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Epoxy encapsulation adhesive for high power LED encapsulation and preparation method for epoxy encapsulation adhesive and use of epoxy encapsulation adhesive

A technology of LED encapsulation and epoxy resin, applied in the direction of epoxy resin glue, adhesive, polymer adhesive additives, etc., can solve the problems of high price of silicone resin, urgent packaging materials, small output, etc., to achieve low cost, The effect of high glass transition temperature and thermal decomposition temperature and strong bonding performance

Inactive Publication Date: 2016-03-02
深圳市极客智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Of course, in recent years, Shunde ACR, Changsha Bluestar, Jiangyin Tianxing and other manufacturers have emerged in China, but they basically maintain the production of low-power packaging materials, and the output is also small. Therefore, the development of high-end packaging products will promote the promotion of domestic power LEDs. of great significance
[0005] Traditional epoxy resins cannot fully meet the packaging requirements of LEDs, while silicone resins are expensive and monopolized by foreign countries, so the preparation of high temperature resistant and strong bonding performance, strong dielectric properties and UV radiation resistance, good light transmittance applications Encapsulation materials for high-power LEDs are urgently needed

Method used

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  • Epoxy encapsulation adhesive for high power LED encapsulation and preparation method for epoxy encapsulation adhesive and use of epoxy encapsulation adhesive
  • Epoxy encapsulation adhesive for high power LED encapsulation and preparation method for epoxy encapsulation adhesive and use of epoxy encapsulation adhesive

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Embodiment 1

[0024] In the embodiment of the present invention, the epoxy resin encapsulant for high-power LED encapsulation is a two-component system, consisting of 47% of component A and 53% of component B in terms of mass percentage; In percentage terms, it is made of 19.85% of bisphenol F epoxy resin, 80% of phenolic modified silicone resin and 0.15% of polyether modified polysiloxane. The B component is made of Korean pine Made from 14% extract, 85% adipic dihydrazide, 0.4% resorcinol monobenzoate and 0.6% 4-benzoyloxy-2,2,6,6-tetramethylpiperidine The preparation method of described Korean pine extract, comprises the following steps:

[0025] 1) Wash the roots or stems of the Korean pine, pulverize them, and pass through a 40-mesh sieve to obtain coarse powder;

[0026] 2) Adding 5 times the volume concentration of the coarse powder to the coarse powder is an 88% ethanol solution, soaked for 12 hours, then heated to boiling and refluxed for 3 hours, filtered, and slowed down by perc...

Embodiment 2

[0034] In the embodiment of the present invention, the epoxy resin encapsulant for high-power LED encapsulation is a two-component system, consisting of 42% of A component and 58% of B component in terms of mass percentage; In percentage terms, it is made of 80% of bisphenol F epoxy resin, 19.85% of phenolic modified silicone resin and 0.15% of polyether modified polysiloxane. The B component is made of Korean pine Made from 27% extract, 72% adipate dihydrazide, 0.4% resorcinol monobenzoate and 0.6% 4-benzoyloxy-2,2,6,6-tetramethylpiperidine The preparation method of described Korean pine extract, comprises the following steps:

[0035] 1) Wash the roots or stems of the Korean pine, pulverize them, and pass through a 40-mesh sieve to obtain coarse powder;

[0036] 2) Adding 5 times the volume concentration of the coarse powder to the coarse powder is an 88% ethanol solution, soaked for 12 hours, then heated to boiling and refluxed for 3 hours, filtered, and slowed down by per...

Embodiment 3

[0044] In the embodiment of the present invention, the epoxy resin encapsulant for high-power LED encapsulation is a two-component system, consisting of 43.8% of component A and 56.2% of component B in terms of mass percentage; In percentage terms, it is made of 45% of bisphenol F epoxy resin, 54.75% of phenolic modified silicone resin and 0.25% of polyether modified polysiloxane. The B component is made of Korean pine Made from 20% extract, 78% adipate dihydrazide, 1.0% resorcinol monobenzoate and 1.0% 4-benzoyloxy-2,2,6,6-tetramethylpiperidine The preparation method of described Korean pine extract, comprises the following steps:

[0045] 1) Wash the roots or stems of Korean pine, grind them, and pass through an 80-mesh sieve to obtain coarse powder;

[0046] 2) Add 6 times the mass of the coarse powder to the coarse powder in an ethanol solution with a volume concentration of 75%, soak for 18 hours, then heat to boiling and reflux for 5 hours, filter, and slowly use the pe...

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Abstract

The present invention discloses an epoxy encapsulation adhesive for high power LED encapsulation and a preparation method for an epoxy encapsulation adhesive and use of the epoxy encapsulation adhesive. The encapsulation adhesive consists of 42-47% of a component A and 53-58% of a component B by mass percentage. The component A is prepared from 19.85-80% of bisphenol F epoxy resin, 19.85-80% of phenolic aldehyde modified organosilicone resin and 0.15-0.25% of polyether modified polysiloxane by mass percentage, and the component B is prepared from 14-27% of a Korean pine extraction liquid, 72-85% of adipic dihydrazide, 0.4-1.0% of resorcinol monobenzoate and 0.6-1.2% of 4-benzoyloxyl-2,2,6,6-tetramethylpiperidine by mass percentage. The encapsulation adhesive disclosed by the present invention is resistant to high temperature, resistant to ultraviolet radiation, good in light transmittance, high in refractive index, simple in process and low in cost, so that the encapsulation adhesive can be widely applied to the high power LED encapsulation field.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an epoxy resin encapsulation adhesive for high-power LED encapsulation, a preparation method and application thereof. Background technique [0002] As "green lighting", LED lighting is widely used in display screens, landscape lighting, special lighting and other fields. With the maturity of LED light source technology, the luminous lumens per watt has increased rapidly, prompting its decreasing price year by year. Looking forward to the future, LED general lighting has become an industry hotspot with the greatest market potential, so the packaging problem of high-power, high-brightness white LEDs has become increasingly prominent. [0003] Ordinary liquid epoxy materials for LED packaging have high viscosity (viscosity above 10,000 cps at room temperature) and low glass transition temperature (about 110°C), which is difficult to meet the requirements of high-power white LEDs. High...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J183/00C09J11/08C09J11/06H01L33/56
Inventor 刘操
Owner 深圳市极客智能科技有限公司
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