Method for preparing nickel-plated copper powder

A technology of nickel-plated copper and copper powder, applied in liquid chemical plating, coating, metal material coating process and other directions, can solve problems such as high cost, complex process, environmental pollution, etc., to ensure uniformity, simple process, The effect of process safety

Active Publication Date: 2010-06-16
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned methods all have the following problems: 1. the process is complicated: the preparation of all nickel-plated copper powders is through pretreatment processes such as pickling, sensitization and activation; 2. the cost is high: all adopt noble metal palladium or palladium chloride to activate; Pollution problem: all use hydrazine as the reducing agent, which has great pollution to the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] a. Put the copper powder with a particle size of 200 mesh into a hydrochloric acid solution with a weight concentration of 15% to activate for 80 minutes, then wash with tap water 3 times until neutral, filter, and set aside;

[0022] b. Put the copper powder activated in step a into a hydrochloric acid solution with a weight concentration of 5% for pickling for 15 minutes, then wash with water until neutral, filter, and set aside;

[0023] c. first get 10 parts by weight of nickel sulfate solution and add it to 50 parts by weight of sodium hypophosphite solution under stirring, then add 20 parts by weight of sodium citrate solution, adjust pH=8 with sodium hydroxide solution, and then add the Put the alkaline nickel plating solution in a water bath and heat it to 35°C, then put the copper powder pickled in step b into the nickel plating solution, stir until the copper powder is evenly dispersed, wait for 60 minutes to react, and then wash it with deionized water 3 time...

Embodiment 2

[0026] a. Put the copper powder with a particle size of 800 mesh into a hydrochloric acid solution with a weight concentration of 75% to activate for 20 minutes, then wash with tap water 5 times until neutral, filter, and set aside;

[0027] b. Put the copper powder activated in step a into a hydrochloric acid solution with a weight concentration of 15% for pickling for 5 minutes, wash with water until neutral, filter, and set aside;

[0028] c. first get 35 parts by weight of nickel sulfate solution and add it to 10 parts by weight of sodium hypophosphite solution under stirring, then add 80 parts by weight of sodium citrate solution, adjust pH=10 with sodium hydroxide solution, and then add the Put the alkaline nickel plating solution in a water bath and heat it to 50°C, then put the copper powder pickled in step b into the nickel plating solution, stir until the copper powder is evenly dispersed, wait for 15 minutes to react, and then wash it with deionized water 5 times, c...

Embodiment 3

[0031] a. Put the copper powder with a particle size of 500 mesh into a hydrochloric acid solution with a weight concentration of 40% to activate for 50 minutes, then wash with tap water 4 times until neutral, filter, and set aside;

[0032] b. Put the copper powder activated in step a into a hydrochloric acid solution with a weight concentration of 7% for pickling for 10 minutes, wash with water until neutral, filter, and set aside;

[0033] c. first get 20 parts by weight of nickel sulfate solution and add it to 30 parts by weight of sodium hypophosphite solution under stirring, then add 50 parts by weight of sodium citrate solution, adjust pH=9 with potassium hydroxide solution, and then add the Put the alkaline nickel plating solution in a water bath and heat it to 40°C, then put the copper powder pickled in step b into the nickel plating solution, stir until the copper powder is evenly dispersed, wait for 30 minutes to react, and then wash it with deionized water 4 times,...

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Abstract

The invention provides a method for preparing nickel-plated copper powder. The method comprises the following steps: (a) putting copper powder with the granularity between 200 and 800 meshes in 15 to 75 weight percent of hydrochloric acid solution for activation for 20 to 80min, and then carrying out water washing till the solution is neutral; (b) putting the copper powder activated in step (a) in 5 to 10 weight percent of the hydrochloric acid solution for acid washing for 5 to 15min, carrying out water washing till the solution is neutral, and then filtrating the solution for later use; (c) putting the copper powder subjected to acid washing in step (b) in nickel-plated solution for chemical plating and then carrying out cleaning and centrifugal filtration on the copper powder subjected to chemical plating to obtain the nickel-plated copper powder; and (d) soaking the nickel-plated copper powder obtained in step (c) in organic acid ester mixed solution for 0.5 to 3 hours and then filtering and drying the mixed solution to obtain the product.

Description

Technical field: [0001] The invention relates to the technical fields of materials and chemicals, in particular to a preparation method of nickel-plated copper powder. Background technique: [0002] The hazard of electromagnetic radiation has become a major public hazard in today's society, which is extremely inconsistent with the ecological environment required for human survival and sustainable development. Electromagnetic interference causes electronic equipment to malfunction, causing major economic losses; electromagnetic environmental pollution endangers the health of the general public; electromagnetic information leakage will cause information leakage of important departments such as national politics, economy, national defense, and science and technology, endangering national security. In addition, if domestic electronic products do not undergo electromagnetic shielding treatment and obtain a certificate of conformity, it will seriously hinder the products from ente...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/36C23C18/18
Inventor 余凤斌朱焰焰王义海郭涵曹建国
Owner TIANNUO PHOTOELECTRIC MATERIAL
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