A method for manufacturing a unidirectional high-level uniform white light element
A technology of white light components and manufacturing methods, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve problems such as the consistency of the fluorescent glue layer on the chip, the difficulty of ensuring the consistency of high color levels, and the unfavorable mass production. The effect of low cost, easy quality and high reliability
Active Publication Date: 2018-09-25
GUANGZHOU XINZIDA ELECTRONICS TECH
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Problems solved by technology
These process methods are very complicated, consume a lot of materials, and it is difficult to achieve the uniformity of the thickness of the fluorescent adhesive layer on the chip with the chip particle as a unit, which makes it difficult to ensure the high color level consistency of the light. The layer is also damaged, the quality is difficult to control, and the process is complicated, which is not conducive to mass production
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[0041] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:
[0042] The manufacturing method of the unidirectional high-level consistent white light element according to the present invention mainly includes the following steps:
[0043] S1. Make a whole piece of flip-chip COW structure (chip on wafer, wafer without thinning and cutting), such as figure 1 As shown, including the following production process:
[0044] S11. On a sapphire substrate 100, a buffer layer 110, an n-type gallium nitride layer 120, an active layer 130, a p-type confinement layer 140, and a p-type gallium nitride are sequentially epitaxially grown on a sapphire substrate 100 layer 150, thereby obtaining a basic epitaxial wafer structure;
[0045] S12. Evaporating a silver alloy on the p-type gallium nitride layer 150 to form a current spreading layer and a light reflection layer 160;
[0046] S13. Etching out the position of the N-bo...
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Abstract
The invention relates to a preparation method for a unidirectional white light component of high color gradation consistency, and belongs to the field of semiconductor production. The preparation method mainly comprises the following steps that S1) an integral flip COW structure is prepared; S2) the surface of a substrate of the flip COW structure is coated with a fluorescent glue layer, and the fluorescent glue layer is baked and solidified; S3) a flip chip is formed by laser cutting and splitting off; S4) a double-side adhesive tape and a tool are provided, the tool is provided with a channel cooperated with the flip chip, and one side of the double-side adhesive tape is adhered to the tool; S5) the pad surface of the flip chip is adhered to the other side of the double-side adhesive tape; S6) white glue of high reflectivity is injected into the channel of the tool, baked and solidified; and S7) cutting is carried out along the channel of the tool to form the unidirectional white light component of high color gradation consistency.
Description
technical field [0001] The invention relates to the field of semiconductor production and manufacturing, in particular to a method for manufacturing a unidirectional white light element with high color-level consistency. Background technique [0002] With the continuous development of human society, energy consumption is increasing, and the global energy shortage has become the consensus of everyone. The advantages of light-emitting diodes such as high durability, long life, light weight, low power consumption, and fast response speed make them widely used in various light sources such as light displays, traffic signals, and lighting. [0003] At present, package-free products (CSP products) developed based on flip chips have five light-emitting surfaces, including one sapphire surface and four sides. For some specific applications, such as flashlights, we only need to obtain as much light as possible from one side. Therefore, it is necessary to bond the sides with high-ref...
Claims
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IPC IPC(8): H01L33/50H01L33/00
CPCH01L33/504H01L2933/0041
Inventor 李琦毛明华方耀豪陈忠兴
Owner GUANGZHOU XINZIDA ELECTRONICS TECH