A surface-treated special base paper for electronic carrier tape and its preparation method

A surface treatment and electronic technology, which is applied in the field of special base paper for electronic carrier tape and its preparation, to achieve the effect of low cost, high bonding strength and easy handling

Active Publication Date: 2018-01-05
JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to users, the quality of this product is also better than that of South Korea, but there is still a gap between it and Japanese products

Method used

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  • A surface-treated special base paper for electronic carrier tape and its preparation method
  • A surface-treated special base paper for electronic carrier tape and its preparation method
  • A surface-treated special base paper for electronic carrier tape and its preparation method

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Experimental program
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Effect test

Embodiment 1

[0039] 1. Process flow

[0040] (1) Pulp ratio and additives: In consideration of the stiffness and interlayer bonding of the base paper for electronic special paper tapes, we choose a high proportion of coniferous wood fiber and a low proportion of hardwood fiber, and use a combination of water and moisture resistance material, to ensure the bonding force between the base paper layers.

[0041] For example, to produce 0.60mm base paper, 65% of softwood pulp and 35% of hardwood pulp; to produce 0.40mm base paper, 75% of softwood pulp and 25% of hardwood pulp; to produce 0.75mm base paper, 60% of softwood pulp and 35% of broadleaf pulp Leaf pulp 20%, recycled waste paper 20%, etc.

[0042] (2) Beating control process: beating determines the product performance of base paper. In this process, we will strictly control the beating process, and formulate corresponding beating treatment processes for different production specifications to ensure the bonding ability and other proper...

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Abstract

The invention discloses an electronic carrier tape special base paper with a treated surface and a manufacturing method thereof. The electronic carrier tape special base paper has two layers or more than two layers of papermaking structures. The paper is characterized in that the surface and back surface of the paper are coated with a layer of treating fluid containing a hot melting glue binding modifier, so tension for tearing the processed paper tape surface and a hot melting upper adhesive tape reaches 10 g to 70 g after hot melt adhesion, and peeling and fluffing would not occur when the hot melting upper adhesive tape is peeled. The treating fluid contains 1.5%-2.0% of polyvinyl alcohol, 1.5%-2.0% of polyacrylamide modifier, 0.7%-0.9% of acrylate copolymer, 0.02% of cyanoethyl chitosan, and 0.50%-0.80% of hot melting glue binding modifier. The tension for tearing the processed paper tape surface and the hot melting upper adhesive tape reaches 10 g to 70 g after hot melt adhesion, and peeling and fluffing would not occur when the hot melting upper adhesive tape is peeled. The electronic carrier tape special base paper satisfies requirements in industries.

Description

technical field [0001] The invention belongs to the technical field of electronic information materials, and in particular relates to a surface-treated special base paper for electronic carrier tape used in the packaging of chip electronic components in the technical field of microelectronics and a preparation method thereof. Background technique [0002] With the miniaturization of electrical appliances, the miniaturization requirements for electronic components are getting higher and higher. When the size is large, it is acceptable to use plastic carrier tape, but when the size is smaller, the production of plastic carrier tape is very difficult. Dimensional accuracy is difficult to guarantee, especially it is difficult to eliminate the chamfer around when drilling, which is especially obvious when the size is small, especially important is that the static electricity of plastic products is difficult to eliminate, which brings difficulties to the process of taking component...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D21F11/04D21F5/04D21F5/06D21D1/20D21D1/02D21H15/10D21H11/14D21H11/12D21H21/16D21H19/20D21H19/24D21H19/30
CPCD21D1/02D21D1/20D21F5/04D21F5/06D21F11/04D21H11/12D21H11/14D21H15/10D21H19/22D21H19/24D21H19/30D21H21/16
Inventor 姜兆宏
Owner JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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