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Chemical nickel plating method and method for chemical plating copper-nickel conducting circuit

A technology of electroless nickel plating and conductive lines, applied in the direction of liquid chemical plating, coating, metal material coating technology, etc., can solve the problems of shortening the service life of electroless nickel plating solution, complicated electroless plating process, and difficult maintenance, etc. Achieve the effect of good activation effect, uniform distribution of copper and nickel layer, and low cost

Active Publication Date: 2016-03-09
东莞市发斯特精密科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the cost of this process is high, and it makes the electroless plating process complicated and difficult to maintain, and the palladium chloride solution has an impact on the general electroless nickel plating solution. natural decomposition, shorten the service life of electroless nickel plating solution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A method for plating copper-nickel conductive lines on the surface of a non-metallic part, comprising the following steps:

[0028] First laser activation, using laser to form a circuit pattern on the surface of the non-metallic part, so that the pattern area produces a metal nucleus;

[0029] Secondly, pre-plating copper, soak the non-metallic parts with circuit patterns in the pre-copper-plating solution at 45°C for 10 minutes, and ventilate the pre-copper-plating solution while soaking, so as to roll and tumble with the copper-plating solution to produce copper film on the circuit pattern;

[0030] Thick copper plating again, put the pre-copper-plated non-metallic parts into the thick copper solution at 55°C for 60 minutes, and ventilate the pre-plating solution at the same time, so as to roll and toss with the copper-plating solution to produce a thick copper film on the circuit pattern;

[0031] Then the pickling nickel is activated, and the non-metallic parts af...

Embodiment 2

[0037] A method for chemically plating copper-nickel conductive lines on a non-metallic surface, comprising the following steps:

[0038] First laser activation, using laser to form a circuit pattern on the surface of the non-metallic part, so that the pattern area produces a metal nucleus;

[0039] Next pre-plating copper, will form the non-metal parts of circuit pattern and place in the pre-plating copper solution and soak for 15min, soak and ventilate in the pre-plating copper solution at the same time, so as to roll and toss with the copper-plating solution, to produce the copper film on the above-mentioned on the line pattern;

[0040] Thick copper plating again, put the pre-copper-plated non-metallic parts into the thick copper solution and soak for 100min, and ventilate into the pre-plating solution while soaking, so as to roll and toss with the copper-plating solution to produce a thick copper film on the above-mentioned on the line pattern;

[0041] Then the picklin...

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PUM

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Abstract

The invention relates to the technical field of non-metal surface chemical plating, in particular to a chemical nickel plating method. The chemical nickel plating method is mainly applied to a non-metal surface chemical plating copper-nickel conducting circuit. The chemical nickel plating method comprises the following steps that firstly, acid pickling is used for nickel activating, and a non-metal part obtained after copper plating is put into an acid pickling solution to be soaked for 5-30 min; secondly, chemical nickel plating is conducted, the non-metal part obtained after acid pickling is soaked into a nickel plating solution to be soaked for 5-20 min; and finally the non-metal part plated with the copper-nickel conducting circuit is obtained, wherein the acid pickling solution includes, by weight, 10%-20% of concentrated hydrochloric acid and 2%-3% of nickel chloride. According to the chemical nickel plating method, acid pickling is directly used for nickel activating; compared with traditional activating conducted through precious metal, namely palladium, the technology is simple, cost is low, the activating effect is good, the reaction rate is easy to control, and it is ensured that a nickel plating layer on the copper circuit is uniform. The invention further relates to a method for the chemical plating copper-nickel conducting circuit.

Description

technical field [0001] The invention relates to the technical field of electroless plating on non-metal surfaces, in particular to an electroless nickel plating method and a method for electroplating copper-nickel conductive lines on the surface of non-metal parts. Background technique [0002] Electroless plating is a process in which metal deposition is produced through a controllable redox reaction under the catalysis of metals. The realization of electroless plating should have: the potential of the reducing agent in the solution to be oxidized is significantly lower than the potential of the metal ion to be reduced, so that the metal may be deposited on the substrate; the prepared solution does not spontaneously decompose, and when mixed with the catalyst The metal deposition process occurs only when the surfaces are in contact; the plating speed can be adjusted; the precipitated metal should have catalytic activity, so that the plating layer can be thickened. Compared...

Claims

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Application Information

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IPC IPC(8): C23C18/36C23G1/10
Inventor 吴京霞孙联和李乾
Owner 东莞市发斯特精密科技股份有限公司
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