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Adhesive composition and bonded structure

A technology for connecting structures and compositions, used in adhesives, conductive adhesives, non-polymer adhesive additives, etc., can solve the problems of difficult storage stability and low activation energy, and achieve improved storage stability, Excellent balance and excellent storage stability

Active Publication Date: 2020-05-15
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to cure the above-mentioned adhesive at low temperature, it is necessary to use a thermal latent catalyst with low activation energy, but it is extremely difficult to have both storage stability

Method used

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  • Adhesive composition and bonded structure
  • Adhesive composition and bonded structure
  • Adhesive composition and bonded structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～4

[0236] (Production of adhesive for circuit connection)

[0237] Compound thermoplastic resin, radical polymerizable compound and radical polymerization initiator, and boron compound or amine compound with solid mass such as shown in Table 1, further, with adhesive agent component (except conductive particle in the adhesive agent for circuit connection) 1.5% by volume of conductive particles was blended and dispersed based on the total volume of components other than components) to obtain an adhesive for circuit connection. The obtained adhesive for circuit connection was coated on a fluororesin film with a thickness of 80 μm using a coating device, and dried by hot air at 70° C. for 10 minutes to obtain a film-like adhesive for circuit connection with an adhesive layer thickness of 20 μm. Adhesive.

[0238] [Table 1]

[0239] UR-4800 YP-50 UA1 P-2M TBA-BPB TBA-MNB TBA-PB DMA PEROYL L Example 1 50 - 50 3 3 - - - 8 Example 2 50 ...

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Abstract

The present invention provides an adhesive composition and a connection structure. The adhesive composition of the present invention contains (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a boron-containing salt, and (d) a boron-containing salt is as follows The compound represented by the general formula (A). ···(A)[In formula (A), R 1 , R 5 , R 6 , R 7 and R 8 Each independently represents a hydrogen atom or an alkyl group with 1 to 18 carbon atoms, and R 2 , R 3 and R 4 Each independently represents an aryl group].

Description

technical field [0001] The present invention relates to an adhesive composition and a bonded structure. Background technique [0002] In semiconductor elements and liquid crystal display elements, various adhesives have been used conventionally in order to bond various members in the elements. Requirements for adhesives include adhesion, heat resistance, reliability under high temperature and high humidity, and many other aspects. The above-mentioned adhesive is used for connection of a liquid crystal display element and TCP (COF), connection of FPC and TCP (COF), connection of TCP (COF) and printed wiring board, connection of FPC and printed wiring board, and the like. In addition, the above-mentioned adhesive is also used when mounting a semiconductor element on a substrate. [0003] As the adherend used for bonding, use a printed wiring board, or polyimide, polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN) and other organic substrates...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J4/06C09J9/02C09J11/06H01B1/20H01L21/60
CPCH01L2224/83101Y02E10/50H01L2224/73204
Inventor 伊泽弘行森尻智树杉本靖
Owner RESONAC CORPORATION