Sputtering target material and CIGS-based thin film solar cell manufactured by sputtering target material
A technology for solar cells and sputtering targets, used in sputtering plating, circuits, photovoltaic power generation, etc., can solve the problems of difficult battery recycling, poor film thickness uniformity, and excessive waste water, and achieve large-scale continuous cleaning. Production, large-area uniform film formation, and the effect of reducing manufacturing costs
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Embodiment 1
[0035] Deposit a 500nm molybdenum electrode layer by magnetron sputtering on the surface of a soda-lime glass; then form a 1.9um p-type copper indium gallium selenide light absorption layer on the molybdenum electrode layer; then form a p-type copper indium gallium selenide light absorption layer on the molybdenum electrode layer Form a 50nm n-type copper indium gallium selenide film layer on the n-type copper indium gallium selenide film layer; then use an Al-doped zinc selenide target on the n-type copper indium gallium selenide film layer, and use DC magnetron sputtering to deposit a 50nm doped zinc selenide film layer, the content of Al in the doped zinc selenide film layer is 500ppm; then adopt magnetron sputtering to deposit 800nm AZO (Al-doped ZnO) film layer on the doped zinc selenide film layer as a transparent conductive layer. The structure of the thin film battery of this embodiment is as figure 1 shown.
Embodiment 2
[0037] A 550nm molybdenum electrode layer was deposited by magnetron sputtering on the surface of a soda-lime glass; then a 1.8um p-type copper indium gallium selenide light absorption layer was formed on the molybdenum electrode layer; then a p-type copper indium gallium selenide light absorption layer was formed Form a 45nm n-type copper indium gallium selenide film layer on the n-type copper indium gallium selenide film layer; then use an Al-doped zinc selenide target material on the n-type copper indium gallium selenide film layer, and use AC magnetron sputtering to deposit a 40nm doped zinc selenide film layer, the content of Al in the doped zinc selenide film layer is 800ppm; then adopt magnetron sputtering to deposit 40nm doped zinc oxide film layer on the doped zinc selenide film layer, the resistivity of the doped zinc oxide film layer is 45Ωcm; then, a 600nm AZO (Al-doped ZnO) film layer is deposited as a transparent conductive layer on the doped zinc oxide film layer...
Embodiment 3
[0039] A metal molybdenum electrode layer of 500nm is deposited on the surface of a soda lime glass by magnetron sputtering; then a 1.9um p-type copper indium gallium selenide light absorption layer is formed on the molybdenum electrode layer; then a p-type copper indium gallium selenide light absorption layer is formed A 35nm n-type copper indium gallium selenide film layer is formed on the n-type copper indium gallium selenide film layer; then an Al-doped zinc selenide target is used on the n-type copper indium gallium selenide film layer, and a 50nm doped zinc selenide is deposited by DC magnetron sputtering film layer, the content of Al in the doped zinc selenide film layer is 1300ppm; then on the doped zinc selenide film layer, adopt magnetron sputtering to deposit the intrinsic ZnO film layer of 40nm; then use the intrinsic ZnO film layer on the intrinsic ZnO film layer Magnetron sputtering is used to deposit 800nm AZO (Al-doped ZnO) film layer as a transparent conducti...
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