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Surface-organically-modified boron nitride powder, preparation method and applications thereof

A technology of boron nitride powder and boron nitride, which is applied in the application field of preparing thermally conductive polymers, can solve the problems of stronger force, unfavorable powder uniform dispersion and mixed glue fluidity and other problems

Active Publication Date: 2016-04-06
FOSHAN SANSHUI JINGE NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method reduces the low surface energy region on the powder surface and enhances the interfacial bonding force between the powder and the matrix, the newly added functional groups on the powder surface will lead to stronger interaction between powder particles, which is not conducive to The uniform dispersion of the body and the fluidity of the mixed glue in the process of compounding and construction
However, there is no report on epoxy microencapsulated boron nitride powder

Method used

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  • Surface-organically-modified boron nitride powder, preparation method and applications thereof
  • Surface-organically-modified boron nitride powder, preparation method and applications thereof
  • Surface-organically-modified boron nitride powder, preparation method and applications thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0066] In a 1000ml three-necked flask, 200g of deionized water, 100g of boron nitride powder (purchased from Liaobin Fine Chemical Co., Ltd. Huilong Electronic Materials Co., Ltd., epoxy value 0.70mol / 100g) 2g, put the flask in a heating mantle, heat while stirring until the temperature rises to 30°C, keep stirring at this temperature for 20min; then, under stirring, The aqueous solution of diethylenetriamine (2.8g is dissolved in 25g deionized water) and the aqueous solution of hydantoin epoxy resin (6g is dissolved in 25g deionized water) are started dropwise respectively in the flask, and the rate of addition is about 1.5 ml / min , continue to stir for 90min after the dropwise addition is completed; filter the mixture with a Buchner funnel (200mm), rinse the powder with deionized water (500ml×3), then place the powder in a blast oven at 100°C for 5 hours, collect The dried powder is ready for use. The contact angles of the obtained powders are shown in Table 1.

Embodiment 2

[0068]In a 1000ml three-necked flask, 250g of deionized water, 100g of boron nitride powder (purchased from Liaobin Fine Chemical Co., Ltd. Huilong Electronic Materials Co., Ltd., epoxy value 0.70mol / 100g) 1g, put the flask in a heating mantle, heat while stirring until the temperature rises to 40°C, keep stirring at this temperature for 20min; then, under stirring, The aqueous solution of triethylenetetramine (3.5g is dissolved in 25g deionized water) and the aqueous solution of hydantoin epoxy resin (6g is dissolved in 25g deionized water) are started dropwise respectively in the flask, and the rate of addition is about 1.0 ml / min , continue to stir for 90min after the dropwise addition is completed; filter the mixture with a Buchner funnel (200mm), rinse the powder with deionized water (500ml×3), then place the powder in a blast oven at 100°C for 5 hours, collect The dried powder is ready for use. The contact angles of the obtained powders are shown in Table 1.

Embodiment 3

[0070] 170g of deionized water, 100g of boron nitride powder (purchased from Liaobin Fine Chemical Co., Ltd., Yingkou, Liaoning Province, median particle size 100 μm) and 1070 hydantoin epoxy resin (purchased from Wuxi, Jiangsu Province) were added to a 1000ml three-necked flask. Huilong Electronic Materials Co., Ltd., epoxy value 0.70mol / 100g) 1g, put the flask in a heating mantle, heat while stirring until the temperature rises to 40°C, keep stirring at this temperature for 20min; then, under stirring, The aqueous solution of pentaethylenehexamine (0.75g dissolved in 25g deionized water) and hydantoin epoxy resin aqueous solution (4g dissolved in 25g deionized water) were added dropwise to the flask respectively at a rate of about 1.0 ml / min , continue to stir for 90min after the dropwise addition is completed; filter the mixture with a Buchner funnel (200mm), rinse the powder with deionized water (500ml×3), then place the powder in a blast oven at 100°C for 5 hours, collect ...

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Abstract

The present invention discloses surface-organically-modified boron nitride powder, wherein a hydantoin epoxy resin cross-linked polymerization product layer is coated on the particle surface, the hydantoin epoxy resin cross-linked polymerization product content in the surface-organically-modified boron nitride powder is 5-10 wt.%, and the raw materials for preparing the surface-organically-modified boron nitride powder comprise 20-30 wt.% of boron nitride, 1-3 wt.% of a hydantoin epoxy resin, 0.1-2 wt.% of an organic amine curing agent, and the balance of water. According to the present invention, the surface-organically-modified boron nitride powder has characteristics of good compatibility with polymer substrates and easy dispersion in the substrate, and can maintain good construction or processing fluidity under the high filling rate of 47.5 wt.%, and the thermal conductivity of the prepared epoxy composite material is up to 2.42 W / m.K.

Description

technical field [0001] The invention belongs to the field of powder surface treatment and heat-conducting polymer composite materials, and relates to a surface organically modified boron nitride powder, a preparation method thereof and an application in preparing heat-conducting polymers. Background technique [0002] Due to its high thermal conductivity and good insulation, boron nitride powder can effectively improve the thermal conductivity of the polymer material by compounding it with the polymer material, thereby preparing insulating and heat-conducting polymer composite materials. This kind of material not only overcomes the shortcomings of the traditional methods of solving the heat dissipation of electronic equipment, such as the poor thermal conductivity of the thermal conductivity material (such as mica, beryllium oxide ceramics, etc.) between the heating element and the heat dissipation element, It has the disadvantages of low mechanical properties and high price...

Claims

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Application Information

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IPC IPC(8): C08K9/10C08G59/50C08G59/26C08K3/38C08L23/00C08L63/00C08L67/00C08L77/02C08L83/06
Inventor 黄超亮姜宏伟赵念
Owner FOSHAN SANSHUI JINGE NEW MATERIALS CO LTD
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