Surface-organically-modified boron nitride powder, preparation method and applications thereof

A technology of boron nitride powder and boron nitride, which is applied in the application field of preparing thermally conductive polymers, can solve the problems of stronger force, unfavorable powder uniform dispersion and mixed glue fluidity and other problems
CN105461963AActive Publication Date: 2016-04-06FOSHAN SANSHUI JINGE NEW MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FOSHAN SANSHUI JINGE NEW MATERIALS CO LTD
Publication Date
2016-04-06

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Abstract

The present invention discloses surface-organically-modified boron nitride powder, wherein a hydantoin epoxy resin cross-linked polymerization product layer is coated on the particle surface, the hydantoin epoxy resin cross-linked polymerization product content in the surface-organically-modified boron nitride powder is 5-10 wt.%, and the raw materials for preparing the surface-organically-modified boron nitride powder comprise 20-30 wt.% of boron nitride, 1-3 wt.% of a hydantoin epoxy resin, 0.1-2 wt.% of an organic amine curing agent, and the balance of water. According to the present invention, the surface-organically-modified boron nitride powder has characteristics of good compatibility with polymer substrates and easy dispersion in the substrate, and can maintain good construction or processing fluidity under the high filling rate of 47.5 wt.%, and the thermal conductivity of the prepared epoxy composite material is up to 2.42 W / m.K.
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Description

technical field

[0001] The invention belongs to the field of powder surface treatment and heat-conducting polymer composite materials, and relates to a surface organically modified boron nitride powder, a preparation method thereof and an application in preparing heat-conducting polymers. Background technique

[0002] Due to its high thermal conductivity and good insulation, boron nitride powder can effectively improve the thermal conductivity of the polymer material by compounding it with the polymer material, thereby preparing insulating and heat-conducting polymer composite materials. This kind of material not only overcomes the shortcomings of the traditional methods of solving the heat dissipation of electronic equipment, such as the poor thermal conductivity of the thermal conductivity material (such as mica, beryllium oxide ceramics, etc.) between the heating element and the heat dissipation element, It has the disadvantages of low mechanical properties and high price...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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