The invention relates to the technical field of non-
metal surface chemical plating, in particular to a chemical
nickel plating method. The chemical
nickel plating method is mainly applied to a non-
metal surface chemical plating
copper-
nickel conducting circuit. The chemical nickel plating method comprises the following steps that firstly, acid
pickling is used for nickel activating, and a non-
metal part obtained after
copper plating is put into an acid
pickling solution to be soaked for 5-30 min; secondly, chemical nickel plating is conducted, the non-metal part obtained after acid
pickling is soaked into a nickel plating solution to be soaked for 5-20 min; and finally the non-metal part plated with the
copper-nickel conducting circuit is obtained, wherein the acid pickling solution includes, by weight, 10%-20% of concentrated
hydrochloric acid and 2%-3% of nickel
chloride. According to the chemical nickel plating method, acid pickling is directly used for nickel activating; compared with traditional activating conducted through
precious metal, namely
palladium, the technology is simple, cost is low, the activating effect is good, the
reaction rate is easy to control, and it is ensured that a nickel plating layer on the copper circuit is uniform. The invention further relates to a method for the
chemical plating copper-nickel conducting circuit.