Ice-cold compound material and ice-cold slice prepared from ice-cold compound material

Abstract

An ice-cold compound material and an ice-cold slice are disclosed, the ice-cold compound material is prepared from high specific heat powder and high thermal conductivity powder by mixing, the ice-cold slice is prepared from the ice-cold compound material and resin by mixing and thermocompression for curing, the ice-cold compound material at least comprises first powder particles, second powder particles and flake particles, the particle size of the second powder particles is less than the particle size of the first powder particles, the second powder particles and the flake particles are filled in gaps among the first powder particles, the first powder particles have high specific heat, and the second powder particles and the flake particles have high thermal conductivity, so that the ice-cold slice prepared from the ice-cold compound material can absorb a lot of heat and quickly conduct the heat out to avoid raising of the temperature.

Description

technical field [0001] The invention relates to a cold composite material and a thin sheet, in particular to a composite material with heat dissipation function and a thin sheet prepared therefrom. Background technique [0002] In order to combine light, thin, short, small features and high operating efficiency of electronic products, the problem of heat dissipation has always been considered when designing and manufacturing electronic products; usually, electronic product manufacturers will attach Thermal foil. [0003] As the name suggests, the heat conduction sheet is made of a material with good thermal conductivity, and because it is used in electronic products, it also needs to have good insulation, and in order to cope with uneven electronic component joints, it also needs to be soft. Silicone has Viscous and compressible enough to cope with irregular component interfaces, it also has low electrical conductivity and is an important heat-conducting sheet material. How...

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Problems solved by technology

[0004] At present, the use of silica gel as the base heat sink has some disadvantages. First, the silica gel will release some gas in a high-heat environment. In addition to safety concerns, the work efficiency of the heat sink will be reduced due to material wear and tear. Next, the silica gel will release some gas. Mixed high thermal conductivity substances, such as gold, silver, etc. are precious metals, so the cost of manufacturing is too high; in view of the above problems, the inventor believes that it is necessary to propose a new thermal conductivity sheet

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