cool the formed ingot with pure water, and then dry it with compressed air;

[0042] (2) Use vertical smelting to further smelt it, then put it into a crucible, seal it, tur...

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Abstract

The invention discloses an anti-oxidation metal product. The anti-oxidation metal product is bonding brass wires, purity of the brass wires is greater than or equal to 99.99wt%, the surface of the brass wires is coated with an anti-oxidation layer with thickness of 1-2nm, the anti-oxidation layer is composed of 0.1-0.5 parts of fullerene, 2-8 parts of aluminum, 8-15 parts of polyethylene, 11-16 parts of polyacrylamide and 1-3 parts of carbon disulfide by weight. The anti-oxidation metal product has advantages of high bonding force of a coating layer, low pinhole rate, high temperature resistance capability, great oxidation resistance capability, low resistivity, excellent conductivity and high breakdown resistance voltage, the anti-oxidation metal product can further stand 400 DEG C temperature and can stand 200 DEG C high temperature environments for three hours, and thereby a brass wire oxidation problem can be effectively solved.

Description

technical field [0001] The invention relates to an anti-oxidation metal product. It belongs to the technical field of metal products. Background technique [0002] Bonding gold wire is a metal product commonly used in the field of microelectronics industry. It is a gold alloy wire used as a connecting wire in integrated circuits, and is a key lead material for the connection of integrated circuits or discrete devices and LEDs. [0003] In recent years, with the rapid development of the semiconductor industry and the soaring price of gold, both production and use companies have brought huge cost pressures. In addition, the integration of integrated circuits is getting higher and higher, the thickness of the circuit board is getting smaller and smaller, the number of electrodes on the device is increasing, the distance between the electrodes is getting narrower, and the packaging density is getting smaller and smaller accordingly. Alloy wire can no longer meet the increasing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48
CPCH01L24/43H01L24/45H01L2224/45147H01L2224/45565H01L2224/45599H01L2224/4579H01L2224/45824H01L2224/45893H01L2224/43848H01L2224/45144H01L2224/45H01L2924/01204H01L2924/01205H01L2924/00014H01L2924/20105H01L2924/20106H01L2924/20107H01L2924/20108H01L2924/2011H01L2924/00012H01L2924/00
Inventor 李江平张海燕李桢华杨国立唐俊朝王凤美
Owner GUANGDONG MEIYAN JIXIANG IND INVESTMENT
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